FuSe-TG: Heterogeneous module, array antenna, and IC co-design for energy-efficient D-band wireless communications and radar

FuSe-TG：异构模块、阵列天线和 IC 协同设计，用于节能 D 频段无线通信和雷达

• 批准号: 2235336
• 负责人: Wooram Lee
• 金额: $ 30万
• 依托单位: Pennsylvania State Univ University Park
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-06-15 至 2025-05-31
• 项目状态: 未结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2235336&HistoricalAwards=false
• 关键词: FuSe; TG; Heterogeneous; module; array

Future wireless communication and radar technologies above 100 GHz will enable high-speed data transmission and high-resolution radar sensing, which will be the foundation to enable people and things to connect and interact with one another across physical and virtual spaces seamlessly. One of the key enablers for these technologies is a large-scale antenna array module, where multiple radio transmitters and receivers are integrated with a group of antennas for high-speed data transmission over a longer distance. This project will address the key co-design and integration challenges of implementing a large-scale antenna array module above 100 GHz. The scope of the proposed co-design study covers both high-performance-driven integration platforms for potential defense-related applications and volume-driven cost-effective packaging technologies for commercial use cases. The research insights from this project can be adopted via industry engagement to develop new process technologies and therefore will benefit a wide range of semiconductor manufacturing companies in the United States. The success of the project will also help maintain the continuous leadership of the United States in wireless technologies and semiconductors by training students into innovative engineers.To overcome severe path loss and limited transistor performance above 100 GHz, silicon-based large-scale phased array transceivers are essential to realizing D-band (110-170 GHz) wireless communications and radar. For the development of D-band phased array modules, the small size of antenna-in-package (AiP), which scales down with wavelength, poses electromagnetic, thermal, and manufacturing challenges. To address these, we propose a holistic IC/package/antenna/system co-design approach based on heterogeneous integration for a scalable phased array module above 100 GHz. We will study a scalable D-band aperiodic phased array architecture without the constraint of λ/2 antenna spacing as a stepstone example to establish our teaming environment and demonstrate the proposed approaches. For the heterogeneous integration of different chiplets and antenna arrays at frequencies100 GHz, we will investigate emerging packaging technologies such as fan-out wafer-level packaging (FOWLP) and SLIC to address the combined electromagnetic, IC/signal routing density, and thermal challenges. We will also develop new D-band antenna design principles using substrate-integrated waveguide (SIW) based composite right/left-handed (CRLH) metamaterial resonator for wide bandwidth and dual-polarization support. These collaborative efforts will pave the way for the development of a scalable phased array module above 100 GHz with more element count, higher energy efficiency, better thermal management, and greater manufacturability. This will be the key enabler to realizing next-generation ultra-wideband wireless communications and radar that offer the potential for revolutionary applications including industrial automation, immersive augmented and virtual reality, holographic telepresence, and self-driving cars.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

未来100 GHz以上的无线通信和雷达技术将实现高速数据传输和高分辨率雷达传感，这将是使人和物跨越物理和虚拟空间无缝连接和互动的基础。这些技术的关键推动因素之一是大规模天线阵列模块，其中多个无线电发射器和接收器与一组天线集成在一起，以实现更长距离的高速数据传输。该项目将解决实施100 GHz以上大规模天线阵列模块的关键合作设计和集成挑战。拟议的联合设计研究的范围既包括用于潜在国防相关应用的高性能驱动的集成平台，也包括用于商业用例的批量驱动的经济高效的包装技术。该项目的研究见解可以通过行业参与来开发新的工艺技术，因此将使美国范围广泛的半导体制造公司受益。该项目的成功还将有助于通过将学生培养成创新工程师，保持美国在无线技术和半导体领域的持续领先地位。为了克服100 GHz以上严重的路径损耗和有限的晶体管性能，硅基大规模相控阵收发机是实现D波段(110-170 GHz)无线通信和雷达的关键。对于D波段相控阵组件的开发，随着波长的缩小，封装天线(AIP)的小尺寸带来了电磁、热和制造方面的挑战。针对这些问题，我们针对100 GHz以上的可扩展相控阵组件，提出了一种基于异质集成的整体IC/封装/天线/系统协同设计方法。我们将以一种不受λ/2天线间距限制的可扩展D波段非周期相控阵结构为例，建立我们的分组环境，并演示所提出的方法。对于频率为100 GHz的不同芯片和天线阵列的异质集成，我们将研究新兴的封装技术，如扇出晶圆级封装(FOWLP)和SLIC，以解决组合的电磁、IC/信号布线密度和热挑战。我们还将开发新的D波段天线设计原则，使用基于基片集成波导(SIW)的复合右手/左手(CRLH)超材料谐振器来实现宽带和双极化支持。这些合作努力将为开发100 GHz以上的可扩展相控阵模块铺平道路，该模块具有更多的元件数量、更高的能源效率、更好的热管理和更好的可制造性。这将是实现下一代超宽带无线通信和雷达的关键推动因素，这些通信和雷达具有革命性应用的潜力，包括工业自动化、身临其境的增强和虚拟现实、全息网真以及自动驾驶汽车。该奖项反映了NSF的法定使命，并通过使用基金会的智力优势和更广泛的影响审查标准进行评估，被认为值得支持。