Hybrid Simulation of Electromagnetic Field Interaction with Metallic Structures Showing Massive Nonlinear Loading
电磁场与金属结构相互作用的混合仿真显示大量非线性载荷
基本信息
- 批准号:357752756
- 负责人:
- 金额:--
- 依托单位:
- 依托单位国家:德国
- 项目类别:Research Grants
- 财政年份:2017
- 资助国家:德国
- 起止时间:2016-12-31 至 2020-12-31
- 项目状态:已结题
- 来源:
- 关键词:
项目摘要
The proposed project aims to contribute scientifically at the intersection of three different research areas: (1) the physics of electromagnetic field interaction with nonlinearly loaded, electrically large structures and surfaces, (2) novel engineering applications for such structures and surfaces, and (3) efficient and stable numerical modeling and simulation of such structures and surfaces. The massive loading of metallic structures, i.e. the connection of several hundreds of nonlinear loads over an electrically large area, has been of high interest in the recent past and poses new challenges and opportunities for fundamental research. Examples and applications that are foreseen or already looked at for these kind of structures and surfaces include energy-selective shielding, waveform-dependent absorption, self-focusing of surface waves, RF limiters, subwavelength imaging, nonlinear radar and switching, and time-domain windowing among others. Due to this high interest it is very likely that there will be an increasing demand for efficient and validated numerical methods for design and optimization of nonlinearly loaded structures and surfaces in the near future. Based on previous work of the groups of Prof. Schuster at Hamburg University of Technology (TUHH) and the group of Prof. Grivet-Talocia at Politecnico di Torino (POLITO) it is proposed to generate a novel hybrid simulation technique addressing this need. The technique will use the integral equation based Method of Moments (MoM) for characterization of the linear part (i.e. the metallic structures and surfaces) of the problem and a combination of Model Order Reduction (MOR) and Waveform Relaxation (WR) for dealing with the complete system including many nonlinear loads. The research challenge lies in the suitable combination and adaption of these well-known methods (MoM, MOR, WR) for meeting the demands on accuracy, stability, and efficiency of the numerical simulation of massively nonlinearly loaded (i.e. 1000 and more nonlinear loads), electrically large structures and surfaces.
提出的项目旨在在三个不同研究领域的交叉领域做出科学贡献:(1)电磁场与非线性载荷,电大型结构和表面相互作用的物理学,(2)此类结构和表面的新工程应用,以及(3)此类结构和表面的高效和稳定的数值模拟和模拟。金属结构的巨大载荷,即数百个非线性载荷在电大面积上的连接,近年来一直受到高度关注,并为基础研究带来了新的挑战和机遇。这些结构和表面的可预见的或已经研究的例子和应用包括能量选择屏蔽、波形依赖吸收、表面波的自聚焦、射频限制器、亚波长成像、非线性雷达和开关以及时域窗口等。由于这种高度的兴趣,很可能在不久的将来,对非线性加载结构和表面设计和优化的有效和经过验证的数值方法的需求将越来越大。基于汉堡工业大学(TUHH)的Schuster教授小组和都灵理工大学(POLITO)的Grivet-Talocia教授小组的先前工作,提出了一种新的混合模拟技术来满足这一需求。该技术将使用基于积分方程的矩量法(MoM)来表征问题的线性部分(即金属结构和表面),并结合模型阶降(MOR)和波形松弛(WR)来处理包含许多非线性载荷的完整系统。研究的挑战在于如何将这些众所周知的方法(MoM、MOR、WR)进行适当的组合和适应,以满足大规模非线性载荷(即1000及以上非线性载荷)、电大结构和表面的数值模拟对精度、稳定性和效率的要求。
项目成果
期刊论文数量(3)
专著数量(0)
科研奖励数量(0)
会议论文数量(0)
专利数量(0)
A Macromodeling-Based Hybrid Method for the Computation of Transient Electromagnetic Fields Scattered by Nonlinearly Loaded Metal Structures
- DOI:10.1109/temc.2020.2991455
- 发表时间:2020-07
- 期刊:
- 影响因子:2.1
- 作者:T. Wendt;Cheng Yang;Heinz D. Brüns;S. Grivet-Talocia;C. Schuster
- 通讯作者:T. Wendt;Cheng Yang;Heinz D. Brüns;S. Grivet-Talocia;C. Schuster
A Multistage Adaptive Sampling Scheme for Passivity Characterization of Large-Scale Macromodels
- DOI:10.1109/tcpmt.2021.3056746
- 发表时间:2020-11
- 期刊:
- 影响因子:0
- 作者:M. De Stefano;S. Grivet-Talocia;T. Wendt;Cheng Yang;C. Schuster
- 通讯作者:M. De Stefano;S. Grivet-Talocia;T. Wendt;Cheng Yang;C. Schuster
Numerical Complexity Study of Solving Hybrid Multiport Field-Circuit Problems for Diode Grids
解决二极管栅极混合多端口场电路问题的数值复杂性研究
- DOI:10.1109/iceaa.2019.8879021
- 发表时间:2019
- 期刊:
- 影响因子:0
- 作者:T. Wendt;C. Yang;C. Schuster;S. Grivet-Talocia
- 通讯作者:S. Grivet-Talocia
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Professor Dr. Christian Schuster其他文献
Professor Dr. Christian Schuster的其他文献
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{{ truncateString('Professor Dr. Christian Schuster', 18)}}的其他基金
Entwurf von passiven Hochfrequenzkomponenten in Mehrlagensubstraten mit Hilfe von funktionalen Vias
使用功能通孔的多层基板中的无源高频元件设计
- 批准号:
181145560 - 财政年份:2010
- 资助金额:
-- - 项目类别:
Research Grants
Via-Arrays in Multilayer Substrates for Usage in High-Speed, Energy- and Resource-Efficient Digital Systems
多层基板中的通孔阵列,用于高速、节能和资源高效的数字系统
- 批准号:
146128452 - 财政年份:2010
- 资助金额:
-- - 项目类别:
Research Grants
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