Grand Challenges in Thermal Management of Electronic Systems: From Device to Systems

CBET-0840617代理该奖项部分支持将于2008年10月31日至11月1日在ASME国际机械工程大会暨博览会期间举行的电子系统热管理重大挑战：从设备到系统的研讨会。这次会议的目的是聚集一个国际研究小组来讨论电子封装中新出现的话题。就会议的学术价值而言，电子封装仍然是一个特别具有挑战性的研究领域，特别是考虑到它的跨学科性质结合了电气工程、热工、材料科学等方面的专业知识。在这次研讨会上要强调的一个特别重要的话题是三维封装，在典型的二维电子系统中增加了第三个维度。会议的更广泛影响包括对一些在美国的初级研究人员和学生提供部分支持，特别鼓励女性和少数族裔与会者参加。研究结果将通过ASME电子包装杂志的一期特刊广泛传播。

CBET-0840617AgonaferThis award partially supports a symposium on Grand Challenges in Thermal Management of Electronic Systems: From Device to Systems, which will be held in conjunction with the ASME International Mechanical Engineering Congress & Exposition on October 31 - November 1, 2008. The purpose of this meeting is to bring together an international group of researchers to discuss emerging topics in electronic packaging.With respect to the intellectual merit of the conference, electronic packaging remains an especially challenging area of research, particularly given its interdisciplinary nature that combines expertise from electrical engineering, thermal engineering, materials science, and others. A topic of special importance, to be emphasized at this symposium, is three-dimensional packaging, in which a third dimension is added to typical two-dimensional electronic systems. The broader impacts of the conference include partial support for a number of US-based junior researchers and students, with women and minority attendees especially encouraged to attend. The results will be widely disseminated through a special issue of the ASME Journal of Electronic Packaging.