I-Corps: A Dedicated Foundry Service for Emerging Materials

I-Corps:新兴材料的专用代工服务

基本信息

  • 批准号:
    2317500
  • 负责人:
  • 金额:
    $ 5万
  • 依托单位:
  • 依托单位国家:
    美国
  • 项目类别:
    Standard Grant
  • 财政年份:
    2023
  • 资助国家:
    美国
  • 起止时间:
    2023-04-15 至 2024-03-31
  • 项目状态:
    已结题

项目摘要

The broader impact/commercial potential of this I-Corps project is the development of advancements in the use of emerging materials for semiconductor manufacturing. The dedicated emerging materials foundry could alleviate the chip shortage concerns which have disproportionately affected small and medium-sized businesses which use chips in their products. There may be four classes of customers: scientists/engineers in the fields of chemistry, biology, etc.; scientists/engineers who grow nanomaterial in their labs; small/medium sized internet of things companies; and semiconductor packaging facilities that are interested in integrating chips with their existing products. For each class, an application-specific chip will be developed which will harness certain unique properties of 2-dimensional materials. The low-to-medium volume production line of the proposed business will enable the flexibility to meet the targeted needs of a large variety of customers who will not be reliant on the rigid tape-out schedules of foundries.This I-Corps project is based on the development of a dedicated emerging materials foundry for producing novel chip designs using unconventional materials with a quick turnaround time. With the continued scaling of transistors in silicon chips, Moore’s law has reached a phase of stagnation. To overcome this challenge, novel semiconductor materials have been used to experimentally demonstrate superior performance in ultra-scaled transistors. Despite their fascinating properties, there has been very little progress in transitioning these state-of-the-art technologies from the lab to the marketplace. As a result, there are hardly any foundries today which manufacture chips based on novel and emerging semiconductors. All this while, the growth of 2-dimensional materials on a large scale, which is crucial in mass producing transistors, has been drastically improved. This is a unique opportunity to commercialize an emerging materials semiconductor foundry at a time when the US wants to regain its leadership in semiconductor and chip manufacturing.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.
这个I-Corps项目的更广泛的影响/商业潜力是在半导体制造中使用新兴材料的进步。专用的新兴材料代工厂可以缓解芯片短缺的担忧,这种担忧对在产品中使用芯片的中小企业造成了不成比例的影响。可能有四类客户:化学、生物等领域的科学家/工程师;科学家/工程师在他们的实验室中生长纳米材料;小型/中型物联网公司;以及对将芯片与现有产品集成感兴趣的半导体封装设施。对于每一个类别,将开发一个特定应用的芯片,它将利用二维材料的某些独特特性。拟议业务的中小批量生产线将能够灵活地满足各种客户的目标需求,这些客户将不依赖于晶圆代工厂严格的流片时间表。I-Corps项目是基于开发专用新兴材料晶圆代工厂,以快速周转时间生产使用非传统材料的新型芯片设计。随着硅芯片中晶体管的不断缩小,摩尔定律已经到了停滞阶段。为了克服这一挑战,新型半导体材料已被用于实验证明超尺度晶体管的上级性能。尽管它们具有迷人的特性,但在将这些最先进的技术从实验室转移到市场方面进展甚微。因此,今天几乎没有任何代工厂生产基于新型和新兴半导体的芯片。与此同时,大规模生长二维材料,这对大规模生产晶体管至关重要,已经得到了极大的改善。这是一个独特的机会,商业化的新兴材料半导体代工厂在美国的时候,希望重新获得其领导地位的半导体和芯片制造。这个奖项反映了NSF的法定使命,并已被认为是值得支持的评估使用基金会的知识价值和更广泛的影响审查标准。

项目成果

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Saptarshi Das其他文献

Photon-assisted heat engines in the THz regime
太赫兹范围内的光子辅助热机
  • DOI:
  • 发表时间:
    2020
  • 期刊:
  • 影响因子:
    0
  • 作者:
    P. Sengupta;Saptarshi Das
  • 通讯作者:
    Saptarshi Das
Surrogate regression modelling for fast seismogram generation and detection of microseismic events in heterogeneous velocity models
用于快速地震图生成和异质速度模型中微震事件检测的替代回归模型
  • DOI:
    10.1093/gji/ggy283
  • 发表时间:
    2018
  • 期刊:
  • 影响因子:
    2.8
  • 作者:
    Saptarshi Das;Xi Chen;M. Hobson;S. Phadke;Bertwim van Beest;J. Goudswaard;D. Hohl
  • 通讯作者:
    D. Hohl
Rural energy access and inequalities : An analysis of NSS data from 1999-00 to 2009-10
农村能源获取和不平等:1999-00 至 2009-10 NSS 数据分析
  • DOI:
  • 发表时间:
    2013
  • 期刊:
  • 影响因子:
    0
  • 作者:
    Aditya Ramji;Anmol Soni;Ritika Sehjpal;Saptarshi Das;Ritu;Singh
  • 通讯作者:
    Singh
A Monolithic Stochastic Computing Architecture for Energy and Area Efficient Arithmetic
用于能源和面积高效算术的单片随机计算架构
  • DOI:
    10.21203/rs.3.rs-1196783/v1
  • 发表时间:
    2022
  • 期刊:
  • 影响因子:
    0
  • 作者:
    Harikrishnan Ravichandran;Yikai Zheng;Thomas F. Schranghamer;N. Trainor;J. Redwing;Saptarshi Das
  • 通讯作者:
    Saptarshi Das
A stochastic encoder using point defects in two-dimensional materials
一种利用二维材料中点缺陷的随机编码器
  • DOI:
    10.1038/s41467-024-54283-1
  • 发表时间:
    2024-12-04
  • 期刊:
  • 影响因子:
    15.700
  • 作者:
    Harikrishnan Ravichandran;Theresia Knobloch;Shiva Subbulakshmi Radhakrishnan;Christoph Wilhelmer;Sergei P. Stepanoff;Bernhard Stampfer;Subir Ghosh;Aaryan Oberoi;Dominic Waldhoer;Chen Chen;Joan M. Redwing;Douglas E. Wolfe;Tibor Grasser;Saptarshi Das
  • 通讯作者:
    Saptarshi Das

Saptarshi Das的其他文献

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{{ truncateString('Saptarshi Das', 18)}}的其他基金

Collaborative Research: FuSe: Indium selenides based back end of line neuromorphic accelerators
合作研究:FuSe:基于硒化铟的后端神经形态加速器
  • 批准号:
    2328741
  • 财政年份:
    2023
  • 资助金额:
    $ 5万
  • 项目类别:
    Continuing Grant
CAREER: Two-Dimensional Straintronic Field Effect Transistor
职业:二维应变电子场效应晶体管
  • 批准号:
    2042154
  • 财政年份:
    2021
  • 资助金额:
    $ 5万
  • 项目类别:
    Continuing Grant
E2CDA: Type II: 2D Electrostrictive FETs for Ultra-Low Power Circuits and Architectures
E2CDA:II 类:用于超低功耗电路和架构的 2D 电致伸缩 FET
  • 批准号:
    1640020
  • 财政年份:
    2016
  • 资助金额:
    $ 5万
  • 项目类别:
    Continuing Grant

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