Grand Challenges in Thermal Management of Electronic Systems: From Device to Systems

电子系统热管理的巨大挑战：从设备到系统

• 批准号: 0840617
• 负责人: Dereje Agonafer
• 金额: $ 1万
• 依托单位: University of Texas at Arlington
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2008
• 资助国家: 美国
• 起止时间: 2008-08-01 至 2009-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0840617&HistoricalAwards=false
• 关键词: Grand; Challenges; Thermal; Management; Electronic

CBET-0840617AgonaferThis award partially supports a symposium on Grand Challenges in Thermal Management of Electronic Systems: From Device to Systems, which will be held in conjunction with the ASME International Mechanical Engineering Congress & Exposition on October 31 - November 1, 2008. The purpose of this meeting is to bring together an international group of researchers to discuss emerging topics in electronic packaging.With respect to the intellectual merit of the conference, electronic packaging remains an especially challenging area of research, particularly given its interdisciplinary nature that combines expertise from electrical engineering, thermal engineering, materials science, and others. A topic of special importance, to be emphasized at this symposium, is three-dimensional packaging, in which a third dimension is added to typical two-dimensional electronic systems. The broader impacts of the conference include partial support for a number of US-based junior researchers and students, with women and minority attendees especially encouraged to attend. The results will be widely disseminated through a special issue of the ASME Journal of Electronic Packaging.

CBET-0840617 Agonafer该奖项部分支持电子系统热管理的重大挑战研讨会：从设备到系统，该研讨会将于2008年10月31日至11月1日与ASME国际机械工程大会博览会一起举行。 本次会议的目的是召集国际研究人员讨论电子封装领域的新兴课题。关于会议的学术价值，电子封装仍然是一个特别具有挑战性的研究领域，特别是考虑到其跨学科性质，结合了电气工程，热工程，材料科学等专业知识。 在这次研讨会上要强调的一个特别重要的主题是三维封装，其中第三维被添加到典型的二维电子系统中。 会议的更广泛影响包括对一些美国初级研究人员和学生的部分支持，特别鼓励妇女和少数民族与会者参加。 研究结果将通过《ASME电子封装杂志》特刊广泛传播。