CAREER:Terahertz Interconnect, the Last Centimeter Data Link

事业：太赫兹互连，最后一厘米数据链路

• 批准号: 1351915
• 负责人: Qun Jane Gu
• 金额: $ 40万
• 依托单位: University of California-Davis
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2014
• 资助国家: 美国
• 起止时间: 2014-01-01 至 2019-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1351915&HistoricalAwards=false
• 关键词: CAREER; Terahertz; Interconnect; Last; Centimeter

CAREER: Terahertz Interconnect, the Last Centimeter Data LinkIntellectual Merit: The objective of this proposal is to develop terahertz interconnect compatible and scalable with silicon processes to address the long-standing interconnect issue. The ever-increasing inter- and intra- chip communication bandwidth imposes a big challenge over decades: interconnect bottleneck. Existing electronic interconnect (EI) and optic interconnect (OI) cannot address the interconnect issue by their own. These result in the "last centimeter" dilemma in data links. THz unique spectrum, sitting between microwave and optic frequencies, allows it to enjoy advantages of both low cost, high reliability electronic processing and low loss, small size transmission channels, therefore holds great promises in interconnect area to bridge the "last centimeter" link. Ultimate interconnect solutions mandate high energy efficiency, high bandwidth density, high reliability, low cost, as well as a fast adaptability and scaling capability with process advancements. To address this multi-dimension challenge, the PI proposes THz Interconnect research, including the investigation of TI theory, channel design, circuit implementation techniques and demonstration validation. Particularly, we will investigate three crucial enabling techniques: planar silicon process compatible channels and couplers, the high efficiency self-oscillating harmonic power amplifier based transmitter, and the high sensitivity receiver. THz interconnect system architecture and fundamental performance limits given practical circuit/system constraints, and TI scalability with process advancements will also be investigated. To the PI's knowledge, this will be the first time to investigate THz Interconnect compatible with mainstream silicon technologies. THz interconnect theory discovers the understanding of the bandwidth density and energy efficiency limits of the interconnect, and leads to evolving TI architectures that scale performance with technologies to ultimately close the interconnect gap. If successful, THz Interconnect will provide orders of magnitude better bandwidth density and energy efficiency than existing interconnects to ultimately address the last centimeter interconnect issue. Broader Impacts: THz interconnect development opens a new, high potential application for the under-utilized THz spectrum. The PI also envisions that the success of THz interconnect will enable new computer architectures to satisfy the ever-increasing bandwidth requirement in the BIG DATA era. It will also save tremendous energy to not only bring significant economic impacts, but also mitigate global warming problems. THz interconnect will form a killer application for the under-utilized THz spectrum to further motivate THz advancements and impact our lives and societies in larger and deeper scales. The PI will also integrate research with education and outreach programs, and broadly disseminate the research results through publications.

职业：Terahertz Interconnect，最后一厘米的数据LinkIntlectual功绩：该提案的目的是开发Terahertz Interconnect兼容且与硅过程可扩展，以解决长期存在的互连问题。数十年来，越来越多的间和内部交流带宽构成了一个巨大的挑战：互连瓶颈。现有的电子互连（EI）和光学互连（OI）无法自己解决互连问题。这些导致数据链接中的“最后一厘米”困境。 THZ独特的频谱位于微波炉和光学频率之间，使其可以享受低成本，高可靠性电子处理和低损耗，小尺寸的传输通道的优势，因此在互连区域内构成了巨大的承诺，可以弥合“上一厘米”链接。最终的互连解决方案授权高能效，高带宽密度，高可靠性，低成本以及快速的适应性和随着过程进步的缩放能力。为了应对这一多维挑战，PI提出了THZ互连研究，包括对TI理论，渠道设计，电路实施技术和演示验证的研究。特别是，我们将研究三种至关重要的启用技术：平面硅过程兼容通道和耦合器，基于高效率的基于谐波放大器的发射器以及高灵敏度接收器。 THZ互连系统体系结构和基本性能限制给定实用的电路/系统限制，并且还将研究具有过程进步的TI可伸缩性。据PI所知，这将是首次研究与主流硅技术兼容的THZ互连。 THZ互连理论发现了对互连的带宽密度和能效极限的理解，并导致不断发展的TI体系结构，从而通过技术扩展性能，以最终缩小互连差距。如果成功的话，THZ互连将提供比现有互连的数量级更好的带宽密度和能源效率，以最终解决上一厘米的互连问题。更广泛的影响：THZ互连开发为利用不足的THZ频谱开辟了新的，高潜在的应用。 PI还设想THZ互连的成功将使新的计算机体系结构满足大数据时代不断增加的带宽要求。它还可以节省巨大的能源，不仅会带来重大的经济影响，还可以减轻全球变暖问题。 THZ InterConnect将在未充分利用的THZ频谱中构成杀手级的应用，以进一步激励THZ的进步并以更大，更深入的规模影响我们的生活和社会。 PI还将将研究与教育和外展计划整合在一起，并通过出版物广泛传播研究结果。