High Resolution Thermal Imaging System For Thermal Design, Validation, and Failure Analysis of High Performance Digital and Radio Frequency Integrated Circuits

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The growing complexity and continued emphasis on multi-functionality and speed in today's integrated circuits (IC) has led to exponentially increased transistor counts and shrinking device geometries. Consequently, power dissipation is rapidly increasing, leading to higher heat fluxes, higher temperatures and larger temperature gradients. Critically, power dissipation levels in high-performance digital and radio-frequency (RF) ICs are approaching the cooling limit. Such a "thermal crisis" imposes significant challenges on IC performance, reliability, cost and portability. Hence, the design of high performance ICs needs to shift from electric-centric to electro-thermal design processes where the thermal aspects are considered at an early stage of the design to ensure the anticipated performance and reliability.