STTR Phase I: Wafer-Integrated Soft Magnetic Composite Films for Inductors with High Power Density and Efficiency

STTR 第一阶段：用于高功率密度和效率电感器的晶圆集成软磁复合薄膜

• 批准号: 2304631
• 负责人: Uppili Sridhar
• 金额: $ 27.5万
• 依托单位: Himet Materials LLC
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2023
• 资助国家: 美国
• 起止时间: 2023-09-01 至 2024-11-30
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=2304631&HistoricalAwards=false
• 关键词: STTR; Phase; Wafer; Integrated; Soft

The broader/commercial impact of this Small Business Technology Transfer (STTR) Phase I project is to revolutionize the miniature-powered Integrated Circuit (IC) converter market, widely used in cellular phones, Internet of Things devices, and microsensors. The technology will provide form factor reductions of various modules, leading to the further miniaturization of on-chip components. A manufacturing facility can service several IC companies by providing foundry capabilities to integrate inductors according to each customer’s design. The technology can provide US manufacturers of such devices with a significant competitive edge in the very large mobile electronics and miniature electronics markets both in commercial and defense markets. Establishing manufacturing capability in the US will support a revival of component packaging and back-end integration business. Mobile device miniaturization is increasing at a rapid rate. In on-board power converters, passive components such as inductors and capacitors are among the largest components. The non-availability of IC-compatible, low-cost, soft magnetic cores with low loss, high frequency (10MHz), and high saturation magnetization limits the implementation of on-chip inductors. The project aims to create innovative, soft magnetic composite (SMC) materials for inductor cores. IC-compatible high-performance SMC films, with thicknesses that can be scaled to 50 microns and above without losing performance, will be developed for the first time. The project's initial goal will be to develop physical and electrochemical synthesis methodologies for high magnetic moment, low loss, SMC materials that can be used to fabricate on-chip inductors, replacing ferrite core-based inductors in circuits. The approach can be scaled to handle different ranges of power and can be integrated on wafers, package substrates, or boards. These cores will enable inductor thickness to be reduced by at least 10 times for use in low form factor, point-of-use, direct current (DC) to DC power converters and IC voltage regulator circuitry.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

这一小型企业技术转让（STTR）第一阶段项目的更广泛/商业影响是彻底改变微型供电集成电路（IC）转换器市场，该市场广泛应用于手机、物联网设备和微传感器。该技术将提供各种模块的形状因子减小，从而导致片上组件的进一步小型化。一家制造工厂可以为多家IC公司提供服务，提供代工能力，根据每个客户的设计集成电感器。该技术可以为美国制造商提供这种设备的显着竞争优势，在非常大的移动的电子和微型电子市场，无论是在商业和国防市场。在美国建立制造能力将支持组件封装和后端集成业务的复苏。移动终端小型化正在快速增长。在板上电源转换器中，电感器和电容器等无源元件是最大的元件之一。 由于没有与IC兼容的、低成本的、具有低损耗、高频率（10 MHz）和高饱和磁化强度的软磁芯，限制了片上电感的实现。该项目旨在为电感器磁芯创造创新的软磁复合（SMC）材料。将首次开发与IC兼容的高性能SMC薄膜，其厚度可扩展到50微米及以上而不损失性能。该项目的初步目标是开发高磁矩、低损耗的SMC材料的物理和电化学合成方法，这些材料可用于制造片上电感器，取代电路中基于铁氧体磁芯的电感器。该方法可以缩放以处理不同范围的功率，并且可以集成在晶圆、封装基板或电路板上。这些磁芯将使电感器厚度减少至少10倍，用于低外形、使用点、直流（DC）到直流电源转换器和IC电压调节器电路。该奖项反映了NSF的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。