CAREER: High Frequency Integrated Voltage Regulator to Support Dynamic Voltage and Frequency Scaling for Mobile Devices

电压调节器已广泛用于计算系统中以将电力从能量源（例如电池）递送到微处理器。今天的电压调节器通常使用分立元件构造并组装在主板上。电感器和电容器等分立无源元件体积庞大，在主板上占据相当大的基底面。此外，从电压调节器到微处理器的功率输送路径相对较长。最近，对于可以放置在非常接近微处理器的位置以支持动态电压和频率缩放的非常高频的集成电压调节器有很大的需求，这是用于微处理器的非常有效的功耗降低技术。这将需要电源电压根据微处理器的工作负荷动态地改变（较低的工作负荷导致较低的电源电压;较低的电源电压也导致较低的时钟频率）。结果，微处理器的动态和静态功耗都可以大大降低。然而，传统的分立电压调节器不能实现动态电压和频率缩放的全部潜力，因为它们由于电压调节器和微处理器之间的高寄生互连阻抗而不能足够快地调制电源电压。本项目的重点是为智能手机等移动的设备开发20- 50 MHz三维集成稳压器。该研究预计将对智能手机以及其他移动的应用的电源管理解决方案产生重大影响。这项工作将有助于使集成电压调节器成为一种可行的方法，以显著降低移动的设备的功耗，这将大大延长电池寿命并降低电力消耗。综合教育计划将有助于保持美国电力电子劳动力的竞争活力，快速将高频功率转换器设计纳入课程，并通过短期课程对行业电力电子工人进行再培训。计划中的教育活动还包括对K-12年级的学生和代表性不足的群体进行宣传，以增加对电力电子领域的熟悉和吸引力。本项目的研究目标是开发一种20- 50 MHz的三维集成多相稳压器，可以支持智能手机等移动的设备的动态电压和频率缩放。一个独特的横向磁通电感器结构将被用来集成多个电感器到一个单件磁芯。所提出的单芯多相横向磁通电感器结构可以同时实现低剖面、高密度、低绕组电阻和限制磁通。它还可以具有可控的非线性电感（电感电流越小，电感越大），以提高稳压器轻载效率，这对于智能手机应用非常重要。这种独特的磁性元件将作为与半导体器件堆叠的衬底，实现三维集成。将采用两种不同的技术来实现集成。一是印制电路板嵌入。该技术与当今的印刷电路板制造工艺兼容，这将有助于加速工业采用集成稳压器。第二项技术是三维打印。能够共同分配不同浆料的三维打印机将用于构造包括磁性层和非磁性层两者的电感器基板。磁性层用于构建多相横向磁通电感器;非磁性层用于构建金属迹线以实现集成电压调节器所需的电连接。该技术将使非常复杂的电感器结构的集成成为可能，这将带来功率转换器封装和集成的范式转变。此外，一个高带宽的无纹波的恒定导通时间控制将被开发为建议的集成多相电压调节器。这种新的控制将有相位重叠和开启时间延长快速瞬态速度的能力。

Voltage regulators have been used widely in computing systems to deliver power from energy sources such as batteries to microprocessors. Today's voltage regulator is usually constructed using discrete components and assembled on the motherboard. The discrete passive components such as inductors and capacitors are bulky and occupy a considerable footprint on the motherboard. Furthermore, the power delivery path from the voltage regulators to the microprocessors is relatively long. Recently there has been great demand for a very high-frequency integrated voltage regulator that can be placed very close to the microprocessor to support dynamic voltage and frequency scaling, which is a very effective power consumption reduction technique for microprocessors. This would entail the supply voltage changing dynamically according to the microprocessor workload (a lower workload leads to a lower supply voltage; a lower supply voltage also leads to a lower clock frequency). As a result, both the dynamic and static power consumption of the microprocessor can be greatly reduced. However, traditional discrete voltage regulators are not able to realize the full potential of dynamic voltage and frequency scaling since they are not able to modulate the supply voltage fast enough due to the high parasitic interconnect impedance between the voltage regulators and the microprocessors. This project focuses on developing a 20-50MHz three-dimensional integrated voltage regulator for mobile devices such as smartphones. The research is expected to have a significant impact on power management solutions for smartphones as well as other mobile applications. The work will help to make the integrated voltage regulator a feasible approach to significantly reduce power consumption in mobile devices, which will greatly extend battery life and reduce electricity consumption. The integrated education plan will help to maintain the competitive vitality of the United States power electronics workforce by quickly incorporating high-frequency power converter design into the curriculum, and by retraining industry power electronics workers through short courses. The planned education activities also include outreach to students in grades K-12 and underrepresented groups to increase familiarity and attractiveness of the area of power electronics.The research goal of this project is developing a 20-50MHz three-dimensional integrated multi-phase voltage regulator that can support dynamic voltage and frequency scaling for mobile devices such as smartphones. A unique lateral flux inductor structure will be used to integrate multiple inductors into a single-piece magnetic core. The proposed single-core multi-phase lateral flux inductor structure can simultaneously achieve low-profile, high-density, low winding resistance and confined-flux. It can also have controllable nonlinear inductance (the smaller the inductor current, the larger the inductance) to increase voltage regulator light-load efficiency, which is very important for the smartphone application. This unique magnetic component will serve as a substrate stacked with semiconductor devices to realize three-dimensional integration. Two different technologies will be used to realize integration. One is printed circuit board embedding. This technique is compatible with today's printed circuit board fabrication process, which will help to speed industry's adoption of integrated voltage regulators. The second technology is three-dimensional printing. A three-dimensional printer capable of co-dispensing different pastes will be used to construct the inductor substrate which includes both a magnetic layer and a non-magnetic layer. The magnetic layer is used to build a multi-phase lateral flux inductor; the non-magnetic layer is used to build metal traces to realize a necessary electrical connection for the integrated voltage regulator. This technique will enable the integration of a very complicated inductor structure, which will bring a paradigm shift in power converter packaging and integration. Furthermore, a high bandwidth non-ripple-based constant on-time control will be developed for the proposed integrated multi-phase voltage regulators. This new control will have phase overlapping and turn-on-time extension capability for fast transient speed.