Development of ultrasonic hot press method for high-performance organic devices

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A novel printing process using ultrasonic welding technique has been developed in this research work. Organic semiconductor materials were placed between two plastic films with transistor electrodes, and ultrasonic vibration was applied on the sample. Instantaneous and local heating generated by the ultrasonic welding equipment make the semiconductor material melt. As a result, organic thin film transistors were fabricated between the flexible films. The proposed ultrasonic welding technique is solvent-free process and green technology compared with other printing processes. This method is applicable to low heat resistant plastic materials as a substrate film.