GOALI: Development of Block Copolymer Self-assembly for Next Generation Device Fabrication

GOALI：开发用于下一代器件制造的嵌段共聚物自组装

• 批准号: 1029452
• 负责人: H S Philip Wong
• 金额: $ 36万
• 依托单位: Stanford University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2010
• 资助国家: 美国
• 起止时间: 2010-08-01 至 2014-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1029452&HistoricalAwards=false
• 关键词: GOALI; Development; Block; Copolymer; Self

Directed block copolymer self-assembly is one of the promising technologies to solve the problems of conventional lithography for advanced semiconductor technologies. In contrast to conventional lithography, block copolymer self-assembly provides sub-20 nm features with lower cost and higher throughput, though defects and precise positioning are fundamental research topics that need to be addressed. The goal of this project is to address these challenges for integrating directed block copolymer self-assembly technology into practical integrated device fabrication process at the circuit level and demonstrate the fabrication of the key features for next generation devices. Block copolymer self-assembly and guided template patterning methods are proposed as a proof of concept demonstration for fabricating ultra-high density memory arrays and sub-20 nm contact holes for high-density silicon circuitry, respectively. The broader impacts of this project cover both fundamental research and commercial manufacturing at the university-industrial interface. This project can have direct impact to promote block copolymer self-assembly technology as an economically efficient extension to conventional lithography for next generation device fabrication, benefiting the semiconductor manufacturing industry and the broader electronics industry greatly. It also will substantially stimulate the study of polymer materials design for better functional performance. As part of a outreach to the broader society, a few video clips will be produced and posted onto public websites to help the students understand the science and technology of the self-assembly. This university-industry collaboration provides an excellent training ground for the participating students in a multidisciplinary environment at the interface of fundamental research and industrial manufacturing.

定向嵌段共聚物自组装技术是解决先进半导体工艺中传统光刻技术存在的问题的一种很有前途的技术。与传统的光刻相比，嵌段共聚物自组装提供了低于20 nm的功能，具有更低的成本和更高的吞吐量，但缺陷和精确定位是需要解决的基本研究课题。该项目的目标是解决这些挑战，将定向嵌段共聚物自组装技术集成到实际的集成器件制造工艺中，在电路层面上，并展示下一代器件的关键功能的制造。提出了嵌段共聚物自组装和引导模板图案化方法，分别作为用于制造超高密度存储器阵列和用于高密度硅电路的亚20 nm接触孔的概念演示的证明。该项目的更广泛影响包括大学-工业界面的基础研究和商业制造。该项目可以直接影响促进嵌段共聚物自组装技术作为下一代器件制造的传统光刻的经济有效的延伸，使半导体制造业和更广泛的电子行业受益匪浅。它也将大大刺激高分子材料设计的研究，以获得更好的功能性能。作为向更广泛社会推广的一部分，将制作一些视频剪辑并发布到公共网站上，以帮助学生了解自组装的科学和技术。这种大学与工业的合作为参与的学生在基础研究和工业制造的界面上的多学科环境中提供了一个很好的培训基地。