Grinding behavior of sintered metal diamond grinding wheels with chemically bonded abrasive grains

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The properties of sintered metallic bonded diamond grinding wheels are dependent on the cutting properties of the components, on the bonding system and the process parameters in the production of the grinding wheels. The components of the bonding system, in addition to the properties, such as the hardness, the thermal conductivity and the density of the grinding wheel, significantly influence the integration of the cutting material into the bonding matrix. The totality of these properties determines the grinding behavior of the grinding tool. The chemical adhesion of the abrasive grains in the bonding matrix and their influence on the grinding behavior of sintered metal grinding wheels has not been investigated in detail so far. The aim of this research project is therefore to understand the relationships between the characterization of the chemical adhesion between the abrasive grain and the bonding matrix, the resulting grinding layer properties and the grinding behavior of sintered metal diamond grinding wheels and to describe them by means of characteristic values.