Collaborative Research: From High-level Synthesis to Layout: a Cross-layer Methodology for Large-scale Reliable IC Design
协作研究:从高级综合到布局:大规模可靠IC设计的跨层方法
基本信息
- 批准号:1255816
- 负责人:
- 金额:$ 10.5万
- 依托单位:
- 依托单位国家:美国
- 项目类别:Continuing Grant
- 财政年份:2013
- 资助国家:美国
- 起止时间:2013-04-01 至 2017-03-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
Designing robust and energy-efficient large-scale systems-on-chips (SOCs) with high design productivity is a challenge of great interest. However, lack of coordination among different design layers has caused designers to make worst-case assumptions at individual design layers, leading to substantially suboptimal designs with poor reliability/energy/performance co-optimization or tradeoffs. This project is the first major effort dedicated toward a unified failure-resistant system from high-level synthesis to physical design with tight integration. It will build reliability-centric physical-aware high-level synthesis and high-level-guided physical design to bridge the gap between these two distant layers. A novel cross-layer engineering change order (ECO) framework will also be developed to couple high-level ECO with stable physical-level ECO. New tools and methodologies will be studied and provided to the system and physical design community targeting reliability while increasing overall design productivity and quality. Electronics have permeated modern society, which increasingly depends on reliable operations of these electronic systems. However, device-level scaling is heading in the opposite direction from system reliability. This project will transform existing SOC design methodologies through cross-layer integration. Research from this effort will be broadly disseminated through publications and presentations, active interaction with industrial collaborators, as well as infusion of new course material into classrooms and instructional laboratories. The principal investigators will continue their efforts in recruiting women and other underrepresented minorities into their research programs. They have previously reached out to K-12 students and will continue to do so in order to attract the best of them into the engineering profession.
设计具有较高设计生产力的强大和节能大规模系统(SOC)是引起人们极大兴趣的挑战。但是,不同设计层之间缺乏协调性导致设计人员在单个设计层上做出了最糟糕的假设,从而导致可靠性/能源/能源/绩效合作优化或权衡的次优型设计。该项目是致力于统一失败系统从高级合成到物理设计的首次重大努力,并紧密整合。它将建立以可靠性为中心的物理意识高级合成和高级引导的物理设计,以弥合这两个遥远层之间的差距。还将开发出一种新型的跨层工程变更顺序(ECO)框架,以与稳定的物理水平生态融为一体。将研究新工具和方法,并提供给系统和物理设计社区的目标,同时提高整体设计生产力和质量。电子产品已经渗透到现代社会,越来越多地取决于这些电子系统的可靠运营。但是,设备级缩放与系统可靠性相反的方向朝着相反的方向发展。该项目将通过跨层集成来改变现有的SOC设计方法。这项工作的研究将通过出版和演示,与工业合作者的积极互动以及将新课程材料注入教室和教学实验室的积极互动来广泛传播。首席调查人员将继续努力招募妇女和其他代表性不足的少数民族的研究计划。他们以前曾与K-12学生接触,并将继续这样做,以吸引他们中的最好的人进入工程专业。
项目成果
期刊论文数量(0)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
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David Pan其他文献
TOP-101 - Identification of liver-associated gene signatures from serum exosomes in patients with chronic hepatitis B
- DOI:
10.1016/s0168-8278(23)03152-5 - 发表时间:
2023-06-01 - 期刊:
- 影响因子:
- 作者:
Mario Cortese;Liao Zhang;David Pan;Jeffrey Wallin;Bryan Downie - 通讯作者:
Bryan Downie
On the complexity and accuracy of motion estimation using Lie operators
关于使用Lie算子的运动估计的复杂性和准确性
- DOI:
10.1109/ssst.2004.1295611 - 发表时间:
2004 - 期刊:
- 影响因子:0
- 作者:
M. Nalasani;David Pan - 通讯作者:
David Pan
Fixed Drug Eruption of the Penis Secondary to Sulfamethoxazole-Trimethoprim
继发于磺胺甲恶唑-甲氧苄啶的阴茎固定药疹
- DOI:
- 发表时间:
2006 - 期刊:
- 影响因子:0
- 作者:
N. Lawrentschuk;David Pan;A. Troy - 通讯作者:
A. Troy
2102 PROSTATE-SPECIFIC ANTIGEN KINETICS AND BIOPSY PROGRESSION IN PATIENTS MANAGED BY ACTIVE SURVEILLANCE
- DOI:
10.1016/j.juro.2012.02.2270 - 发表时间:
2012-04-01 - 期刊:
- 影响因子:
- 作者:
Viacheslav Iremashvili;Murugesan Manoharan;Soum Lokeshwar;Daniel L. Rosenber;David Pan;Mark S. Soloway - 通讯作者:
Mark S. Soloway
Primary and secondary control over age-related changes in physical appearance.
对与年龄相关的外貌变化进行主要和次要控制。
- DOI:
- 发表时间:
1998 - 期刊:
- 影响因子:5
- 作者:
S. Thompson;Craig W. Thomas;C. A. Rickabaugh;Peerapong Tantamjarik;Teresa A. Otsuki;David Pan;Ben F. Garcia;Evan Sinar - 通讯作者:
Evan Sinar
David Pan的其他文献
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{{ truncateString('David Pan', 18)}}的其他基金
Collaborative Research: SaTC: CORE: Medium: Security and Robustness for Intermittent Computing Using Cross-Layer Post-CMOS Approaches
协作研究:SaTC:CORE:中:使用跨层后 CMOS 方法的间歇计算的安全性和鲁棒性
- 批准号:
2303116 - 财政年份:2023
- 资助金额:
$ 10.5万 - 项目类别:
Continuing Grant
SHF: Medium: Integrating Human and Machine Intelligence for Next Generation Interactive Analog IC Design
SHF:媒介:集成人类和机器智能以实现下一代交互式模拟 IC 设计
- 批准号:
1704758 - 财政年份:2017
- 资助金额:
$ 10.5万 - 项目类别:
Continuing Grant
SHF: Small: Design/Technology Co-Optimization and Exploration in Emerging Scaling
SHF:小型:新兴扩展中的设计/技术协同优化和探索
- 批准号:
1718570 - 财政年份:2017
- 资助金额:
$ 10.5万 - 项目类别:
Standard Grant
SHF: SMALL: GOALI: Design for Manufacturability in Extreme Scaling with Emerging Nanolithography
SHF:小型:GOALI:利用新兴纳米光刻技术实现极限缩放的可制造性设计
- 批准号:
1218906 - 财政年份:2012
- 资助金额:
$ 10.5万 - 项目类别:
Standard Grant
SHF: Small: Collaborative Research: Design for Manufacturability for 3D ICs with Through Silicon Vias
SHF:小型:协作研究:具有硅通孔的 3D IC 的可制造性设计
- 批准号:
1018750 - 财政年份:2010
- 资助金额:
$ 10.5万 - 项目类别:
Standard Grant
CAREER: A Synergistic CAD Framework for Nanometer Design and Process Integration
职业生涯:用于纳米设计和工艺集成的协同 CAD 框架
- 批准号:
0644316 - 财政年份:2007
- 资助金额:
$ 10.5万 - 项目类别:
Continuing Grant
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