STTR Phase I: Wafer-Integrated Soft Magnetic Composite Films for Inductors with High Power Density and Efficiency

STTR 第一阶段：用于高功率密度和效率电感器的晶圆集成软磁复合薄膜

• 批准号: 2304631
• 负责人: Uppili Sridhar
• 金额: $ 27.5万
• 依托单位: Himet Materials LLC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-09-01 至 2024-11-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2304631&HistoricalAwards=false
• 关键词: STTR; Phase; Wafer; Integrated; Soft

The broader/commercial impact of this Small Business Technology Transfer (STTR) Phase I project is to revolutionize the miniature-powered Integrated Circuit (IC) converter market, widely used in cellular phones, Internet of Things devices, and microsensors. The technology will provide form factor reductions of various modules, leading to the further miniaturization of on-chip components. A manufacturing facility can service several IC companies by providing foundry capabilities to integrate inductors according to each customer’s design. The technology can provide US manufacturers of such devices with a significant competitive edge in the very large mobile electronics and miniature electronics markets both in commercial and defense markets. Establishing manufacturing capability in the US will support a revival of component packaging and back-end integration business. Mobile device miniaturization is increasing at a rapid rate. In on-board power converters, passive components such as inductors and capacitors are among the largest components. The non-availability of IC-compatible, low-cost, soft magnetic cores with low loss, high frequency (10MHz), and high saturation magnetization limits the implementation of on-chip inductors. The project aims to create innovative, soft magnetic composite (SMC) materials for inductor cores. IC-compatible high-performance SMC films, with thicknesses that can be scaled to 50 microns and above without losing performance, will be developed for the first time. The project's initial goal will be to develop physical and electrochemical synthesis methodologies for high magnetic moment, low loss, SMC materials that can be used to fabricate on-chip inductors, replacing ferrite core-based inductors in circuits. The approach can be scaled to handle different ranges of power and can be integrated on wafers, package substrates, or boards. These cores will enable inductor thickness to be reduced by at least 10 times for use in low form factor, point-of-use, direct current (DC) to DC power converters and IC voltage regulator circuitry.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

这个小型企业技术转移（STTR）I阶段项目的更广泛/商业影响是彻底改变微型驱动的集成电路（IC）转换器市场，该电路（IC）转换器市场广泛用于蜂窝电话，物联网设备和微传感器。该技术将提供各种模块的外形降低，从而导致芯片组件的进一步微型化。制造工厂可以通过提供铸造功能来整合每个客户设计引起的诱导引起的功能，从而为多家IC公司提供服务。该技术可以在商业和国防市场的非常大型的移动电子和微型电子市场中为我们的此类设备的制造商提供具有巨大的竞争优势。在美国建立制造能力将支持组件包装和后端集成业务的复兴。移动设备小型化以快速速度增加。在板载电源转换器中，被动组件（例如诱导和电容器）是最大的组件之一。 IC兼容，低成本，软磁芯具有低损耗，高频（10MHz）和高饱和磁化的不可用，限制了芯片诱导的诱导的实施。该项目旨在为诱导核心创建创新的软磁复合材料（SMC）材料。与IC兼容的高性能SMC膜，厚度可以缩放到50微米及以上而不会失去性能，这将首次开发。该项目的最初目标是开发物理和电化学合成方法，用于高磁矩，低损耗的SMC材料，可用于制造片上诱导的诱导，以取代铁氧体核心基于基于铁氧体的诱导电路。该方法可以缩放以处理不同的功率范围，并可以集成在摇摆，包装基板或板上。这些核心将使感应厚度至少减少10次，以用于低外形，使用点，直流电流（DC）到DC功率转换器和IC电压调节器电路。该奖项反映了NSF的法定任务，并通过使用该基金会的智力功能和广泛影响来评估Criteria criteria criteria criteria criteria被视为珍贵。