SGER: A Novel Approach to Integrated Flexible Electronic Systems

SGER：集成柔性电子系统的新方法

• 批准号: 0645965
• 负责人: Angus Kingon
• 金额: --
• 依托单位: North Carolina State University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2006
• 资助国家: 美国
• 起止时间: 2006-09-15 至 2008-02-29
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0645965&HistoricalAwards=false
• 关键词: SGER; Novel; Approach; Integrated; Flexible

This exploratory grant is aimed at demonstrating a new concept for achieving high quality transistors on flexible substrates. It makes use of a transient metal substrate for Sior Ge- based transistors, and allows lamination onto a flexible polymer carrier. The process facilitates the incorporation of additional active and passive components, thus providing the key building blocks to achieve complete low cost, large area mechanically flexible electronic systems.Intellectual Merit:The proposed research represents an entirely novel approach to an important problem, namely that of obtaining high performance semiconductor devices on flexible substrates. This is an intellectually important challenge, and the proposed approach sidesteps issues encountered by the current, heavily researched approaches (polymer transistors, or low temperature processed amorphous silicon). The proposed research also addresses important materials processing challenges associated with materials compatibility. A fundamental thermodynamic approach will be taken to address these issues.Broad Impact:In terms of broad impact, the project will contribute to the education and training of a US national PhD student in Materials Science and Engineering. Moreover, the successful demonstration of the concept is expected to greatly expand the capability of low cost electronic systems on flexible substrates, opening up entirely new applications for flexible electronic systems.

这项探索性拨款旨在展示在柔性衬底上实现高质量晶体管的新概念。它利用一种过渡金属衬底来制造基于SiOER Ge的晶体管，并允许在柔性聚合物载体上叠层。该工艺促进了其他有源和无源元件的集成，从而提供了实现完整的低成本、大面积机械柔性电子系统的关键构件。智能优点：拟议的研究代表了一种全新的方法来解决一个重要问题，即在柔性衬底上获得高性能半导体器件。这是一个智力上的重要挑战，所提出的方法回避了当前大量研究的方法(聚合物晶体管或低温处理的非晶硅)所遇到的问题。这项拟议的研究还解决了与材料兼容性相关的重要材料加工挑战。将采取基本的热力学方法来解决这些问题。广泛影响：就广泛影响而言，该项目将有助于美国国家材料科学和工程博士生的教育和培训。此外，这一概念的成功演示有望极大地扩展柔性基板上的低成本电子系统的能力，为柔性电子系统开辟全新的应用。