GOALI: Size and Anisotropy Effects in Micro/Nano-bonds with Comparable Grain and Bond Sizes

GOALI学术联络机会(GOALI)奖旨在研究使用固-液互扩散新技术制造的微/纳米粘结的过程-微结构-机械行为。这些用于连接微电子设备中的金属互连的键与其构成的颗粒具有类似的大小。因此，预计它们的行为各向异性。此外，与传统接头不同的是，这些接头主要由金属间化合物组成，这些金属间化合物深刻地影响着这些键的力学行为。这些键的机械可靠性决定了使用这些键制造的电子器件的可靠性和成品率。本研究的目的是通过模拟和实验来研究键形成的动力学以及这些键的变形、疲劳和破坏的机制。设计并在该工艺上进行了实验，以确定工艺参数对这些粘结的微观组织和力学行为的影响，并确定最佳工艺条件。将建立相场数值模型来模拟成键动力学。通过微纳尺度的原位力学实验和疲劳实验研究材料的变形和损伤机制。有限元模拟将被用来模拟这些各向异性键的疲劳和损伤。这项研究将与英特尔公司合作进行，英特尔公司将在样品制造、热机械疲劳测试和失效分析方面提供协助。这项研究将加强固-液互扩散过程，使其成为电子制造商生产高能效、高质量和可靠电子设备的可行选择。它将促进和加快从目前的电子工艺中消除铅的进程，使这一进程更加环保和无害。在这项研究中产生的模拟工具和基础知识将促进包括电子制造、力学和材料科学与工程在内的几个学科的发展。

This Grant Opportunities for Academic Liaison with Industry (GOALI) award is to investigate process-microstructure-mechanical behavior in micro/nano bonds fabricated using a new technology of solid-liquid inter-diffusion. These bonds, that are used to join metallic interconnects in microelectronic devices, have a comparable size with their constituting grains. Therefore, they are expected to behave anisotropically. Furthermore, unlike conventional joints, these joints mainly consist of intermetallics which profoundly affect the mechanical behavior of these bonds. Mechanical reliability of these bonds dictates the reliability and yield of the electronic devices fabricated using these bonds. The goal of this research is to investigate the kinetics of bond formation as well as the mechanics of deformation, fatigue and failure of these bonds through modeling and experimentation. An experiment will be designed and conducted on the process to determine the effect of process parameters on the microstructure and mechanical behavior of these bonds and to determine the optimal process condition. Phase field numerical models will be developed to simulate the kinetics of bond formation. Mechanisms of deformation and damage will be studied through in situ mechanical and fatigue experiments at the micro/nano scale. Finite element simulation will be used to model fatigue and damage in these anisotropic bonds. The research will be conducted in collaboration with Intel Corporation who will provide assistance with specimen fabrication, thermo-mechanical fatigue testing and failure analysis of the specimens. This research will lead to enhancements in the solid-liquid inter-diffusion process making it a viable option for electronic manufacturers to produce energy efficient high quality and reliable electronic devices. It will facilitate and expedite the process of eliminating lead from the current electronic processes making the process more environmentally friendly and benign. Simulation tools and fundamental knowledge generated in this research will advance several disciplines including electronic manufacturing, mechanics and material science and engineering.