Development of heat dissipation system for electronic devices using flow boiling heat transfer

利用流动沸腾传热的电子设备散热系统的开发

基本信息

批准号：
17560167
负责人：
KAMINAGA Fumito
金额：
$ 2.18万
依托单位：
Ibaraki University
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
2005
资助国家：
日本
起止时间：
2005 至 2006
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/en/grant/KAKENHI-PROJECT-17560167/
关键词：
Boiling Electronic device heat dissipation Heat transfer Enhancement Narrow channel

项目摘要

The purpose of this study is to obtain fundamental knowledge how to make use of flow boiling heat transfer to develop innovated heat dissipation system for high heat loaded electronic devices. This study was performed under conditions of narrow working flow path and low flow rate which are encountered in practical cases and used water as a working fluid to meet requirements of high source power and environmental issues. In the study pressure drop, heat transfer coefficient, and maximum heat flux which are important design factors are experimentally examined.Two types of studies were performed. One was to propose correlations for pressure drop and heat transfer coefficient in terms of experimental data in a fine circular tube previously obtained in our laboratory. The other was an experimental investigation about heat transfer and pressure drop in narrow rectangular channels, 1.0 and 1.5 mm gap and 20 mm width and 80 mm length (40 mm heated length).From the first study, the pressure dro … More p and boiling heat transfer coefficient in a fine circular tube could be predicted by correlations developed in a normal size tube by taking additional account of large effect of vapor flow. In the second study, experiments were performed to measure pressure drop, heat transfer coefficient, and maximum heat flux at mass flux of 16 to 76 kg/m^2s. The major findings of the experiments are as follows. Smaller gap size, than 1.0 mm was suggested since the maximum pressure drop as much as 500 Pa and then the pressure drop is much lower than the circular tube. However, the fluctuation of the pressure drop is much larger than that in the tube. The heat transfer coefficients are similar between the tube and the channel in the relationship between heat flux and wall superheat, but the relationship in the rectangular channel between the coefficient and local quality is different form that in the circular tube. The correlation developed for circular tubes highly overpredicted the maximum heat flux and the correlation developed by using data of rectangular channels give much better prediction. The liquid phase distribution in the cross section of the channel significantly affects the heat transfer coefficient and maximum heat flux. Less

这项研究的目的是获得基本知识，如何利用流量沸腾的传热来开发用于高热量电子设备的创新散热系统。这项研究是在狭窄的工作流道路和低流量的条件下进行的，这些条件在实际情况下遇到，并将水作为工作流体，以满足高源功能和环境问题的要求。在研究压力下降中，进行了最大的热量，这是重要的设计因素。进行了两种类型的研究。一种是在我们实验室先前获得的细胞中，就实验数据中提出了压降和传热系数的相关性。另一个是针对狭窄的矩形通道中的传热和压降的实验投资，1.0和1.5 mm的间隙和20 mm的宽度和80 mm的长度和80 mm的长度（40 mm加热长度）。从第一个研究，更大的PRO…PRO…更多的P和沸腾的传热系数可以通过正常尺寸的相关性来预测，在正常尺寸的范围内开发出较大的尺寸量。在第二项研究中，进行实验以测量压降，传热系数和最大质量通量的最大热通量为16至76 kg/m^2s。实验的主要发现是比1.0 mm小的间隙大小，因为最大压降高达500 pA，然后压降远低于圆管。但是，压降的波动比管中的波动大得多。热通量和壁过热之间关系中的管与通道之间的传热系数相似，但是核心和局部质量之间的矩形通道中的关系是圆管中不同的形式。用于高度高估的最大热通量和使用矩形通道数据而形成的相关性高度高度预测的相关性，可提供更好的预测。通道的横截面中的液相分布显着影响传热系数和最大热通量。较少的