Resuspension of submicron Particles by Various Disturbances

各种干扰使亚微米颗粒重新悬浮

• 批准号: 02650681
• 负责人: EMI Hitoshi
• 金额: $ 1.47万
• 依托单位: Kanazawa University
• 依托单位国家: 日本
• 项目类别: Grant-in-Aid for General Scientific Research (C)
• 财政年份: 1990
• 资助国家: 日本
• 起止时间: 1990 至 1991
• 项目状态: 已结题
• 来源: https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-02650681/
• 关键词: Fine Particles; Reentrainment; Pulse air jet; Surface cleaning; Resuspension; Wafer; 飛散; ウエハ; 付着粒子; 飛散実験; 気流速度; ダクト壁; ファンデルワ-ルス力; 流体抵抗; 飛散率

Resuspension of submicron particles from a duct wall by air stream was studied to clarify the detachment mechanisms of fine particles from various tubings and surfaces in clean room. Although the resuspension of particles in clean room leads to the contamination of products, the resuspension phenomena of particles by pulse air jet was investigated to develop dry wafer surface cleaning method. The followings are the main conclusions obtained in the present work.(1) Fine particles with diameter less than 1mum would not be resuspended by a steady air stream with velocity of over 100 m/s, but those which deposited at a bump of the wall or the aggregates of these particles could be detached from the surface at a lower airflow velocity.(2) Abrupt change in airflow velocity leads to particle reentrainment.(3) Sequence of pulse air jets is effective for the removal of fine particles from after surface because particle detachment takes place the moment air jet hits the surface.(4) Continual exposure of wafer surface to air jets brings complete removal of particles with diameter of 0.25mum.(5) Fraction of particles reentrained per pulse of air jet does not change in the sequence of the pulse air jets.(6) Particle removal efficiency from wafer surface by pulse air jets mostly depends on the air pressure rise at the collision of air jet on the surface.

研究了气流对管道壁面上亚微米颗粒的再悬浮，以阐明洁净室中微细颗粒从各种管道和表面上的分离机理。虽然粒子在洁净室中的再悬浮会导致产品的污染，但为了发展晶片表面的干式清洗方法，本文研究了脉冲空气射流对粒子的再悬浮现象。以下是本工作中获得的主要结论。(1)粒径小于1 μ m的细颗粒在流速大于100 m/s的稳定气流中不会再悬浮，但在较低流速下，沉积在壁面凸起处的细颗粒或这些颗粒的聚集体可以从表面脱离。(2)气流速度的突然变化导致颗粒的二次夹带。(3)脉冲空气射流的顺序对于从后表面去除细颗粒是有效的，因为颗粒分离发生在空气射流撞击表面的时刻。(4)将晶片表面连续暴露于空气射流中可完全去除直径为0.25 μ m的颗粒。(5)在脉冲空气射流的顺序中，每个脉冲空气射流的再夹带颗粒的分数不改变。(6)脉冲空气射流去除硅片表面颗粒的效率主要取决于射流与硅片表面碰撞时的气压升高。

项目成果

大谷 吉生: "気流による微小粒子の壁からの飛散" エアロゾル研究.

Yoshio Otani：“气流从墙壁上散射微粒”气溶胶研究。

Emi, Hitroshi and Otani, Yoshio: ""Wafer Surface Cleaning by Pulse Air Jet"" Aerosol Science and Technology.

Emi、Hitroshi 和 Otani, Yoshio：““脉冲空气喷射晶片表面清洁””气溶胶科学与技术。

Emi,Hitoshi and Otani,Yoshio: ""Wafer Surface Cleaning by Pulse Air Jet"" Aerosol Science and Technology.

Emi，Hitoshi 和 Otani，Yoshio：““脉冲空气喷射晶圆表面清洁””气溶胶科学与技术。

Emi,Hitoshi and Yoshio Otani: "“Surface Cleaning of Wafer by Pulse Air Jets"" Aerosol Science and Technology.

Emi、Hitoshi 和 Yoshio Otani：““通过脉冲空气喷射对晶圆进行表面清洁””气溶胶科学与技术。