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CCF: Medium: Collaborative Research: SHF: Cascode: Supporting and Leveraging Voltage Stacking in Future Microprocessors

CCF: Medium: Collaborative Research: SHF: Cascode: Supporting and Leveraging Voltage Stacking in Future Microprocessors
CCF:中:协作研究:SHF:共源共栅:支持和利用未来微处理器中的电压堆叠
批准号:
1514284
负责人:
Jose Renau
金额:
$28.5万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2015
资助国家:
美国
项目状态:
已结题
起止时间:
2015-06-15 至 2019-12-31

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中文摘要
翻译
在从移动设备到仓库级系统的几乎所有计算和通信系统中,功耗正日益成为中心问题。这个项目研究了一种技术,它可以通过瞄准一个没有得到像其他方面那么多关注的功耗的特定方面:电力输送,来削减所有芯片至少几%的芯片能源。除了调查团队,该项目还将涉及研究生和本科生,包括代表不足的群体的成员,从而有助于扩大国家?S在信息技术方面的劳动力。目前的芯片运行在低电压(约1V),以降低功耗。然而,在低电压下供电是有问题的。例如,它会导致更大的传输损耗(在现实世界中,电力传输的电压比使用电压高数千倍)。该项目将研究一种名为Cascode功率传输系统的解决方案,该系统将多个电路平面堆叠在一起,从而自然地增加有效使用(从而传输)电压。这种设计不仅可能绕过其他提高功率输送电压的方法(例如使用片上电压转换器)的一些基本问题,而且还创造了新的架构机会,例如具有更高电压和更好能力的改进通信电路,以补偿制造过程中的变化。
英文摘要
Power dissipation is increasingly becoming the central issue in almost all computing and communication systems from mobile devices to warehouse-scale systems. This project investigates a technology that can shave off at least a few percent of chip energy of all chips by targeting one particular aspect of power consumption that has not received as much attention as others: power delivery. In addition to the team of investigators, the project will involve graduate and undergraduate students, include members of underrepresented groups and will thus help enlarge the nation?s workforce in information technologies.Today's chips operate at low voltages (about 1V) to reduce power consumption. However, delivering the power at low voltage is problematic. For instance, it results in more delivery loss (in the real world, electricity is transported at voltages thousands of times higher than that of the usage voltage). This project will be investigating a solution called the Cascode power delivery system, which stacks multiple planes of circuit to naturally increase the effective usage (and therefore delivery) voltage. This design is not only likely to bypass some fundamental problems with other means of increasing power delivery voltage (such as using on-chip voltage converters), but also to creates new architectural opportunities such as improved communication circuits with higher voltages and better capabilities to compensate variations in the fabrication process.
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  • 项目类别:
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  • 资助金额:
    $49.98万
  • 财政年份:
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  • 项目类别:
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  • 资助金额:
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  • 资助金额:
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  • 负责人:
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