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IUCRC Phase II University of Illinois Urbana Champaign: Center for Advanced Electronics through Machine Learning (CAEML)

IUCRC Phase II University of Illinois Urbana Champaign: Center for Advanced Electronics through Machine Learning (CAEML)
IUCRC 第二阶段伊利诺伊大学香槟分校:机器学习先进电子学中心 (CAEML)
批准号:
2137288
负责人:
Elyse Rosenbaum
金额:
$50.0万
依托单位国家:
美国
项目类别:
Continuing Grant
财政年份:
2022
资助国家:
美国
项目状态:
未结题
起止时间:
2022-04-15 至 2027-03-31

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中文摘要
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英文摘要
The design complexity of modern microelectronic systems, e.g., a chip with over one billion transistors, necessitates the use of automated design checks and computer simulations to verify the functionality and reliability of microelectronic components and systems prior to manufacturing. The computer memory and run time increase with design complexity, and thus one typically adopts a simplified description of the system, with reduced accuracy, to complete the design process in a timely and cost-efficient manner. This project will apply machine learning to microelectronic design verification and optimization, improving accuracy and resulting in a reduced design cycle time and radically improved reliability. CAEML, the Center for Advanced Electronics through Machine Learning, will develop a behavioral, machine-learning approach to hardware modeling, emphasizing the accuracy of the end-to-end system model. Uncertainty quantification is applied to reduce reliance on design guard-banding. CAEML will research techniques for collaborative machine learning (ML), whereby multiple organizations can jointly train ML models using their proprietary design data but without releasing any confidential information. Inverse models will be demonstrated as a feasible approach to design space exploration based on specifications. CAEML brings together experts on microelectronics design and machine learning; Illinois provides expertise on signal integrity and nonlinear dynamical systems. The microelectronics industry undergirds larger vertical markets, including computing, communications, and transportation. CAEML serves the vitally important microelectronics industry with its research, workforce development, and continuing education programs. CAEML research will improve the efficiency of the design process and the quality of the final product; the first reduces costs and the second directly benefits the public. Microelectronic systems that are both secure and reliable allow government and utilities to provide critical services to the public, while low-power microelectronic systems promote environmental sustainability. CAEML provides the microelectronics industry with a diverse pool of new graduates who have excellent professional preparation. CAEML will maintain a single repository to be used for depositing and dissemination of data, documents, and code across the Center. Repository files will be stored on virtual directories that reside on an Illinois Grainger College of Engineering (GCOE) storage array. The format of the data will be documented with metadata files that provide an explanation of the exact format. The Repository will be backed up regularly, following GCOE standards and practices. Experimental data will be retained for at least three years and as governed by the policies of the institution at which the data were gathered.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
期刊论文(24)
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会议论文
Machine-Learning-Based Constrained Optimization of a Test Coupon Launch Using Inverse Modeling
使用逆向建模基于机器学习的测试优惠券发射约束优化
DOI: 10.1109/epeps58208.2023.10314941
发表时间: 2023
期刊: IEEE 32th Conference on Electrical Performance of Electronic Packages and Systems (EPEPS
影响因子: --
作者: [Page, A., Chen, X.]
通讯作者: Chen, X.
DOI: 10.1145/3551901.3556495
发表时间: 2022-09
期刊: 2022 ACM/IEEE 4th Workshop on Machine Learning for CAD (MLCAD)
影响因子: --
作者: [Yuejiang Wen;J. Dean;Brian A. Floyd;P. Franzon]
通讯作者: Yuejiang Wen;J. Dean;Brian A. Floyd;P. Franzon
Inverse Design of Embedded Inductor with Hierarchical Invertible Neural Transport Net
分层可逆神经传输网络嵌入式电感器的逆向设计
DOI: 10.1109/epeps53828.2022.9947131
发表时间: 2022
期刊: 2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS
影响因子: --
作者: [Akinwande, Oluwaseyi, Bhatti, Osama Waqar, Swaminathan, Madhavan]
通讯作者: Swaminathan, Madhavan
DOI: 10.1109/mlcad58807.2023.10299839
发表时间: 2023-09
期刊: 2023 ACM/IEEE 5th Workshop on Machine Learning for CAD (MLCAD)
影响因子: --
作者: [Fin Amin;Soumyadeep Chatterjee;P. Franzon]
通讯作者: Fin Amin;Soumyadeep Chatterjee;P. Franzon
24
    SHF: Small: Online Detection and Recovery from Electrostatic Discharge Induced Transient Errors
    Collaborative Research: Planning Grant: I/UCRC for Advanced Electronics through Machine Learning
    Electrical Overstress Protection for System-in-a-Package
    CAREER: Electrostatic Discharge Protection in SOI-CMOS Circuits
    国内基金
    海外基金
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