A Conference on Thermal Challenges in Next Generation Electronic Systems: THERMES 2007

下一代电子系统中的热挑战会议：THERMES 2007

• 批准号: 0621228
• 负责人: Amy Fleischer
• 金额: --
• 依托单位: Villanova University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-04-01 至 2007-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0621228&HistoricalAwards=false
• 关键词: Conference; Thermal; Challenges; Next; Generation

Proposal Number: CTS-0621228Principal Investigator: Amy FleischerInstitution: Villanova UniversityProposal Title: A Conference on Thermal Challenges in Next Generation Electronic Systems: THERMES 2007 The future of electronic system design focuses on integrated functionality, faster processing speed, decreased size, decreased weight and reduced cost. This shrinking of system size accompanied by growth in functionality creates a critical situation where projected heat fluxes for high performance electronic systems are escalating beyond the capabilities of current thermal management techniques. Thermal issues are now critical at all levels of the electronic product hierarchy, from the chip to the system, resulting in a significant interest in ultra-compact high heat removal thermal management approaches. New and innovative thermal management techniques which will allow the development of next generation electronic equipment need to be systematically investigated. Recent advances in microscale thermal systems and progress in the understanding of nanoscale thermal transport hold promise and must be carefully scrutinized. THERMES 2007 will provide a unique opportunity for the community to focus on these thermal challenges to the electronics industry, an area that is fast becoming the leading obstacle to the continued growth of this trillion dollar industry.Intellectual Merit: THERMES 2007 is a workshop/conference which will focus on two main themes in electronics cooling: a discussion of the expected future demands in the next 10-15 years on thermal management systems and the many possible solutions to these increased demands and the dissemination of the significant advances in thermal management and characterization schemes which have been developed and implemented in the five years since the highly successful initial THERMES conference. Invited talks in selected emerging areas will be complemented with contributed papers from both industrial and academic researchers. Numerous panel discussions focusing on technology, market trends and identification of research challenges will enable highly interactive discussions. The conference is expected to well-attended, drawing leaders in the field from both industry and academics.Broader Impact: Support from the National Science Foundation will subsidize the participation expenses primarily of graduate and undergraduate students who will be presenting papers and of early career and under-represented faculty. Student participation and attendance at this conference will expose them to the issues at the leading edge of thermal management technology and allow them to interact with both industrial and academic leaders in the field. This interaction will provide background and knowledge that classes could not duplicate. As we anticipate that many of these students will enter the field of thermal management and lead the next generation of technology development, we hope that their attendance at this conference will kick-off their life-long participation at the leading edge of research and that the broader impacts of their participation on the enhancement and development of the U.S. knowledge-based workforce will be immeasurable.

提案编号：CTS-0621228首席研究员：Amy Fleischer机构：维拉诺瓦大学提案标题：下一代电子系统热挑战会议：THERMES 2007电子系统设计的未来集中在集成功能、更快的处理速度、更小的尺寸、更轻的重量和更低的成本。这种伴随着功能增长的系统尺寸的缩小产生了一种关键的情况，其中用于高性能电子系统的投影热通量正在升级，超出了当前热管理技术的能力。从芯片到系统，热问题现在在电子产品层次的所有级别都很关键，导致对超紧凑的高散热热管理方法的极大兴趣。新的和创新的热管理技术，这将使下一代电子设备的发展需要进行系统的研究。微尺度热系统的最新进展和对纳米尺度热传输的理解的进展有希望，必须仔细审查。THERMES 2007将为业界提供一个独特的机会，让他们关注电子行业面临的这些热挑战，而电子行业正迅速成为这个万亿美元行业持续增长的主要障碍。智力优势：THERMES 2007是一个研讨会/会议，将集中讨论电子冷却领域的两个主要主题：对未来10年预期需求的讨论-15年来，热管理系统和许多可能的解决方案，这些增加的需求和传播的重大进展，热管理和表征计划，已开发和实施的五年以来，高度第一届THERMES大会圆满成功。在选定的新兴领域邀请会谈将补充从工业和学术研究人员贡献的论文。许多小组讨论侧重于技术，市场趋势和研究挑战的确定将使高度互动的讨论。本次会议预计将吸引来自业界和学术界的领导者参加。更广泛的影响：来自美国国家科学基金会的支持将主要资助将提交论文的研究生和本科生以及早期职业和代表性不足的教师的参与费用。学生参与和出席本次会议将使他们接触到热管理技术前沿的问题，并使他们能够与该领域的工业和学术领导者进行互动。这种互动将提供课程无法复制的背景和知识。由于我们预计这些学生中的许多人将进入热管理领域并引领下一代技术发展，我们希望他们参加这次会议将开启他们在研究前沿的终身参与，并希望他们参与对美国知识型劳动力的增强和发展的更广泛影响将是不可估量的。