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A Conference on Thermal Challenges in Next Generation Electronic Systems: THERMES 2007

A Conference on Thermal Challenges in Next Generation Electronic Systems: THERMES 2007
下一代电子系统中的热挑战会议:THERMES 2007
批准号:
0621228
负责人:
Amy Fleischer
金额:
$0.0万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2006
资助国家:
美国
项目状态:
已结题
起止时间:
2006-04-01 至 2007-06-30

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中文摘要
翻译
提案编号:cts -0621228首席研究员:Amy fleischer机构:Villanova大学提案标题:下一代电子系统中的热挑战会议:THERMES 2007电子系统设计的未来侧重于集成功能,更快的处理速度,更小的尺寸,更轻的重量和更低的成本。随着系统尺寸的缩小和功能的增加,高性能电子系统的预计热通量已经超出了当前热管理技术的能力。现在,从芯片到系统,热问题在电子产品层次的各个层面都很重要,导致人们对超紧凑的高散热热管理方法产生了浓厚的兴趣。新的和创新的热管理技术,将允许下一代电子设备的发展需要系统地研究。微尺度热系统的最新进展和对纳米尺度热输运的理解带来了希望,必须仔细审查。THERMES 2007将为业界提供一个独特的机会来关注电子行业的这些热挑战,这一领域正迅速成为这个万亿美元行业持续增长的主要障碍。知识价值:THERMES 2007是一个研讨会/会议,将重点关注电子冷却领域的两个主要主题:讨论未来10-15年对热管理系统的预期未来需求,以及针对这些日益增长的需求的许多可能的解决方案,并传播热管理和表征方案方面的重大进展,这些进展是自最初的THERMES会议取得巨大成功以来的五年中开发和实施的。在选定的新兴领域的特邀会谈将辅以来自工业和学术研究人员的贡献论文。众多的小组讨论将聚焦于技术、市场趋势和研究挑战的识别,从而实现高度互动的讨论。这次会议预计会有很多人参加,吸引工业界和学术界的领袖。更广泛的影响:来自美国国家科学基金会的支持将主要资助将要发表论文的研究生和本科生以及早期职业生涯和代表性不足的教师的参与费用。参加本次会议的学生将接触到热管理技术的前沿问题,并允许他们与该领域的工业和学术领袖进行互动。这种交互将提供类无法复制的背景和知识。由于我们预计这些学生中的许多人将进入热管理领域并引领下一代技术发展,我们希望他们参加这次会议将开启他们在研究前沿的终身参与,他们的参与对美国知识型劳动力的增强和发展的更广泛影响将是不可估量的。
英文摘要
Proposal Number: CTS-0621228Principal Investigator: Amy FleischerInstitution: Villanova UniversityProposal Title: A Conference on Thermal Challenges in Next Generation Electronic Systems: THERMES 2007 The future of electronic system design focuses on integrated functionality, faster processing speed, decreased size, decreased weight and reduced cost. This shrinking of system size accompanied by growth in functionality creates a critical situation where projected heat fluxes for high performance electronic systems are escalating beyond the capabilities of current thermal management techniques. Thermal issues are now critical at all levels of the electronic product hierarchy, from the chip to the system, resulting in a significant interest in ultra-compact high heat removal thermal management approaches. New and innovative thermal management techniques which will allow the development of next generation electronic equipment need to be systematically investigated. Recent advances in microscale thermal systems and progress in the understanding of nanoscale thermal transport hold promise and must be carefully scrutinized. THERMES 2007 will provide a unique opportunity for the community to focus on these thermal challenges to the electronics industry, an area that is fast becoming the leading obstacle to the continued growth of this trillion dollar industry.Intellectual Merit: THERMES 2007 is a workshop/conference which will focus on two main themes in electronics cooling: a discussion of the expected future demands in the next 10-15 years on thermal management systems and the many possible solutions to these increased demands and the dissemination of the significant advances in thermal management and characterization schemes which have been developed and implemented in the five years since the highly successful initial THERMES conference. Invited talks in selected emerging areas will be complemented with contributed papers from both industrial and academic researchers. Numerous panel discussions focusing on technology, market trends and identification of research challenges will enable highly interactive discussions. The conference is expected to well-attended, drawing leaders in the field from both industry and academics.Broader Impact: Support from the National Science Foundation will subsidize the participation expenses primarily of graduate and undergraduate students who will be presenting papers and of early career and under-represented faculty. Student participation and attendance at this conference will expose them to the issues at the leading edge of thermal management technology and allow them to interact with both industrial and academic leaders in the field. This interaction will provide background and knowledge that classes could not duplicate. As we anticipate that many of these students will enter the field of thermal management and lead the next generation of technology development, we hope that their attendance at this conference will kick-off their life-long participation at the leading edge of research and that the broader impacts of their participation on the enhancement and development of the U.S. knowledge-based workforce will be immeasurable.
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