GOALI: Size and Anisotropy Effects in Micro/Nano-bonds with Comparable Grain and Bond Sizes

这个学术界与工业界联系的赠款机会（GOALI）奖是为了研究使用固液互扩散新技术制造的微/纳米键的过程-微观结构-机械行为。这些用于连接微电子器件中的金属互连的键合具有与其构成晶粒相当的尺寸。因此，预期它们表现为各向异性。此外，与传统接头不同，这些接头主要由金属间化合物组成，这深刻地影响了这些键的机械行为。这些键合的机械可靠性决定了使用这些键合制造的电子器件的可靠性和产量。本研究的目的是通过建模和实验来研究键合形成的动力学以及这些键合的变形、疲劳和失效的机理。将设计一个实验，并在该过程中进行，以确定这些债券的微观结构和机械性能的工艺参数的影响，并确定最佳的工艺条件。将开发相场数值模型来模拟键形成的动力学。变形和损伤机制将通过原位力学和疲劳实验在微米/纳米尺度上进行研究。有限元模拟将用于模拟这些各向异性粘结中的疲劳和损伤。这项研究将与英特尔公司合作进行，英特尔公司将在试样制造、热机械疲劳测试和试样失效分析方面提供援助。 这项研究将导致固液互扩散过程的增强，使其成为电子制造商生产节能、高质量和可靠电子设备的可行选择。 它将促进和加快从目前的电子工艺中消除铅的进程，使该工艺更加环保和良性。在这项研究中产生的仿真工具和基础知识将推动几个学科，包括电子制造，机械和材料科学与工程。

This Grant Opportunities for Academic Liaison with Industry (GOALI) award is to investigate process-microstructure-mechanical behavior in micro/nano bonds fabricated using a new technology of solid-liquid inter-diffusion. These bonds, that are used to join metallic interconnects in microelectronic devices, have a comparable size with their constituting grains. Therefore, they are expected to behave anisotropically. Furthermore, unlike conventional joints, these joints mainly consist of intermetallics which profoundly affect the mechanical behavior of these bonds. Mechanical reliability of these bonds dictates the reliability and yield of the electronic devices fabricated using these bonds. The goal of this research is to investigate the kinetics of bond formation as well as the mechanics of deformation, fatigue and failure of these bonds through modeling and experimentation. An experiment will be designed and conducted on the process to determine the effect of process parameters on the microstructure and mechanical behavior of these bonds and to determine the optimal process condition. Phase field numerical models will be developed to simulate the kinetics of bond formation. Mechanisms of deformation and damage will be studied through in situ mechanical and fatigue experiments at the micro/nano scale. Finite element simulation will be used to model fatigue and damage in these anisotropic bonds. The research will be conducted in collaboration with Intel Corporation who will provide assistance with specimen fabrication, thermo-mechanical fatigue testing and failure analysis of the specimens. This research will lead to enhancements in the solid-liquid inter-diffusion process making it a viable option for electronic manufacturers to produce energy efficient high quality and reliable electronic devices. It will facilitate and expedite the process of eliminating lead from the current electronic processes making the process more environmentally friendly and benign. Simulation tools and fundamental knowledge generated in this research will advance several disciplines including electronic manufacturing, mechanics and material science and engineering.