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Workshop: 21st Annual on Interconnections within High-speed Digital Systems: Support for Student Participation. To be Held in Sante Fe, New Mexico on May 2-5, 2010.

研讨会：第 21 届高速数字系统互连年会：支持学生参与。

基本信息

批准号：
0948091
负责人：
Valencia Koomson
金额：
$ 0.9万
依托单位：
Tufts University
依托单位国家：
美国
项目类别：
Standard Grant
财政年份：
2010
资助国家：
美国
起止时间：
2010-01-01 至 2010-12-31
项目状态：
已结题

来源：
https://www.nsf.gov/awardsearch/showAward?AWD_ID=0948091&HistoricalAwards=false
关键词：
Workshop 21st Annual Interconnections within

项目摘要

This proposal requests travel support for U.S. students, including graduate students and post-doctoral researchers, to participate in the 21st Annual IEEE/LEOS Workshop on Interconnections within High-speed Digital Systems to be held May 2-5, 2010 in Sante Fe, New Mexico.With respect to intellectual merit, this workshop is of particular significance due to the increasing demand for very high speed interconnects to support high data rate communication and due to the growing importance of multi-core architectures, which require high data rate interconnects. The multidisciplinary nature of the problem domain is reflected in the workshop which brings together researchers in semiconductor devices, processor architecture, three-dimensional packaging, and optical-electronic integration. In addition to talks, posters, and tutorials, the workshop features a "workshop problem" where participants interact through small working groups to address a challenge problem.With respect to broader impacts, the proposed support improves the education of graduate students and post-doctoral researchers through participation in the multidisciplinary workshop and associated interaction with leading researchers and other students. The workshop and associated travel support are to be advertised through active outreach to minority serving institutions and organizations focused on women and other students from underrepresented groups. The selection process will emphasize broadening participation.

本提案要求为美国学生（包括研究生和博士后研究人员）提供差旅支持，以参加将于2010年5月2日至5日在新墨西哥州圣达菲举行的第21届IEEE/LEOS高速数字系统互连研讨会。由于对支持高数据速率通信的超高速互连的需求不断增长以及由于多核体系结构的重要性不断增长，其需要高数据速率互连。问题领域的多学科性质反映在研讨会上，研讨会汇集了半导体器件，处理器架构，三维封装和光电集成的研究人员。除了讲座、海报和指导之外，研讨会还设有“研讨会问题”，与会者通过小型工作组进行互动，以解决挑战性问题。关于更广泛的影响，拟议的支持通过参与多学科研讨会以及与主要研究人员和其他学生的相关互动，改善研究生和博士后研究人员的教育。讲习班和相关的旅行支助将通过积极宣传少数群体服务机构和组织，重点关注代表性不足群体的妇女和其他学生。甄选过程将强调扩大参与。