SGER: A Novel Approach to Integrated Flexible Electronic Systems

这项探索性资助旨在展示在柔性衬底上实现高质量晶体管的新概念。它利用硅或锗基晶体管的瞬态金属衬底，并允许层压到柔性聚合物载体上。该过程有利于纳入额外的有源和无源元件，从而提供了关键的积木，以实现完整的低成本，大面积机械灵活的电子systems.Intellectual优点：拟议的研究代表了一个全新的方法来解决一个重要的问题，即获得高性能的半导体器件在柔性基板上。 这是一个智力上的重要挑战，所提出的方法回避了当前大量研究的方法（聚合物晶体管或低温处理的非晶硅）所遇到的问题。拟议的研究还解决了与材料兼容性相关的重要材料加工挑战。广泛的影响：就广泛的影响而言，该项目将为美国国家材料科学与工程博士生的教育和培训做出贡献。此外，该概念的成功演示有望大大扩展柔性基板上低成本电子系统的能力，为柔性电子系统开辟全新的应用。

This exploratory grant is aimed at demonstrating a new concept for achieving high quality transistors on flexible substrates. It makes use of a transient metal substrate for Sior Ge- based transistors, and allows lamination onto a flexible polymer carrier. The process facilitates the incorporation of additional active and passive components, thus providing the key building blocks to achieve complete low cost, large area mechanically flexible electronic systems.Intellectual Merit:The proposed research represents an entirely novel approach to an important problem, namely that of obtaining high performance semiconductor devices on flexible substrates. This is an intellectually important challenge, and the proposed approach sidesteps issues encountered by the current, heavily researched approaches (polymer transistors, or low temperature processed amorphous silicon). The proposed research also addresses important materials processing challenges associated with materials compatibility. A fundamental thermodynamic approach will be taken to address these issues.Broad Impact:In terms of broad impact, the project will contribute to the education and training of a US national PhD student in Materials Science and Engineering. Moreover, the successful demonstration of the concept is expected to greatly expand the capability of low cost electronic systems on flexible substrates, opening up entirely new applications for flexible electronic systems.