High Resolution Thermal Imaging System For Thermal Design, Validation, and Failure Analysis of High Performance Digital and Radio Frequency Integrated Circuits

用于高性能数字和射频集成电路热设计、验证和故障分析的高分辨率热成像系统

• 批准号: 472585-2015
• 负责人: Wei, Lan
• 金额: $ 10.93万
• 依托单位: University of Waterloo
• 依托单位国家: 加拿大
• 项目类别: Research Tools and Instruments - Category 1 (<$150,000)
• 财政年份: 2014
• 资助国家: 加拿大
• 起止时间: 2014-01-01 至 2015-12-31
• 项目状态: 已结题
• 来源: https://www.nserc-crsng.gc.ca/ase-oro/Details-Detailles_eng.asp?id=564786
• 关键词: Resolution; Thermal; Imaging; System; Design

The growing complexity and continued emphasis on multi-functionality and speed in today's integrated circuits (IC) has led to exponentially increased transistor counts and shrinking device geometries. Consequently, power dissipation is rapidly increasing, leading to higher heat fluxes, higher temperatures and larger temperature gradients. Critically, power dissipation levels in high-performance digital and radio-frequency (RF) ICs are approaching the cooling limit. Such a "thermal crisis" imposes significant challenges on IC performance, reliability, cost and portability. Hence, the design of high performance ICs needs to shift from electric-centric to electro-thermal design processes where the thermal aspects are considered at an early stage of the design to ensure the anticipated performance and reliability.

当今集成电路（IC）中日益增长的复杂性以及对多功能性和速度的持续强调已经导致晶体管数量呈指数级增长并且器件几何尺寸缩小。因此，功耗迅速增加，导致更高的热通量、更高的温度和更大的温度梯度。关键是，高性能数字和射频（RF）IC的功耗水平正在接近冷却极限。这种“热危机”对IC的性能、可靠性、成本和便携性提出了重大挑战。因此，高性能IC的设计需要从以电为中心的设计过程转变为电热设计过程，其中在设计的早期阶段考虑热方面，以确保预期的性能和可靠性。