EAGER: Laser 4D light field thermoreflectance (TR) imaging for non-intrusive high accuracy temperature measurement of 3D targets with high spatial and high temporal resolutions
EAGER: Laser 4D light field thermoreflectance (TR) imaging for non-intrusive high accuracy temperature measurement of 3D targets with high spatial and high temporal resolutions
批准号:
1545546
负责人:
Sy-Bor Wen
金额:
$18.41万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2015
资助国家:
美国
项目状态:
已结题
起止时间:
2015-08-01 至 2018-07-31
中文摘要
首席研究员将开发一种技术来确定三维(3D)表面或物体上的温度分布。 该技术类似于3D摄影,但在绘制温度方面增加了更复杂的挑战。 一个带有微型透镜阵列的相机将瞄准该物体。因为这些透镜以不同的角度投射图像,所以实现了三维效果。 同时,从表面的各个点反射的光的强度与温度相关,可以确定3D表面上的温度。 PI还将涉及高中教师,特别是那些来自少数民族人口较多的学校的教师,以及指导研究生和本科生。拟议的研究将创建用于热成像的微透镜阵列(MLA),提取热信息的数值算法,以及在工作条件和瞬态期间确定LED封装的瞬态3D温度分布。 作者将应用被称为4D光场成像的方法,其使得能够通过透镜阵列对3D表面进行成像,每个透镜在对象上具有不同的视角,以投影目标的图像(即,全光图像)到CCD传感器上。然后可以使用PI先前开发的算法从多个视角重建表面的3D图像。 基于表面的温度相关反射率和反射光强度(即,它们的热反射率),可以识别温度变化。 所提出的技术可以实现高精度(~ 10 mK)、高空间分辨率(~光波长的一半;即衍射限制)和纳秒时间分辨率。因此,该技术可用于稳态、准稳态和瞬态热成像,从而实现广泛的应用,包括极端条件、发光二极管(LED)和激光二极管(LD)。
英文摘要
The principal investigator will develop a technique to determine the temperature distribution on a three-dimensional (3D) surface or object. The technique is similar to 3D photography, with the added and much more complicated challenge in mapping out the temperature. A camera with an array of micro-sized lenses will be aimed at the object. Because at different angles these lenses project the images, the effect of three dimensions is achieved. At the same time the intensities of the light reflected from various points of the surface is related to temperatures, the temperature on the 3D surface can be determined. The PI will also involve high school teachers, especially those from schools with high minority population, in addition to supervising graduate and undergraduate students.The proposed study will create a microlens array (MLA) for thermal imaging, numerical algorithms to extract thermal information, and determination of transient 3D temperature profiles of LED packages during operating conditions and in transient state. The author will apply an approach known as 4D light field imaging, which enables imaging of 3D surfaces by the array of lenses, each having a different perspective on the object, to project images of the target (i.e., plenoptic images) onto a CCD sensor. The 3D image of the surfaces can then be reconstructed from the multiple perspectives, using an algorithm previously developed by the PI. Based on the temperature-dependent reflectivity and the reflected light intensity of the surfaces (i.e., their thermoreflectance), temperature changes can be identified. The proposed technique can achieve high accuracy (~ 10 mK), high spatial resolutions (~ half of light wavelength; i.e. diffraction-limited), and nano-second temporal resolutions. The technique can therefore be used for steady, quasi-steady, and transient state thermal imaging, enabling a wide range of applications including extreme conditions, light emitting diodes (LEDs) and laser diodes (LDs).
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