Ductile grinding mechanism and technology of brittle single crystals

本项目旨在对磨削诱导载荷下新出现的脆性单晶的去除机理有一个基本的了解。一个成功的结果不仅将为预测这类难加工材料的延性去除过程开发一个新的理论模型，而且还将产生成本效益高的延性磨削工艺。它将解决先进制造业中一个长期存在的瓶颈生产率问题。该项目开发的突破性技术预计将使许多工业部门在制造更实惠的高性能设备方面显著受益，包括手机、发光二极管、太阳能电池、传感器和激光系统。

This project aims to develop a fundamental understanding of the removal mechanics of emerging brittle single crystals under grinding-induced loading. A successful outcome will not only develop a new theoretical model for predicting the ductile removal regime of this class of difficult-to-machine materials, but their cost-effective ductile grinding processes will also be generated. It will address a longstanding bottleneck productivity issue in advanced manufacturing. The breakthrough technology developed in the project is expected to significantly benefit a number of industrial sectors for the fabrication of more affordable high-performance devices including mobile phones, light-emitting diodes, solar cells, sensors, and laser systems.