RUI: Two-dimensional flow-boiling characteristics under surface wettability gradient

RUI：表面润湿梯度下的二维流动沸腾特性

• 批准号: 1707056
• 负责人: Jong-Hoon Kim
• 金额: $ 26.4万
• 依托单位: Washington State University
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2017
• 资助国家: 美国
• 起止时间: 2017-08-15 至 2022-07-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1707056&HistoricalAwards=false
• 关键词: RUI; Two; dimensional; flow; boiling

As technology becomes increasingly miniaturized, extremely concentrated power consumption from advanced electronic devices leads to the challenge of how to keep devices from overheating. Conventional thermal solutions are inadequate for advanced high power density semiconductor devices for wireless and military applications. Flow-boiling, highly efficient phase-changing thermal energy conversion/transport phenomena, can be incorporated into microgap heat-sink technique as a promising thermal solution for high power density electronics. However, local excessive evaporations (dry-outs) by highly concentrated heat sources and consequent unevenness in flow distribution has been a challenging issue. In this project, microgap surface wetting property will be modified to address this issue; i.e., highly wetting surfaces imposed on hot-spots will enhance liquid-phase entrainment and thus prevent dry-out. The successful accomplishment of this project will advance fundamental knowledge in complex multiphase flow and heat transfer, enable cooling of futuristic electronic devices, and transfer state-of-the-art knowledge and experience to undergraduate and K-12 students.The objective of this project is to attain fundamental knowledge about two-dimensional flow-boiling morphology and heat transfer characteristics under a surface wettability gradient. Despite the critical importance, the understanding of 2-D flow-boiling morphological behavior is very limited. Mere extension of 1-D theories cannot accommodate the 2-D complications and consequences. The proposed research tasks will investigate the 2-D flow-boiling morphology and vapor ebullition cycle, which will explain 2-D energy transport mechanisms related to the flow-boiling. The effect of multiphase forces on the vapor dispersion behaviors will be explored as well. Microgap surfaces with various wetting properties will be fabricated and tested to study how the induced capillary force modify the multiphase force balance and eventually affect 2-D flow-boiling phenomena.

随着技术的日益小型化，先进电子设备极其集中的功耗导致了如何防止设备过热的挑战。传统的热解决方案不适合用于无线和军事应用的先进高功率密度半导体器件。流动沸腾是一种高效的相变热能转换/传输现象，它可以应用于微间隙散热技术，作为高功率密度电子产品的一种很有前途的热解决方案。然而，由高度集中的热源引起的局部过度蒸发(干涸)以及随之而来的流量分布不均匀一直是一个具有挑战性的问题。在该项目中，将改进微间隙表面的润湿特性来解决这个问题；即，施加在热点上的高度润湿的表面将增强液体的夹带，从而防止干涸。该项目的成功完成将促进复杂多相流和热传递的基础知识，使未来电子器件的冷却成为可能，并将最新的知识和经验传授给本科生和K-12学生。本项目的目标是获得表面润湿梯度下的二维流动沸腾形态和传热特性的基础知识。尽管流动沸腾非常重要，但人们对二维流动沸腾形态行为的了解非常有限。仅仅扩展一维理论不能适应二维的复杂情况和后果。拟议的研究任务将研究二维流动沸腾形态和水蒸气沸腾循环，这将解释与流动沸腾相关的二维能量传输机制。文中还探讨了多相力对蒸汽扩散行为的影响。为了研究诱导毛细管力如何改变多相力平衡并最终影响二维流动沸腾现象，我们将制作具有不同润湿性质的微间隙表面并进行测试。

项目成果

Effect of Viscosity on High-Throughput Deterministic Lateral Displacement (DLD)

• DOI: 10.3390/micro2010006
• 发表时间: 2022-03-01
• 期刊: MICRO-SWITZERLAND
• 作者: Senf, Brian;Kim, Jong-Hoon
• 通讯作者: Kim, Jong-Hoon

Recent Advances in Wearable Sensors and Integrated Functional Devices for Virtual and Augmented Reality Applications

• DOI: 10.1002/adfm.202005692
• 发表时间: 2020-10-14
• 期刊: ADVANCED FUNCTIONAL MATERIALS
• 影响因子: 19
• 作者: Kim, Hojoong;Kwon, Young-Tae;Yeo, Woon-Hong
• 通讯作者: Yeo, Woon-Hong

Vortex-free high-Reynolds deterministic lateral displacement (DLD) via airfoil pillars

• DOI: 10.1007/s10404-018-2160-3
• 发表时间: 2018-12-01
• 期刊: MICROFLUIDICS AND NANOFLUIDICS
• 影响因子: 2.8
• 作者: Dincau, Brian M.;Aghilinejad, Arian;Kim, Jong-Hoon
• 通讯作者: Kim, Jong-Hoon

Directly Accessible and Transferrable Nanofluidic Systems for Biomolecule Manipulation

用于生物分子操纵的可直接访问和可转移的纳米流体系统

• DOI: 10.1021/acssensors.9b00470
• 发表时间: 2019
• 期刊: ACS Sensors
• 影响因子: 8.9
• 作者: Kim, Yun-Soung;Dincau, Brian M.;Kwon, Young-Tae;Kim, Jong-Hoon;Yeo, Woon-Hong
• 通讯作者: Yeo, Woon-Hong

Two-Dimensional Flow Boiling Characteristics With Wettability Surface in Microgap Heat Sink and Heat Transfer Prediction Using Artificial Neural Network

• DOI: 10.1115/1.4051602
• 发表时间: 2021-09
• 期刊: Journal of Heat Transfer
• 作者: A. Karim;Y. Kim;Jong-Hoon Kim