Electrostatic manipulation of a micro-object by controlling applied voltage

本项目旨在建立一种高可靠性的静电微操作技术。为此，从理论上推导出了最优电压的时间依赖函数，并通过静电微操作手的实验验证了其有效性。确定了电压函数，使得微小物体从探头尖端脱离后，在飞行过程中可以控制动能，并在降落在衬底上时动能为零。此外，由于由于粘着滞后而吸收的能量存在于微物体与衬底的接触处，因此估算了能量吸收的电压允许误差。为了实现推导出的电压功能，设计了一种高电压、高响应速度的电源。利用该电源，在静电微操纵实验中，成功地将直径为30um的焊球从探针尖端剥离后沉积在基板上。这些结果从理论上和实验上证明了该方法可以应用于IC封装或微器件组装。

This project had aimed at establishing a technique of electrostatic micro-manipulation with high reliability. For that purpose, an optimal voltage as a time-dependent function was theoretically derived ; the effectiveness was demonstrated through the experiment by electrostatic micro-manipulator. The voltage function was determined so that the kinetic energy of a micro-object could be controlled during the flight after detachment from a probe-tip and become zero at landing on a substrate. Additionally, since the energy absorbed due to the adhesional hysteresis exists at the contact of the micro-object to the substrate, an allowable error of voltage for the energy absorption was evaluated. In order to realize the derived voltage function, a power source with high voltage and high-speed response was designed. With this power source, a solder ball with the diameter of 30 um was successfully deposited on the substrate after detachment from the probe-tip in the experiment of electrostatic micro-manipulation. These results theoretically and experimentally proved that this method can be applied to IC packaging or micro-device assembly.