High Density Broadband Signal Interconnects with Embedded Patterned Substrate Layers

高密度宽带信号与嵌入式图案化基板层互连

• 批准号: 1231368
• 负责人: Kathleen Melde
• 金额: $ 29.21万
• 依托单位: University of Arizona
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2012
• 资助国家: 美国
• 起止时间: 2012-10-01 至 2016-09-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1231368&HistoricalAwards=false
• 关键词: Density; Broadband; Signal; Interconnects; Embedded

Project Abstract 1231368Intellectual Merit: The objective of this project is develop new packaging interconnections with embedded patterned substrate layers that allow engineers to manipulate dispersion, impedance, and higher order modes in high density and high data rate channels. The innovation is the addition of a patterned layer with sub-wavelength structures that sits between the ground and signal layers in a transmission line. Interconnects with such structures will achieve design flexibility and superior performance using well-known packaging materials and without vias. Another unique aspect is the design of patterned structures that are non-periodic since the pattern density (and thus impedance) change along the line. These lines will exhibit a graded permittivity along the length of a transmission line which can reduce dispersion by compensating for delay in the direction of propagation. The ability to ?engineer characteristic impedance? creates entirely new possibilities for high performance interconnects with appropriate field and impedance match. The research will include full-wave simulations that are verified by measurements on prototype structures. The goal is an increase is approximately 10GHz in signal bandwidth and a reduction of at least 25% of signal loss over present-day wired interconnects. The research project is based on transforming the electrical properties of transmission lines using well-known dielectric materials and fills in technology gaps of present methods. The dream outcome of this work is to realize a non-homogeneous permittivity, which has not been practically realized. Broader Impacts: This work will bring value to US industry by providing a new approach to interconnects. We hope to achieve unique interconnect solutions that have features of both low permittivity for low dispersion and high-permittivty in terms of size shrinkage that uses reliable manufacturing processes. The framework developed in this work will be applicable to a wide variety of transmission lines. Results of the project including comparisons of simulations and experiments will be widely disseminated to the scientific community by papers and by providing results via a website. The project includes development of a workforce aware in issues such as signal integrity and design for manufacturability. A course in electronic packaging principles will be converted to an on-line format. Video-produced virtual field trips that take students into the simulation and circuit fabrication laboratories will be developed and offered in freshman engineering courses. These materials will also be used in recruiting highly qualified high school students taking courses for university credit.

项目摘要1231368智能优点：该项目的目标是开发具有嵌入式图案化基板层的新型封装互连，允许工程师在高密度和高数据速率通道中操纵色散、阻抗和更高阶模。这一创新是在传输线的接地层和信号层之间增加了具有亚波长结构的图案层。使用这种结构的互连将实现设计灵活性和卓越的性能，使用知名的封装材料，而不需要过孔。另一个独特的方面是图案化结构的设计，这些图案化结构是非周期的，因为图案密度(以及由此阻抗)沿线变化。这些线路将表现出沿传输线长度的渐变介电常数，这可以通过补偿传播方向上的延迟来减少色散。设计特性阻抗的能力？通过适当的场和阻抗匹配，为高性能互连创造了全新的可能性。这项研究将包括全波模拟，并通过原型结构的测量进行验证。目标是信号带宽增加约10 GHz，信号损耗比目前的有线互连减少至少25%。该研究项目基于利用知名介质材料改变输电线路的电学特性，填补了现有方法的技术空白。这项工作的理想结果是实现了一种尚未实际实现的非均匀介电常数。更广泛的影响：这项工作将通过提供一种新的互联方法为美国工业带来价值。我们希望实现独特的互连解决方案，既具有低介电常数、低色散和高介电常数的特点，又具有采用可靠制造工艺的尺寸收缩。这项工作开发的框架将适用于各种输电线路。该项目的结果，包括模拟和实验的比较，将通过论文和通过网站提供结果向科学界广泛传播。该项目包括培养一支了解信号完整性和可制造性设计等问题的员工队伍。电子封装原理课程将转换为在线形式。将开发视频制作的虚拟实地考察，将学生带到模拟和电路制造实验室，并在新生工程课程中提供。这些材料也将用于招收高素质的高中生参加大学学分课程。