Fabrication of nano-devices of self-assembled semiconductor nano-particles based on DNA template

我们研究了以固定在衬底上的拉伸DNA为模板，通过化学镀法制备纳米金属线。将阳离子两亲分子(二甲基二十六烷基铵，2C&lt；16&gt；N2C_1)分散在掺有荧光探针的Lambda DNA-Tris缓冲溶液上。YOYO-1和过量的铂化合物(不包括顺式二氨基氯铂)。在空气-水界面形成多离子络合物单分子膜后，在亚相中加入二甲胺硼烷还原铂化合物，以催化化学沉积金属银。用垂直提升法将单层膜以5mN/m的速度压缩后转移到玻璃基片上，荧光显微镜观察证实DNA在基片上沿浸渍方向拉伸排列。将基板浸泡在化学镀银溶液中，在基板上沉积金属银。金属化过程后的AEM观察表明，在衬底上形成了约50 mm高、50~100 mm宽的细线。电导性原子力显微镜测得的电流图谱表明，在所获得的线结构上观察到了电流。

We have studied the fabrication of nano metal wires by the electroless plating of stretched DNA immobilized on a substrate as a template. A cationic amphiphile (dimethyldihexadecylammonium, 2C_<16>N2C_1) monolayer was spread on a Lambda DNA-Tris buffer solution mixed with fluorescence probe. YOYO-1 and excess platinum compounds (ex.cis-diamminedichloroplatinum). After the formation of a polyion complex monolayer at the air-water interface, dimethylammine borane was added to the subphase to reduce the platinum compound for catalyzing the electroless deposition of silver metal. The monolayer was compressed at 5mN/m and transferred on a glass substrate by the vertical lifting method It was confirmed that DNA was stretched and aligned along the dipping direction on the substrate by fluorescence microscopy. The substrate was immersed in a silver electroless plating solution to deposit silver metal on the substrate. AEM observation after the metallization procedure showed that thin lines (ca.50mm height and 50〜100mm width) were fabricated on the substrate. Electrical current mapping obtained by conductive AFM indicated that electric current was observed on the obtained line structure.