A new lapping process for difficult-to-machine brittle materials

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This project aims to address a timely bottleneck issue in the conventional lapping of difficult-to-machine optoelectronic brittle materials. An innovative chemically enhanced lapping technology for fabricating such materials is expected to reduce machined subsurface damage. This is significant because it would shorten the subsequent finishing process and minimise the manufacturing cost. Intended outcomes from this project also include an advanced machining theory and innovations in material removal characterisation. This breakthrough technology should benefit the design and fabrication of high performance electronic devices for energy, medicine and communication sectors with considerable impact on the Australian economy.