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Development of Large Aperture Silicon Detector.

大口径硅探测器的研制。

基本信息

批准号：
09640382
负责人：
HADA Junji
金额：
$ 1.54万
依托单位：
High Energy Accelerator Research Organization
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (C)
财政年份：
1997
资助国家：
日本
起止时间：
1997 至 1998
项目状态：
已结题

来源：
https://kaken.nii.ac.jp/grant/KAKENHI-PROJECT-09640382/
关键词：
silicon microstrip detector wire bonding high energy physics position sensitive detector high precision tracking シリコン広ピッチ大口径

项目摘要

Number of read-out channel is always a very serious problem for a large area silicon detector. A silicon strip detector with a wider pitch read-out is plausible in this sense. In the present study, a silicon microstrip with a read-out pitch larger than 100 micron are considered. The important points to be required are the followings ;1)Charge collection efficiency of strips should be good enough,2)Noise characteristics should be excellent and3)Position resolution might be better than expected from a read-out pitch.From these consideration, we adopted the detector structure of n-type micro strips with p-stop barrier in between them.Since the field investigation we made showed that a processing of a silicon detector on a 8" wafer exclusively is impossible for the scale of the present study, we tried to develop the method in which several silicon detectors (5 cm in length) are bonded together electrically and mechanically in to a large area detector (as long as 20 cm).We succeded in the development of the followingitems :1)The way of bonding two silicon borads precisely with specially made fixtures by epoxy glue. Painting glue is done with a robot specially programmed.2)The way of reinforcing the bonded silicon boards. This was accomplished with two blades of 0.5 mm thick boron on the boards. The blades is again reinfoced by CFRP glued on both sides.3)The way of electrical bonding by wire-bonding. A special fixture wich enables wire bonding on both sides were made.

对于大面积硅探测器来说，读出通道数一直是一个非常重要的问题。在这个意义上，具有更宽间距读出的硅条探测器是合理的。在本研究中，硅微带读出间距大于100微米被认为是。需要注意的要点如下：1）条带的电荷收集效率应该足够好，2）噪声特性应该优异，以及3）位置分辨率可能比从读出间距预期的要好。我们采用了n型微带的探测器结构，由于我们进行的现场调查表明，对于本研究的规模来说，在8 "晶片上专门处理硅探测器是不可能的，我们尝试了将几个硅探测器（长5cm）通过电和机械的方法粘接在一起，形成一个大面积探测器（长20cm）的方法，取得了以下成果：1）用特制的夹具，用环氧胶将两块硅板精确粘接在一起的方法。涂胶是由专门编程的机器人完成的。2）加固粘接硅胶板的方法。这是用两个0.5 mm厚的硼刀片在板上完成的。叶片再次用CFRP双面胶加固。3）引线键合的电键合方式。制作了一种特殊的夹具，可以实现双面引线键合。