Grand Challenges in Thermal Management of Electronic Systems: From Device to Systems

该奖项部分支持“电子系统热管理的重大挑战：从设备到系统”研讨会，该研讨会将于2008年10月31日至11月1日与ASME国际机械工程大会和博览会同时举行。本次会议的目的是汇集一个国际研究小组，讨论电子封装的新兴主题。关于会议的知识价值，电子封装仍然是一个特别具有挑战性的研究领域，特别是考虑到它的跨学科性质，结合了电气工程、热工程、材料科学和其他方面的专业知识。本次研讨会要强调的一个特别重要的主题是三维包装，即在典型的二维电子系统上添加第三维度。这次会议的更广泛影响包括部分支持一些在美国的初级研究人员和学生，特别鼓励妇女和少数族裔与会者参加。结果将通过ASME电子封装杂志的特刊广泛传播。

CBET-0840617AgonaferThis award partially supports a symposium on Grand Challenges in Thermal Management of Electronic Systems: From Device to Systems, which will be held in conjunction with the ASME International Mechanical Engineering Congress & Exposition on October 31 - November 1, 2008. The purpose of this meeting is to bring together an international group of researchers to discuss emerging topics in electronic packaging.With respect to the intellectual merit of the conference, electronic packaging remains an especially challenging area of research, particularly given its interdisciplinary nature that combines expertise from electrical engineering, thermal engineering, materials science, and others. A topic of special importance, to be emphasized at this symposium, is three-dimensional packaging, in which a third dimension is added to typical two-dimensional electronic systems. The broader impacts of the conference include partial support for a number of US-based junior researchers and students, with women and minority attendees especially encouraged to attend. The results will be widely disseminated through a special issue of the ASME Journal of Electronic Packaging.