Effect of Chemo-Mechanical Grinding on Surface Integrity of Single Crystal Silicon Substrates

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Silicon substrates or wafers are extensively used in electronic and optic/photonic industries. A long-time standing problem in silicon wafer machining is the surface and subsurface damage induced by machining. This may significantly affect the mechanical, optical and electronic characteristics of wafer-based components. The issue becomes increasingly more critical as the application of silicon wafers is extending further as structural components. The research outcomes will contribute an improved understanding of Chemo Mechanical Grinding process and help to develop innovative technologies for silicon industries.