Exploration of New Design Avenues for High Speed Ceramic Grinding

高速陶瓷磨削设计新途径的探索

• 批准号: 9610454
• 负责人: Abhijit Chandra
• 金额: $ 29.9万
• 依托单位: Michigan Technological University
• 依托单位国家: 美国
• 项目类别: Continuing Grant
• 财政年份: 1997
• 资助国家: 美国
• 起止时间: 1997-08-01 至 2000-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=9610454&HistoricalAwards=false
• 关键词: Exploration; New; Design; Avenues; Speed

Development of a cost-effective production finishing process is pivotal for commercial success of structural precision ceramic components. High-speed grinding of ceramics has emerged as a viable potential candidate for such finishing operation. However, unlike metals, ceramics are brittle and highly sensitive to process induced surface and sub-surface damages in the finished part. Process damage may be minimized by maintaining force/abrasive grit below a critical threshold. This, however, imposes an extremely small material removal rate that is an order of magnitude lower than that required for commercial viability. Current efforts focus on improving material removal rate under these constraints. This research project seeks to explore new design avenues, particularly for very high-speed grinding, above the current critical thresholds of depth of cut and feed/grit. The objectives of the research are: (1) to establish and experimentally validate a mechanistic model of material removal and associated damage evolution in high-speed machining; (2) to use the validated model to investigate the roles of two new design parameters: impulse/grit and intermittent unloading; and (3) to implement and investigate new design states in existing surface grinding facilities. The project will establish the potential of new design avenues for precision ceramic grinding that may deliver very high material removal rate while minimizing residual damage in the finished part. This can have significant impact on the efficiency and effectiveness of finished brittle materials including structural ceramic parts and optical components, as well as processing of silicon wafers for electronic applications.

开发具有成本效益的生产精加工工艺对于结构精密陶瓷部件的商业成功至关重要。 陶瓷的高速磨削已成为此类精加工操作的可行潜在候选者。 然而，与金属不同，陶瓷很脆，并且对成品零件中加工引起的表面和亚表面损伤高度敏感。 通过将力/磨粒保持在临界阈值以下，可以最大限度地减少过程损坏。 然而，这导致了极小的材料去除率，比商业可行性所需的材料去除率低一个数量级。 目前的工作重点是在这些限制下提高材料去除率。 该研究项目旨在探索新的设计途径，特别是对于超高速磨削，超过当前切削深度和进给/磨料的临界阈值。 研究目标是：（1）建立并实验验证高速加工中材料去除和相关损伤演化的机械模型； (2) 使用经过验证的模型来研究两个新设计参数的作用：脉冲/砂砾和间歇卸载； (3) 在现有表面磨削设施中实施和研究新的设计状态。 该项目将为精密陶瓷磨削建立新的设计途径的潜力，可以提供非常高的材料去除率，同时最大限度地减少成品零件的残余损坏。 这可能对成品脆性材料（包括结构陶瓷零件和光学元件）以及电子应用硅晶片的加工的效率和效果产生重大影响。