Dynamic and high precision sensor positioning in large measuring ranges by means of an inverse measuring concept

在纳米到亚纳米精度的大导线范围内进行测量和定位是没有限制的技术挑战。半导体生产正面临着新的挑战，晶圆的尺寸高达700毫米，并且由于要生产的结构尺寸不断减小（目前在10纳米以下范围内）。450mm的EUV技术已经需要700mm的超精密光学反射镜，具有原子精度。第一期项目提出的带Abbe误差补偿的逆测量概念，为解决待动质量不断增长，而对定位精度要求不断提高的问题提供了可能的途径。测量镜是任何三维干涉测量或定位任务的关键部件。镜面代表了整个结构的参照系，从而决定性地决定了可实现的测量不确定度。由于这个原因，必须准确地知道镜面的实际地形，以便能够在数学上纠正它们的平面偏差。尽管近年来精密光学生产取得了巨大的发展，但对于必要的大镜面，可实现的制造公差和测量可能性仍然有限。因此，在实际测量机中需要额外的测量技术来提高逆概念的精度。为此，必须扩展逆测量概念，以便在安装情况下直接测量镜面的能力。这就提供了一种定期甚至永久确定镜面地形的方法，从而可以对其进行算术校正。通过这种方式，无论是由于机械应力，热应变还是机器内部力流的变化，都可以有效地应对地形变化未知的问题。镜面的平面度偏差在镜面扫描时由附加的测量系统记录，然后直接用于长度和角度测量值的校正。

There are no limits to the technical challenges involved in measuring and positioning in large traverse ranges with nanometer to sub-nanometer precision. Semiconductor production is facing new challenges with wafers up to 700 mm in size and due to the constantly decreasing dimensions of the structures to be produced (currently in the sub-10 nm range). Already the 450 mm EUV technology requires ø 700 mm ultra-precise mirror optics with atomic precision. The inverse measuring concept with Abbe error compensation developed in the first project period represents a possible way out of the problem of the growing masses to be moved, while the requirements for positioning accuracy are constantly increasing. The measuring mirrors are one key component in any three-dimensional interferometric measuring or positioning task. The mirror surfaces represent the reference system of the entire structure and thus decisively determine the achievable measurement uncertainty. For this reason, the actual topography of the mirror surfaces must be exactly known in order to be able to correct their flatness deviations mathematically. Although precision optics production has developed enormously in recent years, both the achievable manufacturing tolerances and the measuring possibilities are still limited for the necessary large mirror surfaces. The desired increase in accuracy of the inverse concept therefore requires additional measuring technology in the actual measuring machine. For this purpose, the inverse measuring concept has to be extended for the ability for direct measurement of the mirror surfaces in the installed situation. This provides an option for regular or even permanent determination of the mirror topography and thus its arithmetical correction. In this way, the problem of a topography changing unknown in time, whether due to mechanical stresses, thermal strains or changes in the force flow within the machine, can be effectively countered. The flatness deviations of the mirror surfaces are to be recorded by additional measuring systems during the scan of the mirror surfaces and then be used directly for the correction of the length and angle measured values.