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Atomic scale wear of layred crystal structure material by atomic force microscope

原子力显微镜观察层状晶体结构材料的原子尺度磨损

基本信息

批准号：
07650179
负责人：
MIYAKE Shojiro
金额：
$ 1.28万
依托单位：
Nippon Institute of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
1995
资助国家：
日本
起止时间：
1995 至 1996
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-07650179/
关键词：
Micro tribology Atomic scale wear Scanning Probe Microscope muscovite mica nano lithography

项目摘要

Atomic-scale topographic images and atomic-scale lateral force microscope (LFM) images of muscovite mica were observed simultaneously. Then, the atomic wear phenomenon was evaluated from lateral force and surface atomic topographic changes caused by sliding. Above about 100 nN load, grooves were formed on the damage-free mica surface. Wear about one nm deep in the mica surface corresponds to the depth from the surface of one cleavage plane to the surface of the cleavage plane immediately beneath it. By applying this wear mechanism atomic-scale mechanical processing of layred crystal structure materials such as muscovite mica was performed using an atomic force microscope (AFM). Processing began at a certain critical load, and the processing depth increased discretely with load. Fracture easily occurred at the two cleavage planes of SiO_4-K and K-SiO_4 interfaces. The processing depth dependence on load was evaluated. The depth of the wear grooves increased with load. Processing lateral force estimated from the torsion of the tip beam was divided into plowing force and friction force. The plowing force is proportional to processed depth. Several cycles of mechanical sliding of the tip generated a 1-nm-deep groove by removing potassium from the surfaces which corresponded to the distance from the top surface of SiO_4 to the top surface of the next SiO_4 layr beneath it. A groove with four steps of one-nm depth was processed by stepwise mechanical sliding. Atomic images of each step surface of the groove corresponding to the SiO_4 basal plane were observed. Then the letters NIT (scale 2000X600X1nm) was procesed by mechanical tip sliding.

同时观察白云母的原子尺度形貌图像和原子尺度横向力显微镜（LFM）图像。然后，从侧向力和滑动引起的表面原子形貌变化来评估原子磨损现象。当负载超过约 100 nN 时，在无损伤的云母表面上会形成凹槽。云母表面中大约一纳米深的磨损对应于从一个解理面的表面到紧邻其下方的解理面的表面的深度。通过应用这种磨损机制，使用原子力显微镜（AFM）对层状晶体结构材料（例如白云母）进行原子级机械加工。加工从某个临界负载开始，加工深度随负载离散增加。断裂容易发生在SiO_4-K和K-SiO_4界面的两个解理面处。评价加工深度对负载的依赖性。磨损沟槽的深度随着负载的增加而增加。根据尖端梁的扭转估算的加工侧向力分为犁耕力和摩擦力。犁耕力与加工深度成正比。尖端的几个机械滑动循环通过从表面去除钾而产生1纳米深的凹槽，该凹槽对应于从SiO_4的顶表面到其下面的下一个SiO_4层的顶表面的距离。通过逐步机械滑动加工出具有四级一纳米深度的凹槽。观察了对应于SiO_4基面的凹槽各台阶面的原子像。然后通过机械尖端滑动处理字母NIT（尺度2000X600X1nm）。