IUCRC Phase III University of Texas, Arlington: Center for Energy-Smart Electronic Systems (ES2)

IUCRC 第三阶段德克萨斯大学阿灵顿分校：能源智能电子系统中心 (ES2)

• 批准号: 2209751
• 负责人: Dereje Agonafer
• 金额: $ 25万
• 依托单位: University of Texas at Arlington
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 2022
• 资助国家: 美国
• 起止时间: 2022-09-01 至 2027-08-31
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2209751&HistoricalAwards=false
• 关键词: IUCRC; Phase; III; University; Texas

With the proliferation of automation and electronic devices throughout most major industries, the amount of data being produced and the need to process/manage that data continues to grow. Automated management of data centers, addressing their emerging thermal challenges and improving their energy efficiency form the key to addressing this demand. The Center for Energy-Smart Electronic Systems (ES2), an NSF Industry University Cooperative Research Center (IUCRC), was established in 2011 to address these needs for data centers. This award provides a Phase III renewal for this 3-site IUCRC, which consists of Binghamton University, Villanova University and University of Texas at Arlington. ES2's vision is to develop systematic methodologies for operating electronic systems, including data centers, as dynamic, self- sensing and regulating systems that are predictable and verified in real time. The focus in Phase I and Phase II has been to develop new energy-optimization and thermal management models and designs, as well as tools and algorithms enabling electronic data systems to operate more efficiently and securely. Phase III will further expand on these methodologies to progress closer to a full realization of the ES2 vision. The Center brings together computer scientists, electrical engineers, and mechanical engineers in a synergistic multidisciplinary team to advance industrially relevant research in this area. ES2, in promoting significant reductions in energy consumption in electronic systems, will contribute to the national agenda of eventually reaching net-zero carbon emissions. Reducing energy costs in data centers will help to allow computing services to be more deployable and accessible for a larger population segment. ES2 continues to attract a diverse group of students at the undergraduate and graduate levels and provides industrially relevant training in their careers beyond graduation. ES2 has also integrated a variety of mechanisms across the partners universities and industry members to increase participation by women and underrepresented students. The University of Texas at Arlington (UTA) site has grown its facilities, specifically hardware, to support ES2, often in collaboration with the Center’s industry members. Currently there is a modular data center laboratory consisting of a direct/indirect evaporative cooling unit that has been developed in collaboration with a Center partner; in Phase III this will be augmented with a second spray-based indirect evaporative cooling unit. In Phase III, there will be a considerable focus at UTA on immersion cooling, an important industry sector that is predicted to experience significant growth in the next five years. Immersion cooling applications span high-performance computing, edge computing, and cryptocurrency mining, amongst others. UTA has invested in significant infrastructure to support this important area of research, including resources for a newly renovated state-of-the-art immersion cooling lab as well as a PIV for experiments related to immersion cooling. As such, in Phase III, UTA will be conducting both experimental and computational immersion cooling research. The test laboratories also offer educational value by serving as a practical demonstration of technology and heat transfer principles for both undergraduates as well as high school students participating in UTA’s summer programs. These facilities support the educational and workforce development missions of ES2; the UTA site has a strong track record of providing highly trained STEM graduates to industry, including many of the Center’s members.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

