Dynamic and high precision sensor positioning in large measuring ranges by means of an inverse measuring concept

在具有纳米到亚纳米精度的大导线范围内进行测量和定位所涉及的技术挑战是无限的。半导体生产正面临着新的挑战，晶圆尺寸高达700毫米，而且要生产的结构尺寸不断减小(目前在10纳米以下)。450 mm的EUV技术已经需要具有原子精度的700 mm超精密镜面光学元件。在第一个项目期间开发的带有阿贝误差补偿的反向测量概念代表了一种可能的方法，以解决越来越多的质量被移动的问题，同时对定位精度的要求也在不断提高。在任何三维干涉测量或定位任务中，测量镜都是一个关键部件。镜面代表整个结构的参照系，因此决定了可实现的测量不确定度。因此，必须准确地知道镜面的实际形貌，以便能够从数学上校正它们的平面度偏差。虽然精密光学生产在最近几年有了巨大的发展，但对于必要的大镜面，可达到的制造公差和测量可能性仍然有限。因此，为了提高逆概念的精确度，需要在实际测量机器中使用额外的测量技术。为此，必须扩展反向测量概念，以便能够在安装情况下直接测量镜面。这提供了一种定期或甚至永久地确定镜面地形并因此对其进行算术校正的选项。这样，无论是由于机械应力、热应变还是机器内部力流动的变化，都可以有效地解决地形在时间上未知变化的问题。在镜面扫描期间，镜面的平面度偏差将由附加测量系统记录下来，然后直接用于长度和角度测量值的校正。

There are no limits to the technical challenges involved in measuring and positioning in large traverse ranges with nanometer to sub-nanometer precision. Semiconductor production is facing new challenges with wafers up to 700 mm in size and due to the constantly decreasing dimensions of the structures to be produced (currently in the sub-10 nm range). Already the 450 mm EUV technology requires ø 700 mm ultra-precise mirror optics with atomic precision. The inverse measuring concept with Abbe error compensation developed in the first project period represents a possible way out of the problem of the growing masses to be moved, while the requirements for positioning accuracy are constantly increasing. The measuring mirrors are one key component in any three-dimensional interferometric measuring or positioning task. The mirror surfaces represent the reference system of the entire structure and thus decisively determine the achievable measurement uncertainty. For this reason, the actual topography of the mirror surfaces must be exactly known in order to be able to correct their flatness deviations mathematically. Although precision optics production has developed enormously in recent years, both the achievable manufacturing tolerances and the measuring possibilities are still limited for the necessary large mirror surfaces. The desired increase in accuracy of the inverse concept therefore requires additional measuring technology in the actual measuring machine. For this purpose, the inverse measuring concept has to be extended for the ability for direct measurement of the mirror surfaces in the installed situation. This provides an option for regular or even permanent determination of the mirror topography and thus its arithmetical correction. In this way, the problem of a topography changing unknown in time, whether due to mechanical stresses, thermal strains or changes in the force flow within the machine, can be effectively countered. The flatness deviations of the mirror surfaces are to be recorded by additional measuring systems during the scan of the mirror surfaces and then be used directly for the correction of the length and angle measured values.