Fabrication of nano-devices of self-assembled semiconductor nano-particles based on DNA template

我们研究了通过化学镀将拉伸的DNA固定在基底上作为模板来制备纳米金属线。将阳离子两亲分子二甲基双十六烷基铵（2CN_2C_1<16>）单分子膜铺展在与荧光探针混合的Lambda DNA-Tris缓冲液中。YOYO-1和过量铂化合物（例如顺式二氨二氯铂）。在空气-水界面形成聚离子络合物单层后，向亚相中加入二甲氨硼烷以还原铂化合物用于催化银金属的无电沉积。以5 mN/m的压力将单分子层压到玻璃基底上，用垂直提拉法将单分子层转移到玻璃基底上，荧光显微镜观察证实DNA在基底上沿浸渍方向沿着拉伸排列。将基板浸入银化学镀溶液中以在基板上存款银金属。金属化过程后的AEM观察表明，在衬底上制造了细线（约50 mm高和50 mm宽）。通过导电AFM获得的电流映射表明，在所获得的线结构上观察到电流。

We have studied the fabrication of nano metal wires by the electroless plating of stretched DNA immobilized on a substrate as a template. A cationic amphiphile (dimethyldihexadecylammonium, 2C_<16>N2C_1) monolayer was spread on a Lambda DNA-Tris buffer solution mixed with fluorescence probe. YOYO-1 and excess platinum compounds (ex.cis-diamminedichloroplatinum). After the formation of a polyion complex monolayer at the air-water interface, dimethylammine borane was added to the subphase to reduce the platinum compound for catalyzing the electroless deposition of silver metal. The monolayer was compressed at 5mN/m and transferred on a glass substrate by the vertical lifting method It was confirmed that DNA was stretched and aligned along the dipping direction on the substrate by fluorescence microscopy. The substrate was immersed in a silver electroless plating solution to deposit silver metal on the substrate. AEM observation after the metallization procedure showed that thin lines (ca.50mm height and 50〜100mm width) were fabricated on the substrate. Electrical current mapping obtained by conductive AFM indicated that electric current was observed on the obtained line structure.