EAGER: Transfer by Contact using Adhesion Engineering for Integration of Two-Dimensional Materials into Functional Devices

EAGER：利用粘合工程通过接触转移将二维材料集成到功能器件中

• 批准号: 2135846
• 负责人: Farnaz Niroui
• 金额: $ 18.56万
• 依托单位: Massachusetts Institute of Technology
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2021
• 资助国家: 美国
• 起止时间: 2021-07-01 至 2022-12-31
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2135846&HistoricalAwards=false
• 关键词: EAGER; Transfer; Contact; using; Adhesion

The discovery of graphene has led to the discovery of atomically thin two-dimensional materials with diverse and unique properties. Two-dimensional materials have rapidly grown into one of the leading material platforms for next-generation electronics, optoelectronics and quantum devices. For these materials to be integrated into functional devices, they need to be isolated from their growth substrate and transferred onto a target surface without damage and contamination. This materials integration is challenging to achieve through the current transfer techniques which generally rely on wet and high temperature processes using additional support layers. This EArly-concept Grant for Exploratory Research (EAGER) project looks to overcome these challenges by developing and understanding a dry and low-temperature process that allows direct transfer of two-dimensional materials from a source to target by a single direct contact and delamination step without a need for a support layer. Such a technique can help reduce damage and contamination during the transfer to achieve otherwise hard to realize structures in a scalable and high-throughput manner. As a result, this transfer platform can help in promoting our nation’s global competitiveness in the rapidly evolving field of two-dimensional materials and their applications. This research program will provide opportunities for training students in this area. The results of this research will be directly integrated as a laboratory teaching module in a new course being developed. The aim of this research is to develop a dry, low-temperature, sacrificial layer-free transfer of monolayer two-dimensional materials. In this approach, transfer occurs as the source and target surfaces are brought into contact and delaminated under controlled conditions using an aligned transfer printing platform. Foundational to this is engineering of the target substrate surface with interactions and adhesion mechanisms beyond van der Waals forces that promote a successful transfer. This EAGER will develop this approach for 2D monolayer transfer with a focus on surface adhesion engineering through tuning the surface chemical terminations and mechanical characteristics, studying the adhesion mechanisms, probing the transfer quality and accordingly optimizing for a damage and contamination-free transfer.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

石墨烯的发现导致发现具有潜水员和独特特性的原子上薄的二维材料。二维材料已迅速发展为下一代电子，光电子和量子设备的领先材料平台之一。要将这些材料集成到功能设备中，需要将它们与生长基板隔离，并将其转移到目标表面而不会损坏和污染。通过当前的转移技术，这种材料集成在通常依赖于湿温和高温过程的当前转移技术实现。这项对探索性研究（急切）项目的早期概念赠款旨在通过发展和理解干燥和低温的过程来克服这些挑战，该过程允许通过单个直接接触和分层步骤将二维材料直接转移到目标中，而无需支撑层。这样的技术可以帮助减少转移过程中的损害和污染，以便难以实现以可扩展和高通量方式实现结构。结果，这个转移平台可以帮助促进我们国家在二维材料快速发展的领域中的全球竞争力及其应用。该研究计划将为培训该领域的学生提供机会。这项研究的结果将直接整合为一个新课程的实验室教学模块。这项研究的目的是开发单层二维材料的干燥，低温的无层层转移。在这种方法中，随着源和目标表面的接触并在受控条件下使用对齐的传输打印平台进行分层时，转移发生。这是基础的基础是目标底物表面的工程，其相互作用和广告机制以外的范德华力量促进了成功的转移。这种渴望将通过调整表面化学终止和机械特征，研究粘合剂机制，探测转移质量并因此对无损害和无污染的无污染转移进行优化的奖项，以对表面粘合工程进行这种方法开发这种方法，重点是表面粘合剂工程。该奖项反映了NSF的法定任务，并通过评估范围来进行评估，以反映了范围的范围。