Collaborative Research: EAGER: Novel thermal interface material with Cu nanowire array

合作研究：EAGER：具有铜纳米线阵列的新型热界面材料

• 批准号: 1140953
• 负责人: Costas Grigoropoulos
• 金额: $ 7.5万
• 依托单位: University of California-Berkeley
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2011
• 资助国家: 美国
• 起止时间: 2011-07-01 至 2012-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1140953&HistoricalAwards=false
• 关键词: Collaborative; Research; EAGER; Novel; thermal

Collaborative ProposalsProposal Numbers: #1140953 / #1140121P.I.'s: Costas Grigoropoulos / Renkun ChenInstitution: University of California-Berkeley / University of California-San DiegoThermal interface materials play a critical role in thermal management of electronic devices. Current materials, such as greases and solders would be insufficient for cooling the devices with increasingly higher power dissipation level. The objective of this research is to develop a high performance thermal interface material based on copper nanowire array. The new material will have one order of magnitude lower thermal contact resistance compared to the existing ones. To achieve this goal, vertically aligned, dense arrays of single crystalline copper nanowires with well-controlled diameters, spacing and packing density will be synthesized by electroplating through porous anodic alumina membranes. Fundamental studies on mechanical, thermal and electrical properties of individual nanowires will be carried out by using micro-fabricated devices. Interfacial and bulk thermal resistances of copper nanowire arrays will be characterized using a sensitive transient thermo-reflectance technique. Intellectual Merit: Copper nanowires simultaneously possess two important features that make them a unique candidate for high performance thermal interface materials: high thermal conductivity and high mechanical compliance. Because of the high thermal conductivity and the high packing density of approximately 50%, copper nanowire array has a lower thermal contact resistance compared to the state of the art thermal interface materials. Moreover, the large aspect ratio of the nanowires ( 200:1) makes them highly compliant when subjected to thermal stress, hence the high thermal performance can be retained after thermal cycling. The proposed topics of investigation will advance the understanding of mechanical and electro-thermal properties of copper nanowires pertaining to thermal packaging applications, both individually and collectively as an array, and will lead to the development of a new class of thermal interface materials with superior thermal and mechanical properties. Broader Impacts: Thermal interface material is one of the key thermal packaging components that are highly demanded by microelectronic industry pursuing increasingly higher clock speed. The proposed copper nanowires based interfaces could become a disruptive enabling technology for developing electronic devices with higher performance, hence can potentially make a tremendous societal impact. Educational and outreach activities will be tightly integrated into the program. By developing new curriculum and recruiting undergraduate students into the research, the program will educate next generation thermal engineers who will be motivated by fascinating nanosciences and the grand technological challenges faced by our society. The proposed outreach programs will leverage the efforts of both the Berkeley and UCSD campuses for promoting diversities, and will benefit K-12 and under-represented students.

合作提案提案编号：#1140953 /#1140121 P.I. 's：Costas Grigoropoulos / Renkun Chen研究所：加州大学伯克利分校/加州大学圣地亚哥分校热界面材料在电子设备的热管理中起着至关重要的作用。目前的材料，如油脂和焊料将不足以冷却具有越来越高的功耗水平的设备。本研究的目的是开发一种高性能的基于铜纳米线阵列的热界面材料。与现有材料相比，新材料的接触热阻将降低一个数量级。为了实现这一目标，通过多孔阳极氧化铝膜电镀，将合成具有良好控制的直径、间距和堆积密度的单晶铜纳米线的垂直排列的致密阵列。个别纳米线的机械，热和电气性能的基础研究将通过使用微加工设备进行。铜纳米线阵列的界面热阻和体热阻将采用灵敏的瞬态热反射技术进行表征。 智力优势：铜纳米线同时具有两个重要的特征，使其成为高性能热界面材料的独特候选者：高导热性和高机械顺应性。由于铜纳米线阵列的高导热性和约50%的高填充密度，与现有技术的热界面材料相比，铜纳米线阵列具有较低的接触热阻。此外，纳米线的大纵横比（200：1）使得它们在受到热应力时具有高度顺应性，因此在热循环后可以保持高的热性能。建议的调查主题将推进理解的机械和电热性能的铜纳米线有关的热封装应用，无论是单独和集体作为一个阵列，并将导致一类新的热界面材料的开发具有上级热和机械性能。更广泛的影响：热界面材料是微电子工业追求更高时钟速度的关键热封装元件之一。拟议的基于铜纳米线的接口可能成为开发更高性能电子设备的颠覆性使能技术，因此可能会产生巨大的社会影响。教育和推广活动将紧密结合到该方案中。通过开发新的课程和招募本科生参与研究，该计划将教育下一代热工程师，他们将受到迷人的纳米科学和我们社会面临的重大技术挑战的激励。拟议的外展计划将利用伯克利和UCSD校园的努力来促进教育，并将使K-12和代表性不足的学生受益。