Collaborative Research: 3D Integrated Imaging Receivers for 10-Gb/s Free Space Optical MIMO

这项研究的目标是创造一种新型的高能效成像光接收器，以达到每秒50千兆比特或更高的聚合数据速率，用于宽带无线光通信。该方法是开发一个大型平面镶嵌光电探测器阵列，其速率为每像素每秒10千兆位。该阵列包括分集选择电路，使用光学多输入/多输出配置来实现。就智能优点而言，该项目解决了光无线通信中的两个众所周知的挑战：信道闪烁和光束对准。这项研究探索了与硅集成电路集成以实现多功能运算(判决、放大和计算)的高能效InGaAs金属-半导体-金属光电探测器，以及用于海量数据信号处理的多输入/多输出架构的实现。这项研究有望扩大有关低电压偏压下光电探测器中载流子漂移特性和复杂三维光电子器件结构物理的知识。这项研究还探索了利用三维晶片键合技术在硅电路上进行化合物半导体器件的异质集成，用于光接收器应用。从更广泛的影响来看，这项研究有可能使各种应用受益，包括降低安全漏洞的无线网络，能够在医疗保健环境中对电磁干扰敏感的设备中传输高分辨率数字图像的网络，以及大型数据中心的光学互连。课程涉及跨大学，涵盖信息论、系统级设计、模拟电路、器件物理、制造和集成等多学科主题。各种计划被用来从代表性不足的群体中招收学生。通过塔夫茨工程教育外联中心协调K-12外联工作。

The objective of this research is to create a new class of power-efficient imaging photoreceivers to reach an aggregated data rate of 50 gigabits per second and beyond for broadband wireless optical communication. The approach is to develop a large array of planar tessellated photodetectors with a rate of 10 gigabits per second per pixel. The array includes diversity selection circuits, which are implemented using an optical multi-input/multi-output configuration.With respect to intellectual merit, this project addresses two well-known challenges in optical wireless communication, channel scintillation and optical beam alignment. The research explores power-efficient InGaAs metal-semiconductor-metal photodetectors that are integrated with silicon integrated circuits for multifunctional operation (decision, amplification, and computing), and the implementation of multi-input/multi-output architectures for signal processing of massive amounts of data. This research is expected to augment the body of knowledge on carrier drift characteristics in the photodetectors at low voltage bias and the physics of complex three-dimensional optoelectronic device structures. This research also explores heterogeneous integration of compound semiconductor device on silicon circuits using three-dimensional wafer bonding for photoreceiver applications.With respect to broader impacts, the research has the potential to benefit a variety of applications, including wireless networks with reduced security vulnerabilities, networks able to transfer high-resolution digital images in the midst of equipment sensitive to electromagnetic interference in healthcare settings; and optical interconnects in large-scale data centers. A cross-university curriculum is addressed, covering multi-disciplinary topics in information theory, system-level design, analog circuits, device physics, fabrication and integration. Various programs are used to recruit students from underrepresented groups. K-12 outreach efforts are coordinated through the Tufts Center for Engineering Educational Outreach.