Collaborative Research: Wire Sawing - Mechanics and Design Space Exploration

合作研究：线锯 - 力学和设计空间探索

• 批准号: 0355536
• 负责人: Abhijit Chandra
• 金额: $ 35.53万
• 依托单位: Iowa State University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2004
• 资助国家: 美国
• 起止时间: 2004-07-01 至 2008-06-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=0355536&HistoricalAwards=false
• 关键词: Collaborative; Research; Wire; Sawing; Mechanics

The research goals of this project are to understand the fundamental mechanics of the long wavelength waviness in wire sawed silicon wafers and to investigate the conditions for diamond pull-out from diamond coated wires. The implications of such pull-outs on surface quality and integrity of wire sawed wafers will also be investigated. A combination of analytical and numerical simulations will be pursued. A fluid-structure interaction model will be developed for long wavelength waviness generation, and a coupled thermo-mechanical analysis will be pursued for predictions of diamond pull-out conditions. Simulation results will be verified against experimental observations under laboratory conditions. Verified mechanistic models will then be utilized to develop integrated process models and control algorithms for the wire sawing process.The current wire sawing method of wafer slicing leaves a long wavelength waviness on the wafer surface that must be corrected by an expensive lapping process. If successful, this project will improve the wire sawing process to greatly reduce the induced waviness, thereby reducing the need for lapping, and enhancing the cost effectiveness of wafer production. Abrasive pull-out affects the performance of grinding wheels, and a mechanistic model of this phenomenon will aid in grinding process design as well. These results will be of considerable value to the integrated circuit industry, particularly as the industry goes to bigger wafer diameters and finer circuit structures.

该项目的研究目标是了解线锯硅片中长波长波纹的基本机制，并研究从金刚石涂层线中拔出金刚石的条件。还将研究这种拔出对线锯晶圆的表面质量和完整性的影响。将寻求分析和数值模拟的结合。将开发用于长波长波纹生成的流体-结构相互作用模型，并将采用耦合热机械分析来预测金刚石拔出条件。模拟结果将根据实验室条件下的实验观察进行验证。然后，将利用经过验证的机械模型来开发线锯工艺的集成工艺模型和控制算法。当前的晶圆切片线锯方法会在晶圆表面留下长波长波纹，必须通过昂贵的研磨工艺来校正。如果成功，该项目将改进线锯工艺，大大减少诱发波纹，从而减少研磨的需要，并提高晶圆生产的成本效益。磨料拉出会影响砂轮的性能，这种现象的机械模型也将有助于磨削工艺设计。 这些结果将对集成电路行业具有相当大的价值，特别是当该行业转向更大的晶圆直径和更精细的电路结构时。