A new lapping process for difficult-to-machine brittle materials

本项目旨在及时解决难以加工的光电脆性材料常规研磨中的瓶颈问题。一种用于制造此类材料的创新化学强化研磨技术有望减少机械加工的亚表面损伤。这很重要，因为它将缩短后续的精加工过程，并最大限度地降低制造成本。该项目的预期成果还包括先进的加工理论和材料去除表征的创新。这项突破性技术将有利于能源、医药和通信领域高性能电子设备的设计和制造，对澳大利亚经济产生重大影响。

This project aims to address a timely bottleneck issue in the conventional lapping of difficult-to-machine optoelectronic brittle materials. An innovative chemically enhanced lapping technology for fabricating such materials is expected to reduce machined subsurface damage. This is significant because it would shorten the subsequent finishing process and minimise the manufacturing cost. Intended outcomes from this project also include an advanced machining theory and innovations in material removal characterisation. This breakthrough technology should benefit the design and fabrication of high performance electronic devices for energy, medicine and communication sectors with considerable impact on the Australian economy.