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電子パッケージ薄膜配線のヒロック形成予測と短絡故障強度評価法への展開

电子封装薄膜布线中小丘形成的预测及短路失效强度评估方法的开发

基本信息

批准号：
12750063
负责人：
笹川和彦
金额：
$ 1.79万
依托单位：
Hirosaki University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Encouragement of Young Scientists (A)
财政年份：
2000
资助国家：
日本
起止时间：
2000 至 2001
项目状态：
已结题

项目摘要

本年度は以下の研究を実施し,本研究の目的を達成した。1.短絡故障過程の数値シミュレーション手法の開発短絡故障は,配線-配線間絶縁物の界面はく離,それに続く絶縁物の破壊を伴ったヒロックの成長,結合により生じる。本シミュレーション手法の開発にあたっては,故障過程の第1段階である配線-絶縁物間の界面はく離の時点を短絡故障と定義した。絶縁膜で被覆された多結晶配線における配線-絶縁物間の界面はく離の数値シミュレーション手法を,エレクトロマイグレーション損傷の支配パラメータを用いて開発した。この手法は,配線内部応力分布の経時変化をシミュレートすると共に応力と配線-絶縁物間の界面強度との対応を考慮して,ヒロック形成による絶縁物のはく離に至るまでの時間およびはく離箇所を予測することにより,短絡故障強度の評価を行うものである。また,このシミュレーションを加速通電試験に適用することにより,配線-絶縁物間の界面強度を反映した物性値を導出する方法についても開発した。さらに以上の研究の成功を踏まえ,配線-絶縁物間の界面はく離までのシミュレーション手法をその後に起こるボイドの形成・成長による断線過程のシミュレーションにまで拡張し,絶縁膜で被覆された多結晶配線の断線故障に対する強度評価法についても開発を行った。2.本評価法の実験検証厚さの異なる絶縁膜を表面に有するアルミ多結晶配線を対象として,配線が断線に至るまで通電実験を行った。絶縁物のはく離に達するまでの時間(潜伏期間)と断線時間および断線箇所に関する実験結果を本法に基づいた評価結果と比較したところ,潜伏期間および配線寿命さらに断線箇所のいずれにおいても良好な一致を示し,本強度評価法の有効性を検証した。

This year, the following research has been carried out, and the objectives of this research have been achieved. 1. The number of short-circuit fault process is determined by the method of opening short-circuit fault, the interface of insulation between distribution lines is separated, and the breakdown of insulation is accompanied by the growth of short-circuit fault, and the combination is generated. During the development of this method, the first stage of the fault process is the point at which the interface between the distribution line and the insulation is separated to shorten the network fault and define it. The interface between the insulating film and the polycrystal alignment line is divided into two parts: the first part is divided into three parts: the first part is divided into three parts: the first part is divided into four parts: the second part is divided into three parts: the first part is divided into four parts: the first part is divided into three parts: the first part is divided into four parts: the second part is divided into four parts: the first part is divided into four parts: the second part is divided into four parts: the first part is divided into four parts: the first part is divided into four parts: the second part is divided into four parts: the first part is divided into four parts: the second part is divided into four parts: the third part is divided into four This method is to consider the time of distribution of internal force of distribution line and the interface strength between distribution line and insulation material. The method for deriving the strength of the interface between the conductor and the insulator is described in detail below. In addition, the success of the above research has led to the development of the interface between the conductor and the insulator after the formation and growth of the conductor, and the development of the strength evaluation method for the conductor failure of the conductor coated with the polycrystalline conductor. 2. This evaluation method has been used to verify that there is a difference in thickness between the insulating film and the surface, and that there is a difference between the polycrystalline line and the line. The time (latency) of the object to be separated, the time of the line to be disconnected, and the time of the line to be disconnected are the basic evaluation results of this method. The comparison results show that the latency and the life of the line to be disconnected are good and consistent, and the effectiveness of this intensity evaluation method is verified.