SHF: SMALL: GOALI: Design for Manufacturability in Extreme Scaling with Emerging Nanolithography

先进的光刻模式，使特征尺寸缩放，一直是半导体行业的圣杯。目前有几种领先的14nm、11nm、7nm和1x nm极限尺度纳米光刻技术，包括多重图案光刻（MPL）、极紫外光刻（EUVL）和电子束光刻（EBL）。该项目旨在通过这些新兴的纳米光刻技术为纳米集成电路（IC）制造的可制造性算法、工具和方法开发新的设计。提出的研究将纳米光刻工艺建模/抽象与多尺度布局优化协同联系起来。对于MPL，将开发鲁棒且可扩展的多目标布局分解算法和MPL感知物理设计工具。对于下一代纳米光刻技术，如EUVL和EBL，将研究新的设计和工艺集成问题。混合纳米光刻（例如，MPL与EBL的结合）也将被探索，以阐明未来IC布局设计的终极纳米图案。拟议的解决方案将跨越多个技术层，并汇集来自学术界和工业界的专家。该项目旨在解决在极端规模下集成电路设计和制造之间的差距的基本挑战。因此，它对半导体产业以及相关的信息和高科技产业的潜在影响不能被夸大。德克萨斯大学和IBM之间的学术-产业合作承诺创新和高风险的学术研究，结合现实的行业数据/基准，以及通过IBM及其全球合作伙伴及时的技术转让，使整个行业受益。这项研究的高度跨学科性质将紧密地整合到各种课程开发和各种学生指导计划中。

Advancing lithography patterning, which enables feature size scaling, has been a holy grail for the semiconductor industry. There are several leading nanolithography technologies for 14nm, 11nm, 7nm and 1x nm for extreme scaling, including multiple patterning lithography (MPL), extreme ultraviolet lithography (EUVL) and e-beam lithography (EBL). This project aims at developing novel design for manufacturability algorithms, tools, and methodologies for nanometer integrated circuits (IC) manufactured through these emerging nanolithography technologies. The proposed research will synergistically link nanolithography process modeling/abstraction with multi-scale layout optimization. For MPL, robust and scalable multi-objective layout decomposition algorithms and MPL-aware physical design tools will be developed. For next-generation nanolithography such as EUVL and EBL, new design and process integration issues will be studied. Hybrid nanolithography (e.g., combining MPL with EBL) will also be explored to shed light on ultimate nano-patterning for future IC layout design. The proposed solutions will span multiple technology layers and bring together experts from both academia and industry.This proposed project addresses fundamental challenges to bridge the gap between IC design and manufacturing in extreme scaling. Thus its potential impacts to the semiconductor industry and associated information and high-tech industries cannot be overstated. The academia-industry collaboration between University of Texas and IBM promises innovative and high-risk academia research coupled with realistic industry data/benchmarks and timely technology transfer through IBM and its global partners to benefit the overall industry. The highly interdisciplinary nature of this research will be tightly integrated into a variety of curriculum development and diverse student mentoring programs.