Collaborative Research: Polymer RF electronics with Co-integrated tuning and thermal cooling using microfluidics

合作研究：使用微流体技术进行协同集成调谐和热冷却的聚合物射频电子器件

• 批准号: 1202431
• 负责人: Ioannis Papapolymerou
• 金额: $ 20万
• 依托单位: Georgia Tech Research Corporation
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2012
• 资助国家: 美国
• 起止时间: 2012-05-15 至 2016-04-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1202431&HistoricalAwards=false
• 关键词: Collaborative; Research; Polymer; RF; electronics

ECCS-1202329/1202431 Rhonda Franklin, University of Minnesota Ioannis Papapolymerou, Georgia Institute of Technology Collaborative Research: Polymer RF Electronics with Co-Integrated Tuning and Thermal Cooling Using Microfluidics Abstract Intellectual Merit: Lightweight integrated Radio-Frequency (RF) front ends in mobile communications and radar systems require adequate RF power, tuning capability and low cost. Yet, the demand for multi-function operation inevitably increases circuit densities leading to higher heat production. Integrated tuning with RF electronics exists; however, cooling solutions are developed separately and incorporated in a back-end post-assembly process that results in larger heavier systems that are costly. Tunable RF electronic technology platforms with integrated cooling systems are needed to satisfy growing mobile application requirements. However, they have not been successfully integrated into lightweight, low-cost materials that offer suitable high performance. This collaborative research project between the University of Minnesota and the Georgia Institute of Technology seeks to develop an all-in-one RF electronics and wireless communication/radar system with integrated tuning and cooling designs, using a 3-D System-on-a-Package (SOP) approach for RF front-ends. Low cost Liquid Crystal Polymer (LCP) organic substrates that can be laminated will be used to develop for the first time integrated microfluidic channel designs for heat removal and/or RF tuning. The objectives are (1) to understand dielectric fluids use for tuning in printed RF circuits while offering simultaneous cooling, (2) to develop designs/circuit models that describe RF and thermal interactions in RF designs with fluid interfaces, and (3) to demonstrate feasibility by creating an RF power amplifier circuit with co-integrated tuning/cooling approach with a microfluidic systems in organic polymer substrates. Broader Impacts: The 21st century RF mobile electronics market continues to grow at unprecedented rates. Thus, RF electronics can potentially consume enormous amounts of energy and produce significant amounts of hardware waste due to frequent upgrades if design approaches to minimize or alleviate hardware failure and extend hardware lifetimes though reconfiguration are not developed. The outcomes of this research can slow down such trends and therefore reduce environmental waste production caused by disposed electronics. This research combines RF electronics with microfluidics technology to provide a rich training experience for the next generation of students and researchers working on complex integrated systems that can preserve the environment. The educational effort will provide energy awareness from RF electronics and involve developing strong ties with local K-12 schools in Atlanta and Minneapolis, active minority student participation (i.e. K-12 and undergrad level), collaborations with K-12 educators to develop suitable age appropriate curriculum/demonstrations, and presentation talks/events to educate the public on energy use and consumptions in wireless devices.

ECCS-1202329/1202431 Rhonda富兰克林，明尼苏达大学Ioannis Papapolymerou，格鲁吉亚理工学院合作研究：聚合物射频电子与共集成调谐和热冷却使用微流体抽象知识优点：轻量级集成射频（RF）前端在移动的通信和雷达系统需要足够的RF功率，调谐能力和低成本。然而，对多功能操作的需求不可避免地增加了电路密度，从而导致更高的热产生。存在与RF电子器件集成的调谐;然而，冷却解决方案是单独开发的，并被纳入后端后组装过程中，这导致系统更大更重，成本更高。需要具有集成冷却系统的可调谐RF电子技术平台来满足不断增长的移动的应用需求。然而，它们还没有成功地集成到提供合适的高性能的轻质、低成本材料中。明尼苏达大学和格鲁吉亚理工学院之间的这一合作研究项目旨在开发一种一体化的RF电子和无线通信/雷达系统，该系统具有集成的调谐和冷却设计，并采用3-D系统级封装（SOP）方法用于RF前端。可以层压的低成本液晶聚合物（LCP）有机基板将首次用于开发集成微流体通道设计，用于散热和/或RF调谐。目的是（1）了解电介质流体用于调谐印刷RF电路，同时提供同时冷却，（2）开发设计/电路模型，描述RF设计中的RF和热相互作用与流体接口，以及（3）通过创建RF功率放大器电路与有机聚合物基板中的微流体系统的共集成调谐/冷却方法来证明可行性。更广泛的影响：21世纪世纪射频移动的电子市场继续以前所未有的速度增长。因此，如果没有开发出最小化或减轻硬件故障并延长硬件寿命的设计方法，则RF电子器件可能会消耗大量的能量，并由于频繁的升级而产生大量的硬件浪费。这项研究的结果可以减缓这种趋势，从而减少由废弃电子产品造成的环境废物产生。这项研究将射频电子技术与微流体技术相结合，为下一代从事复杂集成系统研究的学生和研究人员提供丰富的培训经验，以保护环境。教育工作将提供RF电子产品的能源意识，并涉及与亚特兰大和明尼阿波利斯的当地K-12学校建立密切联系，积极参与少数民族学生（即K-12和本科生），与K-12教育工作者合作开发合适的适合年龄的课程/演示，以及演讲/活动，以教育公众无线设备的能源使用和消耗。