课题基金 / 基金详情

GOALI: Development of Block Copolymer Self-assembly for Next Generation Device Fabrication

GOALI: Development of Block Copolymer Self-assembly for Next Generation Device Fabrication
GOALI:开发用于下一代器件制造的嵌段共聚物自组装
批准号:
1029452
负责人:
H S Philip Wong
金额:
$36.0万
依托单位:
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2010
资助国家:
美国
项目状态:
已结题
起止时间:
2010-08-01 至 2014-07-31

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中文摘要
翻译
定向嵌段共聚物自组装是解决传统光刻技术在先进半导体技术中存在的问题的有前途的技术之一。与传统光刻技术相比,嵌段共聚物自组装技术提供了低于20纳米的特性,成本更低,产量更高,但缺陷和精确定位是需要解决的基础研究课题。该项目的目标是解决这些挑战,将定向嵌段共聚物自组装技术集成到电路级的实际集成器件制造过程中,并展示下一代器件的关键功能。本文提出了嵌段共聚物自组装和引导模板图图化方法,分别作为制造超高密度存储阵列和用于高密度硅电路的sub- 20nm接触孔的概念验证。该项目的广泛影响涵盖了大学-工业界面的基础研究和商业制造。该项目可直接促进嵌段共聚物自组装技术作为传统光刻技术在下一代器件制造中的经济高效延伸,极大地有利于半导体制造业和更广泛的电子工业。这也将极大地促进高分子材料设计的研究,以获得更好的功能性能。作为向更广泛的社会推广的一部分,将制作一些视频片段并发布在公共网站上,以帮助学生了解自组装的科学和技术。这种校企合作为参与的学生在基础研究和工业制造的多学科环境中提供了一个极好的训练基地。
英文摘要
Directed block copolymer self-assembly is one of the promising technologies to solve the problems of conventional lithography for advanced semiconductor technologies. In contrast to conventional lithography, block copolymer self-assembly provides sub-20 nm features with lower cost and higher throughput, though defects and precise positioning are fundamental research topics that need to be addressed. The goal of this project is to address these challenges for integrating directed block copolymer self-assembly technology into practical integrated device fabrication process at the circuit level and demonstrate the fabrication of the key features for next generation devices. Block copolymer self-assembly and guided template patterning methods are proposed as a proof of concept demonstration for fabricating ultra-high density memory arrays and sub-20 nm contact holes for high-density silicon circuitry, respectively. The broader impacts of this project cover both fundamental research and commercial manufacturing at the university-industrial interface. This project can have direct impact to promote block copolymer self-assembly technology as an economically efficient extension to conventional lithography for next generation device fabrication, benefiting the semiconductor manufacturing industry and the broader electronics industry greatly. It also will substantially stimulate the study of polymer materials design for better functional performance. As part of a outreach to the broader society, a few video clips will be produced and posted onto public websites to help the students understand the science and technology of the self-assembly. This university-industry collaboration provides an excellent training ground for the participating students in a multidisciplinary environment at the interface of fundamental research and industrial manufacturing.
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SHF: Small: Collaborative Research: Design Automation for Block Copolymer Directed Self-Assembly (DSA) Lithography Patterning
  • 批准号:
    1421292
  • 项目类别:
    Standard Grant
  • 资助金额:
    $22.5万
  • 财政年份:
    2014
  • 负责人:
    H S Philip Wong
  • 依托单位:
Eager: High-Density Electronic Synapse Arrays Using Nanoscale Devices
  • 批准号:
    0950305
  • 项目类别:
    Standard Grant
  • 资助金额:
    $5.56万
  • 财政年份:
    2009
  • 负责人:
    H S Philip Wong
  • 依托单位:
Fabrication of the NEM and NEMFET Logic Gates via Top-Down and Bottom-up Processes
  • 批准号:
    0801334
  • 项目类别:
    Continuing Grant
  • 资助金额:
    $33.0万
  • 财政年份:
    2008
  • 负责人:
    H S Philip Wong
  • 依托单位:
Device Physics of Nanoscale Electronic Devices beyond the Technology Roadmap
  • 批准号:
    0501096
  • 项目类别:
    Standard Grant
  • 资助金额:
    $24.0万
  • 财政年份:
    2005
  • 负责人:
    H S Philip Wong
  • 依托单位:
国内基金
海外基金
水稻边界发育缺陷突变体abnormal boundary development(abd)的基因克隆与功能分析
Development of a Linear Stochastic Model for Wind Field Reconstruction from Limited Measurement Data
  • 批准号:
    --
  • 项目类别:
    --
  • 资助金额:
    40万元
  • 批准年份:
    2020
  • 负责人:
    Vikrant Gupta
  • 依托单位: