EAGER: Transfer by Contact using Adhesion Engineering for Integration of Two-Dimensional Materials into Functional Devices

EAGER：利用粘合工程通过接触转移将二维材料集成到功能器件中

• 批准号: 2135846
• 负责人: Farnaz Niroui
• 金额: $ 18.56万
• 依托单位: Massachusetts Institute of Technology
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2021
• 资助国家: 美国
• 起止时间: 2021-07-01 至 2022-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2135846&HistoricalAwards=false
• 关键词: EAGER; Transfer; Contact; using; Adhesion

The discovery of graphene has led to the discovery of atomically thin two-dimensional materials with diverse and unique properties. Two-dimensional materials have rapidly grown into one of the leading material platforms for next-generation electronics, optoelectronics and quantum devices. For these materials to be integrated into functional devices, they need to be isolated from their growth substrate and transferred onto a target surface without damage and contamination. This materials integration is challenging to achieve through the current transfer techniques which generally rely on wet and high temperature processes using additional support layers. This EArly-concept Grant for Exploratory Research (EAGER) project looks to overcome these challenges by developing and understanding a dry and low-temperature process that allows direct transfer of two-dimensional materials from a source to target by a single direct contact and delamination step without a need for a support layer. Such a technique can help reduce damage and contamination during the transfer to achieve otherwise hard to realize structures in a scalable and high-throughput manner. As a result, this transfer platform can help in promoting our nation’s global competitiveness in the rapidly evolving field of two-dimensional materials and their applications. This research program will provide opportunities for training students in this area. The results of this research will be directly integrated as a laboratory teaching module in a new course being developed. The aim of this research is to develop a dry, low-temperature, sacrificial layer-free transfer of monolayer two-dimensional materials. In this approach, transfer occurs as the source and target surfaces are brought into contact and delaminated under controlled conditions using an aligned transfer printing platform. Foundational to this is engineering of the target substrate surface with interactions and adhesion mechanisms beyond van der Waals forces that promote a successful transfer. This EAGER will develop this approach for 2D monolayer transfer with a focus on surface adhesion engineering through tuning the surface chemical terminations and mechanical characteristics, studying the adhesion mechanisms, probing the transfer quality and accordingly optimizing for a damage and contamination-free transfer.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

石墨烯的发现导致了具有多种独特性能的原子薄二维材料的发现。二维材料已迅速发展成为下一代电子、光电子和量子器件的领先材料平台之一。为了将这些材料集成到功能器件中，需要将它们与其生长基底隔离并转移到目标表面上而不造成损坏和污染。通过电流传输技术实现这种材料集成具有挑战性，该技术通常依赖于使用额外支撑层的湿法和高温工艺。这个早期概念探索性研究资助 (EAGER) 项目旨在通过开发和理解一种干燥低温工艺来克服这些挑战，该工艺允许通过单个直接接触和分层步骤将二维材料从源直接转移到目标，而不需要支撑层。这种技术可以帮助减少转移过程中的损坏和污染，从而以可扩展和高通量的方式实现原本难以实现的结构。因此，这个转移平台可以帮助提升我国在快速发展的二维材料及其应用领域的全球竞争力。该研究计划将为该领域的学生提供培训机会。这项研究的成果将直接作为实验室教学模块整合到正在开发的新课程中。 本研究的目的是开发一种单层二维材料的干燥、低温、无牺牲层转移。在这种方法中，当源表面和目标表面使用对齐的转印平台在受控条件下接触并分层时，就会发生转印。其基础是对目标基板表面进行工程设计，使其具有超越范德华力的相互作用和粘附机制，从而促进成功转移。该 EAGER 将开发这种用于 2D 单层转移的方法，重点是表面粘附工程，通过调整表面化学终止和机械特性、研究粘附机制、探测转移质量并相应地优化无损坏和无污染转移。该奖项反映了 NSF 的法定使命，并通过使用基金会的智力价值和更广泛的影响审查标准进行评估，被认为值得支持。