Dynamic and high precision sensor positioning in large measuring ranges by means of an inverse measuring concept

在纳米到亚纳米精度的大范围测量和定位中，技术挑战是无限的。半导体生产面临着新的挑战，晶圆尺寸高达700 mm，并且由于要生产的结构尺寸不断减小（目前在10 nm以下）。450 mm EUV技术已经需要700 mm超精密镜面光学器件，具有原子级精度。在第一个项目期间开发的具有阿贝误差补偿的逆测量概念代表了解决待移动质量不断增加的问题的可能途径，而对定位精度的要求也在不断提高。测量镜是任何三维干涉测量或定位任务中的一个关键部件。镜面代表整个结构的参考系统，因此决定性地确定可实现的测量不确定度。出于这个原因，反射镜表面的实际形貌必须是精确已知的，以便能够在数学上校正它们的平面度偏差。尽管近年来精密光学器件的生产有了很大的发展，但对于所需的大镜面，可实现的制造公差和测量可能性仍然有限。因此，在实际的测量机中，逆概念的精度的期望增加需要附加的测量技术。为此，必须扩展反向测量概念，以便在安装情况下直接测量镜面。这提供了一种选择，用于定期或甚至永久地确定反射镜形貌，从而进行算术校正。以这种方式，可以有效地应对由于机械应力、热应变或机器内的力流的变化而引起的形貌随时间未知地变化的问题。镜面的平面度偏差将在镜面扫描期间由附加测量系统记录，然后直接用于长度和角度测量值的校正。

There are no limits to the technical challenges involved in measuring and positioning in large traverse ranges with nanometer to sub-nanometer precision. Semiconductor production is facing new challenges with wafers up to 700 mm in size and due to the constantly decreasing dimensions of the structures to be produced (currently in the sub-10 nm range). Already the 450 mm EUV technology requires ø 700 mm ultra-precise mirror optics with atomic precision. The inverse measuring concept with Abbe error compensation developed in the first project period represents a possible way out of the problem of the growing masses to be moved, while the requirements for positioning accuracy are constantly increasing. The measuring mirrors are one key component in any three-dimensional interferometric measuring or positioning task. The mirror surfaces represent the reference system of the entire structure and thus decisively determine the achievable measurement uncertainty. For this reason, the actual topography of the mirror surfaces must be exactly known in order to be able to correct their flatness deviations mathematically. Although precision optics production has developed enormously in recent years, both the achievable manufacturing tolerances and the measuring possibilities are still limited for the necessary large mirror surfaces. The desired increase in accuracy of the inverse concept therefore requires additional measuring technology in the actual measuring machine. For this purpose, the inverse measuring concept has to be extended for the ability for direct measurement of the mirror surfaces in the installed situation. This provides an option for regular or even permanent determination of the mirror topography and thus its arithmetical correction. In this way, the problem of a topography changing unknown in time, whether due to mechanical stresses, thermal strains or changes in the force flow within the machine, can be effectively countered. The flatness deviations of the mirror surfaces are to be recorded by additional measuring systems during the scan of the mirror surfaces and then be used directly for the correction of the length and angle measured values.