Pico-Second Laser Micro Hole Drilling of Ceramics and Ceramic Matrix Composites

该项目的目标是开发一种精确、高产量的工艺，用于在陶瓷和陶瓷基复合材料（例如碳化硅、氮化硅和碳化硅-碳化硅陶瓷基复合材料）中加工深微孔。 实现这一目标的方法将包括i）建立使用最先进的皮秒激光器进行高深宽比微孔钻孔的实验装置，ii）开发皮秒激光与材料相互作用的分析和数值模型，iii）进行实验研究，以确定参数对使用皮秒激光系统对陶瓷和陶瓷基复合材料板进行微钻孔的影响，以及iv）演示这些材料的微孔钻孔能力。陶瓷和陶瓷基复合材料等先进材料由于其卓越的机械和热性能，对于国防、医疗、航空航天和商业行业具有重要的战略意义。 由这些材料制成的许多零件都需要精密微孔以用于冷却和其他目的。 然而，这些材料不适合蚀刻或放电加工等传统微加工工艺，而常用纳秒激光器激光打孔的主要缺点是激光烧蚀过程中造成的表面热损伤。 这种激光加工技术将克服目前产生这些微孔的障碍，因为它可以通过直接将固体转变为等离子体，从而在极短的脉冲持续时间下产生所谓的“冷烧蚀”，从而在几乎没有热损伤的情况下去除材料。 应该能够在弯曲表面上以斜角产生干净的孔。 由于该项目旨在通过分析和实验研究相结合，开发皮秒钻孔过程的系统和科学模型，因此该研究将产生有关超短激光与物质相互作用的关键科学知识。 对超短脉冲激光与材料相互作用的深入了解将有助于激光加工领域的整体进步。 一旦开发出来，该工艺可以显着降低在许多难以加工的先进材料上生产微孔的成本，并提高这些材料在商业和军用产品中的利用率。

The objective of this project is to develop an accurate and high throughput process for machining deep micro holes in ceramics and ceramic matrix composites, such as silicon carbide, silicon nitride and silicon carbide-silicon carbide ceramic matrix composite. The approach to achieve this goal will include i) establishment of an experimental set-up for high aspect ratio micro hole drilling using a state-of-the-art pico-second laser, ii) development of analytical and numerical models for the pico-second laser and material interaction, iii) experimental studies to determine the effects of parameters on micro drilling of ceramic and ceramic matrix composite sheets using the pico-second laser system and iv) demonstration of micro hole drilling capabilities for these materials.Advanced materials such as ceramics and ceramic matrix composites are strategically important for the defense, medical, aerospace and commercial industries due to their superior mechanical and thermal properties. Many parts made of these materials require precision micro holes for cooling and other purposes. However, these materials are not amenable to conventional micro fabrication processes such as etching or electric discharge machining, while the major shortcoming of laser hole drilling by commonly used nanosecond lasers has been the surface thermal damage caused during laser ablation. This laser machining technique will overcome the current barriers in producing these micro holes, since it can remove the material with virtually no thermal damage by directly transforming solid to plasma and thus creating so called "cold ablation" due to the extremely short pulse duration. It should be possible to produce a clean hole on a curved surface in an oblique angle. Since the project seeks to develop a systematic and scientific model of the pico-second drilling process through combined analytical and experimental investigations, the research will generate critical scientific knowledge on ultra short laser-matter interaction. An improved understanding of ultra short pulse laser-material interaction will contribute to the overall advancement of the laser processing field. Once developed, this process can bring a significant cost reduction in producing micro holes on many difficult-to-machine advanced materials and increased utilization of those materials in commercial and military products.