A new lapping process for difficult-to-machine brittle materials

难加工脆性材料的新研磨工艺

• 批准号: DP210102061
• 负责人: Prof Han Huang
• 金额: $ 27.43万
• 依托单位: The University of Queensland
• 依托单位国家: 澳大利亚
• 项目类别: Discovery Projects
• 财政年份: 2021
• 资助国家: 澳大利亚
• 起止时间: 2021-11-01 至 2024-10-31
• 项目状态: 已结题
• 来源: https://dataportal.arc.gov.au/RGS/Web/Grants/DP210102061
• 关键词: new; lapping; process; difficult; machine

This project aims to address a timely bottleneck issue in the conventional lapping of difficult-to-machine optoelectronic brittle materials. An innovative chemically enhanced lapping technology for fabricating such materials is expected to reduce machined subsurface damage. This is significant because it would shorten the subsequent finishing process and minimise the manufacturing cost. Intended outcomes from this project also include an advanced machining theory and innovations in material removal characterisation. This breakthrough technology should benefit the design and fabrication of high performance electronic devices for energy, medicine and communication sectors with considerable impact on the Australian economy.

本计画旨在解决传统研磨加工难加工光电脆性材料的瓶颈问题。一种创新的化学增强研磨技术，用于制造这种材料，预计将减少加工亚表面损伤。这是重要的，因为它将缩短随后的精加工过程并使制造成本最小化。该项目的预期成果还包括先进的加工理论和材料去除特性的创新。这一突破性技术将有利于能源、医药和通信领域高性能电子设备的设计和制造，对澳大利亚经济产生重大影响。