随着自动化和电子设备在大多数主要行业中的普及，产生的数据量以及处理/管理这些数据的需求持续增长。数据中心的自动化管理、应对新出现的热挑战和提高能效是满足这一需求的关键。能源智能电子系统中心（ES 2）是NSF工业大学合作研究中心（IUCRC），成立于2011年，旨在满足数据中心的这些需求。该奖项提供了一个第三阶段的更新，这三个网站IUCRC，其中包括宾厄姆顿大学，维拉诺瓦大学和得克萨斯大学阿灵顿。ES 2的愿景是开发用于操作电子系统的系统方法，包括数据中心，作为动态的、自感知的和调节的系统，这些系统是可预测的，并在真实的时间内得到验证。第一阶段和第二阶段的重点是开发新的能源优化和热管理模型和设计，以及使电子数据系统能够更有效和安全地运行的工具和算法。第三阶段将进一步扩展这些方法，以更接近全面实现ES 2愿景。该中心汇集了计算机科学家，电气工程师和机械工程师在一个协同的多学科团队，以推进该领域的工业相关研究。ES 2在促进电子系统能耗大幅降低方面，将有助于最终实现净零碳排放的国家议程。降低数据中心的能源成本将有助于使计算服务更易于部署，并可供更大的人群使用。ES 2继续吸引本科和研究生层次的学生，并在毕业后的职业生涯中提供工业相关的培训。ES 2还整合了合作大学和行业成员的各种机制，以增加女性和代表性不足的学生的参与。德克萨斯大学阿灵顿分校（UTA）已经发展了其设施，特别是硬件，以支持ES 2，通常与该中心的行业成员合作。目前，有一个模块化数据中心实验室，由一个直接/间接蒸发冷却装置组成，该装置是与中心合作伙伴合作开发的;在第三阶段，将增加第二个基于喷雾的间接蒸发冷却装置。在第三阶段，UTA将重点关注浸没式冷却，这是一个重要的行业领域，预计在未来五年内将有显着增长。沉浸式冷却应用涵盖高性能计算、边缘计算和加密货币挖掘等。UTA已经投资了大量的基础设施来支持这一重要的研究领域，包括新装修的最先进的浸没冷却实验室的资源，以及用于浸没冷却相关实验的PIV。因此，在第三阶段，UTA将进行实验和计算浸没冷却研究。测试实验室还通过为本科生和参加UTA暑期课程的高中生提供技术和传热原理的实际演示来提供教育价值。这些设施支持ES 2的教育和劳动力发展任务; UTA网站在为行业提供训练有素的STEM毕业生方面有着良好的记录，包括许多中心的成员。该奖项反映了NSF的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。

项目成果

NUMERICAL INVESTIGATION ON EFFECT OF TARGET COOLANT DELIVERY IN LIQUID-COOLED MICROCHANNEL HEAT SINKS

液冷微通道散热器中目标冷却剂输送效果的数值研究

• DOI: 10.1615/jenhheattransf.2022044339
• 发表时间: 2023
• 期刊: Journal of Enhanced Heat Transfer
• 影响因子: 2.3
• 作者: Shahi, Pardeep;Deshmukh, Apurv;Hurnekar, Hardik Yashwant;Saini, Satyam;Bansode, Pratik;Agonafer, Dereje
• 通讯作者: Agonafer, Dereje

A NUMERICAL STUDY ON MULTI-OBJECTIVE DESIGN OPTIMIZATION OF HEAT SINKS FOR FORCED AND NATURAL CONVECTION COOLING OF IMMERSION-COOLED SERVERS

浸没式冷却服务器强制对流冷却和自然对流冷却散热器多目标设计优化数值研究

• DOI: 10.1615/jenhheattransf.2022043805
• 发表时间: 2022
• 期刊: Journal of Enhanced Heat Transfer
• 影响因子: 2.3
• 作者: Saini, Satyam;Wagh, Tushar;Bansode, Pratik;Shahi, Pardeep;Herring, Joseph;Lamotte-Dawaghreh, Jacob;Shah, Jimil M.;Agonafer, Dereje
• 通讯作者: Agonafer, Dereje

Experimental Study of Improved Chassis and Duct Redesign for Air-Cooled Server

风冷服务器改进机箱及风道重新设计的实验研究

• DOI: 10.1109/itherm55368.2023.10177651
• 发表时间: 2023
• 期刊: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm
• 作者: Modi, Himanshu;Shahi, Pardeep;Simon, Vibin Shalom;Reddy Chintaparthy, Lochan Sai;Gupta, Gautam;Sivakumar, Akiilessh;Saini, Satyam;Bansode, Pratik;Agonafer, Dereje
• 通讯作者: Agonafer, Dereje

ASSESSMENT OF RELIABILITY ENHANCEMENT IN HIGH-POWER CPUs AND GPUs USING DYNAMIC DIRECT-TO-CHIP LIQUID COOLING

使用动态芯片直接液冷技术增强高功率 CPU 和 GPU 的可靠性评估

• DOI: 10.1615/jenhheattransf.2022043858
• 发表时间: 2022
• 期刊: Journal of Enhanced Heat Transfer
• 影响因子: 2.3
• 作者: Shahi, Pardeep;Mathew, Amith;Saini, Satyam;Bansode, Pratik;Kasukurthy, Rajesh;Agonafer, Dereje
• 通讯作者: Agonafer, Dereje