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Development of position sensitive semiconductor photo-detector

Development of position sensitive semiconductor photo-detector
位置敏感半导体光电探测器的研制
批准号:
05554004
负责人:
HABA Junji
金额:
$8.13万
依托单位:
依托单位国家:
日本
项目类别:
Grant-in-Aid for Developmental Scientific Research (B)
财政年份:
1993
资助国家:
日本
项目状态:
已结题
起止时间:
1993 至 1994

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中文摘要
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英文摘要
We have been investigating the possibility of the photon detector which can measure the incident position of photon with an accuracy far better than 1 mm. Since the projected sensitivity of the detector is as low as a single photon level, the established techniques such as CCD are not suitable for the present application. The detector should have some internal amplification mechanism to achieve a better signal to noise ratio unlike a CCD device.In the present study, we have made a effort to develop photo-sensitive semiconductor device with an internal amplification mechanism which would be realized by 1)an avalanche amplification or 2)an built-in transistor formed on the surface of the detector elements.Along the first approach(1), many studies had been made in the past decade to develop an Avalanche Photo Diode (APD). We have tried to make a linear array of the APD with its pitch of 100 um to acquire a position sensitivity. A successful operation was observed with internal gain of 20 in a single cell device and investigation on the multi-cell linear array structure is now in progress.In the second approach(2), we applied a MOS pixel device whose output signal would be amplified by the pMOS transistor formed on the surface of each pixel. Several test structure have been investigated and have observed the amplified signal initiated by photons.Due to the limited resources and time of the present study, we have not yet succeeded to fabricate the sample which satisfies the requirements aimed at first. However, the two approaches examined in the present study was found to be very promising.
期刊论文(6)
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通讯作者:
Y.Saitoh et al.: "Development of Novel Architecture and Assembly Techiniques for a Detector Unit a Silicon Micro-Vertex Detector using the Flip-Chip Bonding Method" IEEE Transactions on Nuclear Science. 40. 552-556 (1993)
Y.Saitoh 等人:“使用倒装芯片接合方法开发硅微顶点探测器探测器单元的新颖架构和组装技术”IEEE 核科学汇刊。
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通讯作者:
S. Avrillon et al.: "Design Considerations for MOS pixel for single-sided two dimensional detector" A353. 243-245 (1994)
S. Avrillon 等人:“单面二维探测器的 MOS 像素的设计注意事项”A353。
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6
    Development of 2-dimensional hard X-ray sensor using a photon sensor with high sensitivity
    Development of new generation photon detectors with an utmost sensitivity
    Development of apthoton sensor with ultra high sensitivity.
    国内基金
    海外基金
    线阵CCD高速摄像一体化控制系统设计
    • 批准号:
    • 项目类别:
      省市级项目
    • 资助金额:
      --
    • 批准年份:
      2026
    • 负责人:
      孙蕾
    • 依托单位:
    全链路多物理场耦合作用下航空面阵CCD相机多自由度高动态像移片上补偿关键技术研究
    单片集成胶体量子点/硅基CCD红外探测面阵研究
    Gaia时代CCD天体测量中若干关键技术研究
    • 批准号:
      --
    • 项目类别:
      青年科学基金项目
    • 资助金额:
      30万元
    • 批准年份:
      2022
    • 负责人:
      林孚荣
    • 依托单位: