Developement of in situ structural analyzes of bonding between different materials

利用压电驱动的试样夹实现了时间分辨高分辨率透射电子显微镜下原子尺度的固体直接键合。在原子尺度上观察了两个金尖端在接近、接触、成键和分离过程中原子排列的结构变化。结果表明，在强电子辐照下，纳米尺度的金针尖在接近几个原子距离的临界距离时自发接触。晶体边界在接触后形成。靠近表面和键合边界的几层负责键合和分离过程。提出了摩擦试验、压缩试验、拉伸试验和剪切试验等新型原子尺度力学试验。

Atomic scale solid state direct bonding in time-resolved high-resolution transmission electron microscopy was realized by using the piezodriven specimen holder. The structural variations of atomic arrangements in approach, contact, bonding and separation processes between two gold tips were observed at atomic scale. It was found that the nanometer-sized gold tips contact spontaneously when the tips approach at the critical distance corresponding to a few atomic distance underi intense electron irradiation. The crystallographic boundary forms after the contact. A few layrs near the surfaces and bonding-boundaries are responsible for the bonding and separation processes. New kinds of atomic scale mechanical tests such as the friction test, the compressing, tensile and shear deformation tests were proposed.