DEVELOPMENT OF POWDER JET PROCESSING METHOD AND A MECHANISM CHANGE IN PROCESSES OF MATERIAL REMOVAL AND POWDER DEPOSITION

粉末喷射加工方法的开发及材料去除和粉末沉积过程的机理改变

• 批准号: 13450051
• 负责人: KURIYAGAWA Tsunemoto
• 金额: $ 9.6万
• 依托单位: TOHOKU UNIVERSITY
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for Scientific Research (B)
• 财政年份: 2001
• 资助国家: 日本
• 起止时间: 2001 至 2002
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-13450051/
• 关键词: ABRASIVE JET MACHINING.; MICRO-PARTICLE.; POWDER JET.; DEPOSITION ON PROCESS.; MATERIAL REMOVAL.; MULTI-FEEDER.; FILM DEPOSITION; 傾斜組成

Much attention has been paid to a development of micro-sensors and micro-actuators on the order of sub-millimeter size (around 0.01-1mm), which are necessary for micro electrical/mechanical system (MEMS) such as a micro-machine. In this study, we developed a powder jet process, which is one of applications of abrasive jet machining. In this process, micro-particles ( φ 0.1-several μm), which are accelerated by a carrier gas, impinge with a high velocity and accumulate onto a substrate under vacuum or atmospheric condition, and forms thick film. Though the deposition rate is large enough to manufacture a functional structure of sub-millimeter size, there are problems that the deposition rate and mixture ratio, which are related to form accuracy and a density of the structure, are unstable. This is because a mixing and blasting mechanism of carrier gas and micro-particle is inadequate. Last year, we have developed the powder jet device that can blast micro-particles quantitatively and in … More termittently under vacuum condition, and experimented with the device. However, because there are various limitations under vacuum condition, taking practical use into consideration, powder deposition under atmospheric condition is more useful than under vacuum condition. Thus, a possibility of a powder deposition under atmospheric condition was confirmed. Next, we investigated a transition diameter of a particle, at which the mechanism changes from a material removal to a deposition. Furthermore, influences of blasting conditions such as blasting velocity and pressure, and matrials of powers and workpiece material on adhesive strength of formed thick film were investigated. The results of the experiments show that the transition diameter of particle is about 2.0μm and a smaller particle shows an adhesion phenomena when blasting alumina or silicon carbide particles to glass or silicon substrate under atmospheric pressure. And deposition height became stationary after several seconds and reached 20-120μm in thickness. And it becomes clear that kinetic energy of blasted particles and hardness of a substrate workpiece have a large influence on adhesive characteristics. In addition, we suggest a new evaluation method of mechanical properties of the film from a difference of micro-hardness and dynamic hardness values. In this method, the hardness of the formed film on a silicon substrate is bigger than on a glass. Furthermore, it is confirmed that electronic industry materials, such as PZT or ferrite, can be deposited under atmospheric pressure. Less

亚毫米级（0.01- 1 mm）的微传感器和微致动器的发展受到了极大的关注，这对于诸如微机械的微电子/机械系统（MEMS）是必需的。在本研究中，我们开发了一种粉末喷射工艺，这是磨料喷射加工的应用之一。在此过程中，微粒子（φ 0.1-几μm），这是由载气加速，以高速撞击，并在真空或大气条件下积累到基板上，并形成厚膜。虽然沉积速率大到足以制造亚毫米尺寸的功能结构，但是存在与结构的形状精度和密度相关的沉积速率和混合比不稳定的问题。这是因为载气和微粒的混合和喷射机制不充分。去年，我们开发了粉末喷射装置，可以定量喷射微粒， ...更多信息 在真空条件下间歇性放电，并进行了实验。然而，由于真空条件下存在各种限制，考虑到实际应用，大气条件下的粉末沉积比真空条件下更有用。因此，确认了在大气条件下粉末沉积的可能性。接下来，我们研究了颗粒的过渡直径，在该过渡直径处，机制从材料去除变为沉积。此外，还研究了喷砂速度、喷砂压力、粉末材料和工件材料等喷砂条件对厚膜结合强度的影响。实验结果表明，在大气压下将氧化铝或碳化硅颗粒喷到玻璃或硅基片上时，颗粒的过渡直径约为2.0μm，较小的颗粒表现出粘附现象。沉积高度在几秒钟后趋于稳定，厚度达到20-120μm。并且很明显，喷砂颗粒的动能和基底工件的硬度对粘合剂特性有很大的影响。此外，我们提出了一种新的评价方法的机械性能的薄膜的显微硬度和动态硬度值的差异。在该方法中，在硅衬底上形成的膜的硬度大于在玻璃上形成的膜的硬度。此外，证实了电子工业材料，如PZT或铁氧体，可以在常压下沉积。少

项目成果

厨川常元, 成田歩, 庄司克雄, 安富裕也: "アブレイシブジェット加工に関する研究(除去加工から付着加工へ)"2003年精密工学会春季大会学術講演会講演論文集. 83 (2003)

Tsunemoto Kuriyakawa、Ayumu Narita、Katsuo Shoji、Yasutoya Yasu：“磨料喷射加工的研究（从去除加工到粘附加工）”2003年日本精密工程学会春季会议论文集，83（2003）

成田歩, 厨川常元, 庄司克雄: "真空中におけるマルチフィーダー式パウダージェット加工装置の開発"2002年砥粒加工学会学術講演会講演論文集. 発表予定. (2002)

Ayumu Narita、Tsunemoto Kuriyakawa、Katsuo Shoji：“真空中多进料器型粉末喷射加工设备的开发”磨料加工学会 2002 年学术会议论文集（2002 年）。

M.Ito et al.: "Micro-fabrication utilizing abrasive jet machining"Proc. of JSME. H64. (2002)

M.Ito 等人：“利用磨料喷射加工的微制造”Proc。

伊藤元, 斎藤崇, 飯坂順一, 厨川常元, 庄司克雄: "アブレイシブジェット加工による微細加工"日本機械学会2002年度部門講演会講演論文集. H64 (2002)

Hajime Ito、Takashi Saito、Junichi Iizaka、Tsunemoto Kuriyakawa、Katsuo Shoji：“磨料喷射加工的微机械加工”日本机械工程师学会 2002 年分会会议记录 H64 (2002)。

Tsunemoto Kuriyagawa: "MicroNeso Mechanical Manufacturing using Abrasive jet Technique"Proc. of JSAT. A21. (2002)

Tsunemoto Kuriyakawa：“使用磨料射流技术的 MicroNeso 机械制造”Proc。