Ductile grinding mechanism and technology of brittle single crystals

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This project aims to develop a fundamental understanding of the removal mechanics of emerging brittle single crystals under grinding-induced loading. A successful outcome will not only develop a new theoretical model for predicting the ductile removal regime of this class of difficult-to-machine materials, but their cost-effective ductile grinding processes will also be generated. It will address a longstanding bottleneck productivity issue in advanced manufacturing. The breakthrough technology developed in the project is expected to significantly benefit a number of industrial sectors for the fabrication of more affordable high-performance devices including mobile phones, light-emitting diodes, solar cells, sensors, and laser systems.