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REU Site: Nanomanufacturing of Emerging 2D Materials and Devices

REU Site: Nanomanufacturing of Emerging 2D Materials and Devices
REU 网站:新兴 2D 材料和器件的纳米制造
批准号:
2244201
负责人:
Suzanne Mohney
金额:
$40.5万
依托单位国家:
美国
项目类别:
Standard Grant
财政年份:
2023
资助国家:
美国
项目状态:
未结题
起止时间:
2023-06-01 至 2026-05-31

项目摘要

项目成果

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中文摘要
翻译
REU网站名为新兴二维材料和器件的纳米制造,由宾夕法尼亚州立大学-大学公园主办,为学生提供为期十周的暑期研究经验,以解决与半导体行业相关的问题,该行业对美国训练有素的员工的需求预计将急剧增长。每年有10名本科生将成为小型研究团队的一部分,其中包括教师顾问和研究生导师,所有人都将共同努力实现与技术相关的发展目标。团队中的每个本科生都有自己的职责,这是团队总体目标不可或缺的一部分。该项目将为学员和导师提供培训和指导,以鼓励师徒关系的发展,这种关系将超越暑期体验的结束。REU学生将接受负责任的研究行为和实验室安全方面的培训。他们还将参加专业发展机会,并与半导体行业的工程师会面。培训最终将有助于半导体芯片的研究和制造基础设施。这些努力将通过对很大一部分传统上在科学和工程领域代表性不足的学生的指导,促进人力资源开发。REU网站名为新兴二维材料和器件的纳米制造,由宾夕法尼亚州立大学-大学公园主办,为学生提供为期十周的暑期研究经验,以解决与半导体行业相关的问题,该行业对美国训练有素的员工的需求预计将急剧增长。该基地每年将培训10名本科生,让他们有机会进行二维半导体的研究,二维半导体是一类分层范德华固体,为新兴设备技术提供独特的性能优势,并有可能与硅集成电路集成以实现新功能。特别感兴趣的二维半导体包括过渡金属二硫族化合物,如二硫化钼和二硒化钨,它们在单层极限上具有直接带隙,并且与用于大规模缩放器件的硅相比,具有优越的输运特性。该网站还将探索拓扑半金属,可用于芯片上的电气互连或太赫兹区域的光学器件。研究人员将进一步评估在夏季本科生研究地点使用小型跨学科团队的影响,与每个学生有一个独立项目的更常见模式相比。本科生从暑期实习中获得的知识和经验将激励并为他们在纳米制造领域的研究生学习做好准备。他们的培训最终将有助于半导体芯片和新兴电子和光子器件的研究和制造基础设施。该奖项反映了美国国家科学基金会的法定使命,并通过使用基金会的知识价值和更广泛的影响审查标准进行评估,被认为值得支持。
英文摘要
The REU Site entitled Nanomanufacturing of Emerging 2D Materials and Devices hosted by Pennsylvania State University-University Park provides students with a ten-week summer research experience to address problems relevant to the semiconductor industry, a sector in which demand for trained employees in the United States is expected to grow dramatically. Each year ten undergraduate students will be part of small research teams that include faculty advisors and graduate student mentors, all of whom will work together toward a technologically relevant development goal. Each undergraduate on a team will have a responsibility that is integral to the team’s overall objectives. The program will provide training and coaching for mentees and mentors to encourage the development of mentoring relationships that extend beyond the conclusion of the summer experience. REU students will receive training in the responsible conduct of research and laboratory safety. They will also take part in professional development opportunities and meet engineers in the semiconductor industry. The training will ultimately contribute to research and manufacturing infrastructure for semiconductor chips. These efforts will contribute to human resource development through mentorship of a significant fraction of students who are traditionally underrepresented in science and engineering.The REU Site entitled Nanomanufacturing of Emerging 2D Materials and Devices hosted by Pennsylvania State University-University Park provides students with a ten-week summer research experience to address problems relevant to the semiconductor industry, a sector in which demand for trained employees in the United States is expected to grow dramatically. Each year this site will train ten undergraduates by giving them the opportunity to conduct research on two-dimensional semiconductors, a class of layered van der Waals solids that offer unique performance benefits for emerging device technologies and the potential to be integrated with silicon integrated circuits to realize new functionalities. Two-dimensional semiconductors of special interest include the transition metal dichalcogenides, such as molybdenum disulfide and tungsten diselenide, which have a direct band gap in the monolayer limit and exhibit superior transport properties compared to silicon for aggressively scaled devices. The site will also explore topological semimetals, which may be used in electrical interconnects on chips or for optics in the terahertz regime. Researchers will furthermore evaluate the impact of the use of small interdisciplinary teams in a summer undergraduate research site compared to the more common model of each student having a standalone project. The knowledge and experiences that the undergraduate students gain from their summer internships will motivate and prepare them to pursue graduate studies in fields involving nanofabrication. Their training will ultimately contribute to research and manufacturing infrastructure for semiconductor chips and emerging electronic and photonic devices.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
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会议论文
NSF-BSF: New Approaches to Contacts to 2D Semiconductors
Contacts to Layered Dichalcogenide Semiconductors
Nanoengineering Electrodes for Reliable Microelectromechanical Ohmic Contact Switches
Contacts to Group III Nitride Semiconductor Alloys
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  • 项目类别:
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  • 资助金额:
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  • 批准年份:
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  • 负责人:
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  • 批准号:
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  • 项目类别:
    专项基金项目
  • 资助金额:
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  • 批准年份:
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  • 负责人:
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