A New Strategy for Multifunctional Polymer-based Substrates and Flexible Electronics

多功能聚合物基基板和柔性电子产品的新策略

• 批准号: 0824212
• 负责人: Angus Kingon
• 金额: $ 29.94万
• 依托单位: Brown University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2008
• 资助国家: 美国
• 起止时间: 2008-09-01 至 2012-08-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0824212&HistoricalAwards=false
• 关键词: New; Strategy; Multifunctional; Polymer; based

AbstractThe objective of this research is to develop and demonstrate a new approach to introduce increased functionality into high density printed wiring boards that are the primary (and ubiquitous) substrates for electronic systems. The approach is a hybrid processing scheme in which traditional low temperature processing is supplemented by processing of key components on fugitive metal foils and integration with the polymer substrates. The approach will be demonstrated by integrating an oxide thermoelectric material with the polymer substrate. The thermoelectric device will provide thermal management for a module. A second demonstration will be the integration of switching transistors on a flexible array of thermistor-based sensors. The demonstration vehicles are also designed to allow critical, basic processing and materials issues to be addressed.The intellectual merit of the project lies in the novel and elegant processing strategy for low cost substrates, while addressing a critical problem facing the electronics industry, namely that of thermal management. The project is expected to have broad impact in the electronics industry, through the dramatically increased functionality that can be achieved with the common high density printed wiring boards, and flexible electronic systems. Low cost, integrated active thermal management is also expected to impact microelectronic modules. New sensor arrays will also be enabled. Furthermore, the project will educate one female PhD student, and will be used to excite high school students into pursuing STEM careers, alert them to energy issues, and entice undergraduates into graduate engineering research programs. The project will also foster international collaboration.

摘要：本研究的目的是开发和展示一种新的方法，将增加的功能引入高密度印刷线路板，这是电子系统的主要（和无处不在的）基板。该方法是一种混合加工方案，在传统的低温加工的基础上，在无组织金属箔上加工关键部件，并与聚合物衬底集成。该方法将通过将氧化物热电材料与聚合物衬底集成来证明。热电装置将为模块提供热管理。第二个演示将是将开关晶体管集成到基于热敏电阻的柔性传感器阵列上。演示车辆的设计还允许解决关键的基本加工和材料问题。该项目的智力价值在于新颖而优雅的低成本基板加工策略，同时解决电子工业面临的关键问题，即热管理。该项目预计将在电子行业产生广泛的影响，通过使用常见的高密度印刷线路板和灵活的电子系统可以实现显着增加的功能。低成本、集成的主动热管理也有望影响微电子模块。新的传感器阵列也将启用。此外，该项目将培养一名女博士生，并将用于激励高中生追求STEM职业，提醒他们注意能源问题，并吸引本科生参加研究生工程研究项目。该项目还将促进国际合作。