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Rapid Process Development for Chemical Mechanical Planarization

Rapid Process Development for Chemical Mechanical Planarization
化学机械平坦化的快速工艺开发
批准号:
0900093
负责人:
Abhijit Chandra
金额:
$47.64万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2009
资助国家:
美国
项目状态:
已结题
起止时间:
2009-07-01 至 2013-06-30

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中文摘要
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英文摘要
This award is funded under the American Recovery and Reinvestment Act of 2009 (Public Law 111-5).The objective of this research project is to understand the fundamental mechanisms affecting the salient features of product quality and process efficiency in Chemical Mechanical Planarization. A consistent multi-scale and multi-physics approach is pursued. The Chemical Mechanical Planarization process is viewed as a confluence or a union of wafer, pad and slurry, aided by the machine. By the interactions inherent in this process, the wafer, pad, and slurry each modifies the other two, and is in turn modified by them. This project develops a multi-scale and multi-physics representation of the intricacies of 3-way fully coupled pad-wafer-slurry interactions, aided by quasi-coupled interactions with the machine. A concept mapping technique, augmented via curvature correction is utilized to ensure consistency in multi-physics and multi-scale representations. Model development will be aided by mechanistic experimentations as well as full scale planarization tests. The validated predictive model will then be utilized to conduct a detailed parametric study and design space exploration of chemical ? mechanical interactions in a planarization process.Once validated, the multi-scale simulation tool will be housed in a website and can serve as a software testbed for process development. It will not only just check if a process design choice is expected to meet the specifications, but will also be able to provide advice for generic rectifications when the process design choices fail to meet the specifications. This will facilitate development of effective process design and control. It will capture the basic nano-scale nuances of planarization processes, and relate them to macro-scale design considerations. Outreach to neighboring undergraduate institutions and high schools are planned by introducing Concept Mapping principles utilized in this project to science education at the undergraduate and high school levels.
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Chemical Mechanical Paired Grinding
  • 批准号:
    1100066
  • 项目类别:
    Standard Grant
  • 资助金额:
    $41.5万
  • 财政年份:
    2011
  • 负责人:
    Abhijit Chandra
  • 依托单位:
SGER / Collaborative Research : Multiscale Modeling: Finding Strengths, Avoiding Weaknesses
  • 批准号:
    0640826
  • 项目类别:
    Standard Grant
  • 资助金额:
    $0.0万
  • 财政年份:
    2006
  • 负责人:
    Abhijit Chandra
  • 依托单位:
Collaborative Research: Wire Sawing - Mechanics and Design Space Exploration
  • 批准号:
    0355536
  • 项目类别:
    Standard Grant
  • 资助金额:
    $35.53万
  • 财政年份:
    2004
  • 负责人:
    Abhijit Chandra
  • 依托单位:
Modeling and Control of Wafer Scale Yield Improvement in Chemical Mechanical Planarization (CMP)
  • 批准号:
    0323069
  • 项目类别:
    Standard Grant
  • 资助金额:
    $45.69万
  • 财政年份:
    2003
  • 负责人:
    Abhijit Chandra
  • 依托单位:
国内基金
海外基金
Neural Process模型的多样化高保真技术研究
磁转动超新星爆发中weak r-process的关键核反应
多臂Bandit process中的Bayes非参数方法
  • 批准号:
    71771089
  • 项目类别:
    面上项目
  • 资助金额:
    48.0万元
  • 批准年份:
    2017
  • 负责人:
    吴贤毅
  • 依托单位: