Thermal Management of Heat Generating Devices in Close Proximity on Printed Circuit Boards

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The thermal management of electrical devices in close proximity, particularly with dissimilar operating temperatures presents a unique challenge to the thermal designer. The reliability of the components depends to a substantial degree on the maintenance of a desired operating temperature. The challenge is to minimize the neighbor effects, thus maintaining the different operating temperatures on the same board without allowing the hotter electronic devices to influence the operating temperature of the lower temperature components. This project will be performed by a woman researcher at the University and will augment the research agenda of the Purdue University Industry/University Cooperative Research Center for Electronic-Microcooling.