Interfaces between ionic liquids and low temperature plasmas - A novel type of fluid/fluid interface

离子液体在电化学过程中形成了一组非常有趣的溶剂--主要是因为它们的高导电性、它们的电化学稳定性以及它们溶解各种化合物的能力。此外，种类繁多的离子液体为不同的电化学应用提供了量身定制的解决方案的前景。大多数电化学过程的关键元素是电解液(离子液体)和电子传导电极材料(通常是金属)之间的界面。界面的性质(形态、双层结构和容量、电极动力学)通常对过程的结果起决定性作用。在我们的项目中，我们计划系统地探索和研究离子液体和低温等离子体(气体放电)之间的界面，这是离子液体化学和电化学中的一个新体系。根据这一总体目标，我们计划从热力学和动力学的角度来研究和理解这种特殊的流体/流体界面。离子液体/等离子体界面的阴极金属沉积过程将作为模型过程来研究，以探索离子液体和邻近等离子体所确定的参数对界面性质的影响。将离子液体在自由界面向等离子体沉积金属的特性与在固体电极上的常规阴极沉积和在液/液界面的非常规沉积的特性进行比较。

Ionic liquids form a highly interesting group of solvents for electrochemical processes - mainly due to the combination of their high electrical conductivity, their electrochemical stability and their ability to dissolve a wide range of compounds. In addition, the large variety of ionic liquids offers the prospect of tailor-made solutions for different electrochemical applications. The crucial element of most electrochemical processes is the interface between the electrolyte (the ionic liquid) and an electron-conducting electrode material (usually a metal). The properties of the interface (morphology, double layer structure and capacity, electrode kinetics) are usually decisive for the results of the process. In our project we propose to explore and study systematically the interface between ionic liquids and low temperature plasmas (gas discharges) as a new system both in the chemistry of ionic liquids and in electrochemistry. In line with this general aim we plan to investigate and to understand this specific fluid/fluid interface both from the thermodynamic and the kinetic point of view. The cathodic metal deposition at the ionic liquid/plasma interface will be studied as a model process in order to probe the interfacial properties as a function of the parameters determined by the ionic liquid and the neighbouring plasma. The characteristics of the metal deposition at the free interface of the ionic liquid towards the plasma will be compared with the characteristics of conventional cathodic deposition at solid electrodes and less conventional deposition at liquid/liquid interfaces.