Aluminum-copper bond wires for power electronic modules
Aluminum-copper bond wires for power electronic modules
批准号:
440974394
负责人:
Privatdozent Dr.-Ing. Sören Müller
金额:
$0.0万
依托单位国家:
德国
项目类别:
Research Grants (Transfer Project)
财政年份:
--
资助国家:
德国
项目状态:
未结题
起止时间:
中文摘要
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英文摘要
The described research project is dealing with the development of a suitable process chain for the production of aluminum-copper bond wire. Furthermore, the produced compound wires will be characterized regarding their mechanical and electrical properties as well as their bonding behavior. After the successful development the Al/Cu compound wires will be implemented in a demonstrator setup for the serial production of power electronic modules.
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依托单位:
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依托单位:
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